SU436714A1 - Solder for low-temperature soldering - Google Patents
Solder for low-temperature solderingInfo
- Publication number
- SU436714A1 SU436714A1 SU1869179A SU1869179A SU436714A1 SU 436714 A1 SU436714 A1 SU 436714A1 SU 1869179 A SU1869179 A SU 1869179A SU 1869179 A SU1869179 A SU 1869179A SU 436714 A1 SU436714 A1 SU 436714A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- low
- temperature soldering
- tin
- phosphorus
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
1one
Изобретение относитс к процессам пайки, в частности к составу припо дл низкотемпературной пайки.This invention relates to soldering processes, in particular to solder compositions for low-temperature soldering.
Известен припой, содержащий серебро, олово , индий и свинец.Known solder containing silver, tin, indium and lead.
Дл повышени коррозионной стойкости па ного соединени в различных климатических услови х, в его состав введен фосфор в количестве 0,2-1%, а остальные компоненты св заны в следующем соотнощении, %:To increase the corrosion resistance of the solder compound in different climatic conditions, phosphorus in the amount of 0.2–1% is added to its composition, and the remaining components are related in the following ratio,%:
3-6 0,5-5,5 1,0-10,5 Основа.3-6 0.5-5.5 1.0-10.5 Basis.
Температура плавлени припо 295-305°С.Melting point solder is 295-305 ° C.
Па ные соединени , выполненные предлагаемым припоем, не требуют защиты лакокрасочными покрыти ми при работе в различных климатических услови х в интервале темперамур от минус 70 до плюс 270°С. Коррозионна стойкость этого припо достигаетс заThe solder joints made by the proposed solder do not require protection with paint coatings when operating in different climatic conditions in the temperature range from minus 70 to plus 270 ° C. The corrosion resistance of this solder is achieved in
счет легировани его фосфором и индием. Олово вводитс , как св зующее фосфор. Предложенный припой более технологичен. Лучще смачивает па емые металлы и требует менее активных флюсов.an alloying account of phosphorus and indium. Tin is introduced as a binding phosphorus. The proposed solder is more technological. Wets the melted metals better and requires less active fluxes.
Предмет изобретени Subject invention
Припой дл низкотемпературной пайки, содержащий серебро, олово, индий, свинец, отличающийс тем, что, с целью повыщени коррозионной стойкости па ного соединени в различных климатических услови х, в его состав введен фосфор в количестве 0,2- 1%, а остальные компоненты вз ты в следующем соотнощении, %:Solder for low-temperature soldering, containing silver, tin, indium, lead, characterized in that, in order to increase the corrosion resistance of the soldered compound in various climatic conditions, phosphorus in the amount of 0.2-1% is added to its composition, and the remaining components taken in the following ratio,%:
Олово3-6Tin 3-6
Серебро0,5-5,5Silver 0.5-5.5
Индий1,0-10,5Indium1.0-10.5
СвинецОснова.LeadBase.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1869179A SU436714A1 (en) | 1973-01-08 | 1973-01-08 | Solder for low-temperature soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1869179A SU436714A1 (en) | 1973-01-08 | 1973-01-08 | Solder for low-temperature soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU436714A1 true SU436714A1 (en) | 1974-07-25 |
Family
ID=20538451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU1869179A SU436714A1 (en) | 1973-01-08 | 1973-01-08 | Solder for low-temperature soldering |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU436714A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108620764A (en) * | 2017-03-24 | 2018-10-09 | 苏州昭舜物联科技有限公司 | Low temperature solder connects with soldering paste and preparation method |
-
1973
- 1973-01-08 SU SU1869179A patent/SU436714A1/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108620764A (en) * | 2017-03-24 | 2018-10-09 | 苏州昭舜物联科技有限公司 | Low temperature solder connects with soldering paste and preparation method |
| CN108620764B (en) * | 2017-03-24 | 2022-03-08 | 苏州昭舜物联科技有限公司 | Soldering paste for low-temperature soldering and preparation method thereof |
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