GB2308015A - Soldering surface-mounted and lead-in-hole components - Google Patents

Soldering surface-mounted and lead-in-hole components Download PDF

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Publication number
GB2308015A
GB2308015A GB9625027A GB9625027A GB2308015A GB 2308015 A GB2308015 A GB 2308015A GB 9625027 A GB9625027 A GB 9625027A GB 9625027 A GB9625027 A GB 9625027A GB 2308015 A GB2308015 A GB 2308015A
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
solder
contact
contact bank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9625027A
Other versions
GB9625027D0 (en
Inventor
Willy Bentz
Dieter Hussmann
Rainer Selig
Walter Wagenbrenner
Reinhard Kink
Werner Butschkau
Thomas Jessberger
Martin Schaele
Dieter Karr
Eberhard Rieger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB9625027D0 publication Critical patent/GB9625027D0/en
Publication of GB2308015A publication Critical patent/GB2308015A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/027—Soldered or welded connections comprising means for positioning or holding the parts to be soldered or welded
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/042—Remote solder depot on the PCB, the solder flowing to the connections from this depot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Power Steering Mechanism (AREA)
  • Surgical Instruments (AREA)
  • Dry Shavers And Clippers (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)

Description

DESCRIPTION ELECTRICAL DEVICE The invention relates to an electrical device according to the generic type of claim 1. DE 33 10 477 Al discloses a generic type electrical device. This device comprises a printed circuit board fitted with electrical components and a contact bank on which are mounted the contact elements. The printed circuit board comprises bores through which from a front side of the printed circuit board the terminal wires of the components and the terminal portions of the contact elements are guided and are soldered using a wave soldering device on the rear side of the printed circuit board provided with conductor tracks, in that the rear side of the printed circuit board is drawn over a soldering bath disposed in a strip-like manner and thus comes into contact with liquid solder.
Thus in a disadvantageous way it is not possible to fit the rear side of the printed circuit board with components so that in the case of predetermined outer dimensions of the device it is not possible to expand the function thereof in a way which requires an increase in electrical components and contact elements of the contact banks.
In addition the described methods of fitting components to the printed circuit board and therefore the production costs of the device are cost intensive.
Advantages of the invention In contrast thereto the electrical device in accordance with the invention comprising the characterising features of claim 1 has the advantage that the aforementioned inadequacies are avoided to a satisfactory degree. The printed circuit board is formed for SMD technology for the purpose of attaching surface-mountable components.
This renders it possible to mount these components on both sides of the printed circuit board, wherein for the purpose of preliminary fixing the components are adhered to terminals of the printed circuit board provided with solder and then are soldered by application of heat only.
Since no bores and no threading through of terminal wires are required, the manufacturing costs are reduced as a result of shorter assembly times for the printed circuit board than in the prior art.
The terminal portions of the contact elements of the contact bank, which are also guided through bores of the printed circuit board for reasons of stabiiity, are surrounded by terminals of the printed circuit board which comprise in each case a solder deposit on additional deposit surfaces so that these terminal portions of the contact elements are soldered in the same soldering process as the components and are thus supplied with solder from the solder deposit. This saves a separate soldering process for the terminal elements of the contact bank and contributes to cost effective production of the electrical device.
By means of the features set out in the sub claims advantageous developments of the electrical device stated in claim 1 are possible.
Drawing An exemplified embodiment of the invention is illustrated in the drawing and explained in detail in the description hereinunder.
Figure 1 shows a partial sectional view of the printed circuit board having electrical components and a terminal element of the contact bank and Figure 2 also shows a partial sectional view of the printed circuit board and contact bank having centring means and a holding element.
Description of the exemplified embodiment An electrical device 11, in particular a switch and control device for a motor vehicle, comprises as essential components according to Figure 1 a printed circuit board 12, which is fitted with electrical components 13, and a contact bank 14, by way of which the device 11 can be connected to other components of the motor vehicle.
The printed circuit board 12 is formed for SMD technology.
To this end thick layers of solder 21 are applied in the form of a paste and in an adhesive manner on to a basic body 16, which consists of an electric insulating material, in the screen-printing process as planar terminals 17 on a front side 18 and a rear side 19 of the basic body 16.
Electrical components 22, comprising tin-plated contact surfaces 23 formed thereon for the purpose of preliminary fixing, are adhered to the terminals 17.
Furthermore, the printed circuit board 12 comprises bores 24 which are disposed in series and connect the front side 18 to the rear side 19. The wall of each one of the bores 24 is lined with thin layers of solder 21. On the rear side 19 of the basic body 16 the bores 24 issue into terminals 17, which in each case are enlarged by a deposit surface 26 for a solder deposit 27.
The contact bank 14 consists of an insulating material body 28, in which a plurality of contact elements 29 are embedded in a sealed manner. The contact elements 29 which are disposed in series comprise in each case a contact portion [not illustrated in further detail] and an angled terminal portion 31. During the assembly of the contact bank 14 on the printed circuit board 12 the angled end piece of the terminal portion 31 is guided through the associated bore 24 and protrudes with its free end 32 into the terminal 17 which is enlarged by the deposit surface 26.
As shown in Figure 2, centring means 34 in the form of spigots protrude at a base 33 of the contact bank 14 which is facing the printed circuit board 12 which centring means engage into associated recesses 36 and form a clamp pressing fit when the contact bank 14 is placed in the correct position on to the front side 18 of the basic body 16 of the printed circuit board 12. Thereby the contact bank 14 is fixed in a preliminary manner on the printed circuit board 12. In this position holding elements 37, which can be soldered, which consist of metal elbows and which on the one end can be anchored in the insulating body 28 and on the other end protrude tin-plated laterally out of the contact bank 14, flush with the base 33, move into position at the terminals 17.
The printed circuit board 12 assembled in this manner is subjected, with the rear side 14 directed upwards, to heat treatment, which melts the solder 21, in a reflow oven which is equipped with a red light lamp, so that soldered connections of the terminals 17 are produced with the contact surfaces 23 of the components 22 and with the holding elements 37 of the contact bank 14. Simultaneously liquefaction of the solder deposits 27 occurs whose solder 21 flows to the free ends 32 of the terminal portions 31 and into the bores 24, to form soldered connections between the respective terminal 17 and the associated terminal portion 31 of the contact elements 29. The contact bank 14 is secured in a particularly stable manner on the printed circuit board 12 by virtue of the anchoring of the substances themselves of the terminal portions 31 of the contact elements 29 in the bores 24 and by virtue of additionally fixing the insulating material body 28 to terminals 17 of the printed circuit board 12 by way of the holding elements 37.
In this manner an electrical device 11 is produced which comprises high packing density for a large scope of function by virtue of a printed circuit board 12 which is fitted on both sides with components 13. In a manner which is favourable to manufacturing engineering the components 13 are attached in SMD technology and although the contact bank 14, whose contact elements 29 for reasons of stability are still guided according to conventional technology through bores 24 of the printed circuit board 12, only a single soldering process, which is tailored to suit SMD technology, is required in the production of the printed circuit board. [sic]

