SU241950A1 - N.V. Kurguzov, I.K. Sklre and A.I. Golubev - Google Patents
N.V. Kurguzov, I.K. Sklre and A.I. GolubevInfo
- Publication number
- SU241950A1 SU241950A1 SU1217109A SU1217109A SU241950A1 SU 241950 A1 SU241950 A1 SU 241950A1 SU 1217109 A SU1217109 A SU 1217109A SU 1217109 A SU1217109 A SU 1217109A SU 241950 A1 SU241950 A1 SU 241950A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- sklre
- kurguzov
- golubev
- solder
- tin
- Prior art date
Links
Landscapes
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Description
Известен припой дл м гкой пайки алюмини , содержащий цинк 10%, олово 90%.Known solder for soft soldering of aluminum, containing zinc 10%, tin 90%.
Цель изобретени - повысить коррозионную стойкость иа ных соединений в услови х повышенной влажности.The purpose of the invention is to increase the corrosion resistance of other compounds under conditions of high humidity.
Это достигаетс тем, что в состав припо введен германий в количестве 0,5-1%,а остальные компоненты вз ты в следующем соотношении , %: цинк 8-10, олово остальное. Температура плавлени припо 200°С.This is achieved by the fact that germanium in the amount of 0.5–1% is introduced into the composition of the solder, and the remaining components are taken in the following ratio,%: zinc 8–10, tin else. Melting point solder 200 ° C.
Исследовани и климатические полугодовые испытани в камере ТВК-2А (относительна влажность 98%, темиература 40°С) показали, что коррозионна стойкость па ных соединении по сравнению с известным припоем возросла на 60%.The studies and climatic semiannual tests in the TKK-2A chamber (relative humidity 98%, temperature 40 ° С) showed that the corrosion resistance of the solder joints increased by 60% compared with the known solder.
Добавление до 1 % германи не вызывает заметного повышени темиературы пайки и не снижает пластичность соединений.Adding up to 1% of germanium does not cause a noticeable increase in the temperature of soldering and does not reduce the ductility of the joints.
Предмет изобретени Subject invention
Припой дл м гкой пайки алюмини , содержащий цинк, олово, отличающийс тем, что,Solder for soft soldering of aluminum, containing zinc, tin, characterized in that
с целью повышени коррозионной стойкости па ных соединений в услови х повышенно влажност, в его состав введен герман Й в кол честве 0,5-1%. а остальные компоненты вз ты в следу ощем соотношении, %: In order to increase the corrosion resistance of soldered compounds under conditions of high humidity, germanium in the amount of 0.5–1% is introduced into its composition. and the remaining components are taken in the wake of the total ratio,%:
8-10, олово остальное.8-10, tin the rest.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1217109A SU241950A1 (en) | 1968-02-09 | 1968-02-09 | N.V. Kurguzov, I.K. Sklre and A.I. Golubev |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1217109A SU241950A1 (en) | 1968-02-09 | 1968-02-09 | N.V. Kurguzov, I.K. Sklre and A.I. Golubev |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU241950A1 true SU241950A1 (en) | 1969-04-18 |
Family
ID=39992400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU1217109A SU241950A1 (en) | 1968-02-09 | 1968-02-09 | N.V. Kurguzov, I.K. Sklre and A.I. Golubev |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU241950A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0538446A1 (en) * | 1991-04-08 | 1993-04-28 | Us Energy | Solder for oxide layer-building metals and alloys. |
| RU2617309C2 (en) * | 2013-01-22 | 2017-04-24 | Цзюйшен МА | Lead-free solder |
-
1968
- 1968-02-09 SU SU1217109A patent/SU241950A1/en active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0538446A1 (en) * | 1991-04-08 | 1993-04-28 | Us Energy | Solder for oxide layer-building metals and alloys. |
| EP0538446A4 (en) * | 1991-04-08 | 1993-08-25 | United States Department Of Energy | Solder for oxide layer-building metals and alloys |
| RU2617309C2 (en) * | 2013-01-22 | 2017-04-24 | Цзюйшен МА | Lead-free solder |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SU241950A1 (en) | N.V. Kurguzov, I.K. Sklre and A.I. Golubev | |
| SU532324A3 (en) | Solder for soldering aluminum | |
| SU194528A1 (en) | Solder for soldering thermoelements | |
| SU640831A1 (en) | Solder | |
| SU553073A1 (en) | Solder for soldering molybdenum and its alloys | |
| SU217185A1 (en) | ||
| SU241949A1 (en) | LOW-TEMPERATURE WRAPPING BAND | |
| SU190180A1 (en) | ||
| SU420423A1 (en) | FLUSHING FOR THE SOLDERING OF SOILS | |
| SU194527A1 (en) | TITAIA PIKES | |
| SU219368A1 (en) | ||
| GB927380A (en) | Improvements in or relating to solders | |
| SU368955A1 (en) | SUGLYUZNAYA PL: NTTS - ,, .. K1; YY; | |
| SU406671A1 (en) | ALUMINUM SOLDER SOLUTION | |
| SU416201A1 (en) | ||
| SU118690A1 (en) | Heat resistant solder | |
| SU404589A1 (en) | ||
| SU133739A1 (en) | Solder for soldering thermoelements based on tellurides and bismuth and antimony selenides | |
| SU471981A1 (en) | Solder flux | |
| SU538865A2 (en) | Solder for brazing nickel-chrome steels | |
| SU170268A1 (en) | Solder for soldering | |
| SU400541A1 (en) | GLASS | |
| SU477955A1 (en) | Composition for soldering glasses | |
| SU147896A1 (en) | Solder for soldering molybdenum with steel | |
| US2044671A (en) | Solder for aluminum |