SU219368A1 - - Google Patents
Info
- Publication number
- SU219368A1 SU219368A1 SU1090363A SU1090363A SU219368A1 SU 219368 A1 SU219368 A1 SU 219368A1 SU 1090363 A SU1090363 A SU 1090363A SU 1090363 A SU1090363 A SU 1090363A SU 219368 A1 SU219368 A1 SU 219368A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- copper
- solder
- strength
- manganese
- nickel
- Prior art date
Links
Landscapes
- Conductive Materials (AREA)
Description
Известен припой дл пайки меди и ее сплавов следующего состава (в о/о): фосфор 4-5, олоБО 10-15, никель до 1, марганец до 0,5, медь - остальное.The solder is known for soldering copper and its alloys of the following composition (in o / o): phosphorus 4-5, olOBO 10-15, nickel up to 1, manganese up to 0.5, copper - the rest.
Дл повышени прочности и пластичности припо и па ного соединени предлагаетс в состав припо дополнительно вводить алюминий В количестве 0,2-1а/о и кремний 0,1 - l-/o, ъ. остальные компоненты брать в следующем прощентнол соотношении; олово 1,5-8, никель 0,1 - 1, марганец 0,2-1, фосфор не более 6, медь - остальное.In order to increase the strength and ductility of the solder and the joints, it is proposed to additionally introduce aluminum into the solder composition. In an amount of 0.2-1a / o and silicon 0.1 - l / o, b. take the remaining components in the following ratio; tin 1.5-8, nickel 0.1 - 1, manganese 0.2-1, phosphorus not more than 6, copper - the rest.
Прочность соединений медь+медь, па ных предложенным -припоем, выще прочиости основного материала, г. прочность соединений медь-)-сталь составл ет 16-18 KZJMM.The strength of the copper + copper joints, paired by the proposed solder, is higher than the strength of the base material; the strength of the copper -) - steel joints is 16-18 KZJMM.
Испытани соединений медь + медь и медь+сталь, па ных предлагаемым припоем , в камере тепла и влаги показали высокую их коррозионную стойкость.Testing of copper + copper and copper + steel compounds, paired with the proposed solder, in the chamber of heat and moisture showed their high corrosion resistance.
Предмет изобретени Subject invention
Припой дл пайки меди, содержащий фосфор , олово, никель, марганец, медь, отличающийс тем, что, с целью П01вышени прочно ,сти и пластичности .црипо и па ного соединени , в его состав «ведены алюминий в количестве от 0,2 до 1о/о и кремний от 0,1 до 1«/о, Si остальные компоненты вз ты в следующем процентном соотнощении: олово от 1,5 до 8,Solder for copper soldering, containing phosphorus, tin, nickel, manganese, copper, characterized in that, in order to improve the strength, stiffness and ductility of the rim and the solder, aluminum in the amount of 0.2 to 1 ° / o and silicon from 0.1 to 1 "/ o, Si; the remaining components are taken in the following percentage ratio: tin from 1.5 to 8,
никель от 0,1 до 1, марганец от 0,2 до 1, фосфор не более 6, медь - остальное.Nickel from 0.1 to 1, manganese from 0.2 to 1, phosphorus not more than 6, copper - the rest.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1090363A SU219368A1 (en) | 1966-07-16 | 1966-07-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1090363A SU219368A1 (en) | 1966-07-16 | 1966-07-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
SU219368A1 true SU219368A1 (en) | 1968-05-30 |
Family
ID=39968274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU1090363A SU219368A1 (en) | 1966-07-16 | 1966-07-16 |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU219368A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999013117A1 (en) * | 1997-09-05 | 1999-03-18 | The Miller Company | Copper based alloy featuring precipitation hardening and solid-solution hardening |
-
1966
- 1966-07-16 SU SU1090363A patent/SU219368A1/ru active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999013117A1 (en) * | 1997-09-05 | 1999-03-18 | The Miller Company | Copper based alloy featuring precipitation hardening and solid-solution hardening |
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