Claims (4)

1. Electrical device, in particular a switch and control device for motor vehicles, in which at least one printed circuit board, which is fitted with electrical components, and at least one contact bank are contained, which contact bank comprises contact elements having in each case a terminal portion, which terminal portions can be passed through bores, which in each case connect a front side to a rear side of the printed circuit board, and can be soldered on the rear side to terminals of the printed circuit board, characterised in that the printed circuit board is formed for SMD technology for the purpose of attaching surface mounted components and comprises on the front side and the rear side as terminals terminal fields which are provided with solder and on which terminals on the one hand the components are adhered to contact surfaces and which terminals, whilst surrounding the bores on the rear side, on the other hand are enlarged here in each case by virtue of an additional deposit surface for a solder deposit, and in the event of heat treatment, which melts the solder, on the one hand solder the contact surfaces of the components to the terminals lying opposite and on the other hand the solder flows from the solder deposit into the associated bore, connects with the substance itself the respective terminal portion to the associated terminal by virtue of a soldered connection, and fixes the contact bank on the printed circuit board.
2. Electrical device according to claim 1, characterised in that centring means are provided on the contact bank and, when the contact bank is placed in the correct position on to the front side of the printed circuit board, engage into associated recesses of the printed circuit board with a clamp pressing fit for the purpose of preliminary fixing the contact bank on the printed circuit board.
3. Electrical device according to claim 2, characterised in that holding elements, which can be soldered, are attached to the contact bank and said holding elements in the case of a contact bank which is fixed in a preliminary manner on the printed circuit board lie on terminals of the printed circuit board and subsequent to heat treatment which melts the solder fix the contact bank on the printed circuit board.
4. An electrical device substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings.
GB9625027A 1995-12-06 1996-12-02 Soldering surface-mounted and lead-in-hole components Withdrawn GB2308015A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29519294U DE29519294U1 (en) 1995-12-06 1995-12-06 Electric device

Publications (2)

Publication Number Publication Date
GB9625027D0 GB9625027D0 (en) 1997-01-15
GB2308015A true GB2308015A (en) 1997-06-11

Family

ID=8016321

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9625027A Withdrawn GB2308015A (en) 1995-12-06 1996-12-02 Soldering surface-mounted and lead-in-hole components

Country Status (4)

