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Application filed by Philips Electronics NvfiledCriticalPhilips Electronics Nv
Publication of TW317979UpublicationCriticalpatent/TW317979U/en
Connections Effected By Soldering, Adhesion, Or Permanent Deformation
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Abstract
The invention relates to an electrically conductive wire (1) comprising two spaced solder balls (2) thereon and flux (4) in the space (3) between the solder balls for making a circuit connection between electrically conductive members on opposite surfaces of a substrate. The wire (1) is inserted in a through-hole of the substrate and soldered by a customary soldering process, like wave soldering.