JPS6441183A - Joining method between substrate earth and case body - Google Patents

Joining method between substrate earth and case body

Info

Publication number
JPS6441183A
JPS6441183A JP62196681A JP19668187A JPS6441183A JP S6441183 A JPS6441183 A JP S6441183A JP 62196681 A JP62196681 A JP 62196681A JP 19668187 A JP19668187 A JP 19668187A JP S6441183 A JPS6441183 A JP S6441183A
Authority
JP
Japan
Prior art keywords
substrate
case body
earth
soldering
lower cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62196681A
Other languages
Japanese (ja)
Other versions
JPH0642383B2 (en
Inventor
Mitsuo Inagaki
Masahito Taniguchi
Yasuhide Kuroda
Yoshio Kagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62196681A priority Critical patent/JPH0642383B2/en
Publication of JPS6441183A publication Critical patent/JPS6441183A/en
Publication of JPH0642383B2 publication Critical patent/JPH0642383B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PURPOSE:To make improvements in the jointing work efficiency and connecting reliability of a substrate earth by dividing a case body into a case body frame and a lower cover, mounting a substrate on the case body frame small in heat capacity, and jointing it with mounted parts of the substrate by means of a batch soldering reflow. CONSTITUTION:Plural mounted parts 6 are mounted on both sides a ceramic substrate 2 by means of soldering. Next, in the inner part of a metallic case body 8, a metallic platelike projection 81 is welded to a position to which an earth pattern of the substrate corresponds. Afterward, the frame 8 is mounted on the substrate 2, and it is jointed in block by means of a soldering reflow together with the part 6 in the state that the projection 81 is accorded with the earth pattern of the substrate 2. And, a lower cover 9, where plural metallic projections 91 are formed, is installed by screw in the state that each projection 91 comes into contact with the substrate 2. In addition, a glass-insulated terminal 4 for signal introduction is bonded to the lower cover 9 and the substrate 2 by soldering. With this constitution, jointing work efficiency of a substrate earth is improved and while cost is reduced and, what is more, reliability in the jointing work is thus improved.
JP62196681A 1987-08-05 1987-08-05 Method of joining substrate ground and housing Expired - Lifetime JPH0642383B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62196681A JPH0642383B2 (en) 1987-08-05 1987-08-05 Method of joining substrate ground and housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62196681A JPH0642383B2 (en) 1987-08-05 1987-08-05 Method of joining substrate ground and housing

Publications (2)

Publication Number Publication Date
JPS6441183A true JPS6441183A (en) 1989-02-13
JPH0642383B2 JPH0642383B2 (en) 1994-06-01

Family

ID=16361823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62196681A Expired - Lifetime JPH0642383B2 (en) 1987-08-05 1987-08-05 Method of joining substrate ground and housing

Country Status (1)

Country Link
JP (1) JPH0642383B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106324A (en) * 1990-06-27 1992-04-21 Yazaki Corporation Joint terminal

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006079849A1 (en) * 2005-01-29 2006-08-03 Eads Astrium Limited Improvements to ceramic packages for high frequency circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106324A (en) * 1990-06-27 1992-04-21 Yazaki Corporation Joint terminal

Also Published As

Publication number Publication date
JPH0642383B2 (en) 1994-06-01

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