Country Link
DE (1) DE29519294U1 (en)
FR (1) FR2742295B3 (en)
GB (1) GB2308015A (en)
IT (1) IT241029Y1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099324A (en) * 1997-07-21 2000-08-08 The Whitaker Corporation Electrical motor unit having a control module
EP1342292A1 (en) * 2000-12-15 2003-09-10 DI/DT, Inc. Circuit module with universal connectivity
WO2003079743A2 (en) * 2002-03-15 2003-09-25 Endress + Hauser Gmbh + Co. Kg Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
EP1864143A2 (en) * 2005-03-15 2007-12-12 Medconx, Inc. Mini wave soldering system and method for soldering wires and pin configurations
EP1866961A2 (en) * 2005-03-15 2007-12-19 Medconx, Inc. Micro solder pot

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19822811C1 (en) * 1998-05-20 2000-03-09 Amphenol Tuchel Elect Contact carrier for circuit board device has insulating body provided with projecting contacts for connection to circuit board contact sections and solder contacts for attachment to circuit board
DE10201209B4 (en) * 2002-01-14 2005-12-01 Endress + Hauser Gmbh + Co. Kg Lotformteil and method for equipping the same
DE102005043279B4 (en) * 2005-09-09 2009-03-26 Endress + Hauser Gmbh + Co. Kg Printed circuit board and method for soldering SMD components in a reflow soldering oven and subsequent selective soldering of at least one leaded component
DE102008035405B4 (en) * 2008-07-29 2016-09-01 Endress + Hauser Gmbh + Co. Kg Method for producing a printed circuit board and production line for carrying out the same
DE102009002288A1 (en) * 2009-04-08 2010-10-14 Endress + Hauser Gmbh + Co. Kg Method for fixing through hole technology component on side of printed circuit board, involves applying molded part made from hot glue on adhesive area provided on printed circuit board for fixing through hole technology components
DE102012218847A1 (en) * 2012-10-16 2014-04-17 Robert Bosch Gmbh Connection element for a drive arrangement and a drive arrangement with a connection part
CN108747010B (en) * 2018-06-21 2023-11-03 深圳光韵达光电科技股份有限公司 SMT ladder template and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4515304A (en) * 1982-09-27 1985-05-07 Northern Telecom Limited Mounting of electronic components on printed circuit boards
EP0233742A2 (en) * 1986-02-11 1987-08-26 E.I. Du Pont De Nemours And Company Electrical connectors
US5070604A (en) * 1989-12-28 1991-12-10 Sony Corporation Method for soldering two kinds of parts on one-side printed board
US5096440A (en) * 1991-05-10 1992-03-17 Kel Corporation Surface mount connector with circuit board retaining plate
US5373984A (en) * 1993-09-27 1994-12-20 Sundstrand Corporation Reflow process for mixed technology on a printed wiring board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4515304A (en) * 1982-09-27 1985-05-07 Northern Telecom Limited Mounting of electronic components on printed circuit boards
EP0233742A2 (en) * 1986-02-11 1987-08-26 E.I. Du Pont De Nemours And Company Electrical connectors
US5070604A (en) * 1989-12-28 1991-12-10 Sony Corporation Method for soldering two kinds of parts on one-side printed board
US5096440A (en) * 1991-05-10 1992-03-17 Kel Corporation Surface mount connector with circuit board retaining plate
US5373984A (en) * 1993-09-27 1994-12-20 Sundstrand Corporation Reflow process for mixed technology on a printed wiring board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099324A (en) * 1997-07-21 2000-08-08 The Whitaker Corporation Electrical motor unit having a control module
EP1342292A1 (en) * 2000-12-15 2003-09-10 DI/DT, Inc. Circuit module with universal connectivity
EP1342292A4 (en) * 2000-12-15 2006-03-08 Dt Inc Di Circuit module with universal connectivity
WO2003079743A2 (en) * 2002-03-15 2003-09-25 Endress + Hauser Gmbh + Co. Kg Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
WO2003079743A3 (en) * 2002-03-15 2003-12-24 Endress & Hauser Gmbh & Co Kg Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
EP1864143A2 (en) * 2005-03-15 2007-12-12 Medconx, Inc. Mini wave soldering system and method for soldering wires and pin configurations
EP1866961A2 (en) * 2005-03-15 2007-12-19 Medconx, Inc. Micro solder pot
EP1864143A4 (en) * 2005-03-15 2009-11-25 Medconx Inc Mini wave soldering system and method for soldering wires and pin configurations
EP1866961A4 (en) * 2005-03-15 2012-01-25 Medconx Inc Micro solder pot

Also Published As

Publication number Publication date
FR2742295B3 (en) 1997-11-28
IT241029Y1 (en) 2001-04-20
GB9625027D0 (en) 1997-01-15
DE29519294U1 (en) 1997-04-03
ITMI960773V0 (en) 1996-11-26
ITMI960773U1 (en) 1998-05-26
FR2742295A3 (en) 1997-06-13

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