SU241949A1 - LOW-TEMPERATURE WRAPPING BAND - Google Patents
LOW-TEMPERATURE WRAPPING BANDInfo
- Publication number
- SU241949A1 SU241949A1 SU1207964A SU1207964A SU241949A1 SU 241949 A1 SU241949 A1 SU 241949A1 SU 1207964 A SU1207964 A SU 1207964A SU 1207964 A SU1207964 A SU 1207964A SU 241949 A1 SU241949 A1 SU 241949A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- low
- solder
- temperature
- wrapping band
- temperature wrapping
- Prior art date
Links
Description
Известен припой дл низкотемпературной бесфлюсовой пайки разнородных материалов, содержащий, %: медь 50, олово 15, галлий 32.Known solder for low-temperature flux-free soldering of dissimilar materials, containing,%: copper 50, tin 15, gallium 32.
Предложено дл повышени стойкости па ного соединени при резких переменах температуры в состав припо вводить серебро в количестве 0,5-5%, а остальные компоненты брать в следующем соотношении, %: медь 50-54, галлий 29,5-32, олово 13-16.It was proposed to increase the durability of the solder compound in case of sudden temperature changes in the composition of solder to introduce silver in the amount of 0.5-5%, and take the remaining components in the following ratio,%: copper 50-54, gallium 29.5-32, tin 13- sixteen.
Предложенный припой предназначен дл соединени кварца с медью и другими разнородными материалами.The proposed solder is intended to combine quartz with copper and other dissimilar materials.
Дл осуществлени процесса пайки пасту помещают между соедин емыми поверхност ми и оставл ют до затвердевани . Затвердевание припо происходит при комнатной температуре в течение 80 час. Повышение температуры приводит к ускорению затвердевани . При 130°С припой затвердевает в течение 2 час.In order to carry out the soldering process, the paste is placed between the surfaces to be joined and left to solidify. Solder hardening occurs at room temperature for 80 hours. An increase in temperature leads to an acceleration of solidification. At 130 ° C, the solder hardens for 2 hours.
После затвердевани припой обладает следующими свойствами, After curing, the solder has the following properties:
прочность на разрыв3tensile strength3
прочность на срез2,7cut resistance2.7
прочность на сжатие6,3compressive strength6,3
твердость по Виккерсу36.Vickers Hardness36.
После затвердевани припо па ное соединение гзыдерживает без разрушени работу при 400С, а также 10-кратное термоциклировапие от 60°С до 125С. Температура распа соединени выше 800°С.After hardening, the solder joint will keep working at 400 ° C without destruction, as well as 10-fold thermal cycling from 60 ° C to 125 ° C. The temperature of the decomposition of the compound is above 800 ° C.
Предмет изобретени Subject invention
Припой дл низкотемпературной бесфлюсовой пайки разнородных материалов, содержащий медь, галлий, олово, отличающийс тем, что, с целью повыщени стойкости па ного соединени при резких переменах температуры , в его состав введено серебро в количестве 0,5-5%, а остальные компоненты вз ты в следующем соотношении, %: медь 50-54, галлий 29,5-32, олово 13-16.Solder for low-temperature flux-free soldering of dissimilar materials containing copper, gallium, tin, characterized in that, in order to increase the resistance of the solder joint during sudden temperature changes, silver in the amount of 0.5–5% was added to its composition, and the remaining components you are in the following ratio,%: copper 50-54, gallium 29.5-32, tin 13-16.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1207964A SU241949A1 (en) | 1968-01-02 | 1968-01-02 | LOW-TEMPERATURE WRAPPING BAND |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1207964A SU241949A1 (en) | 1968-01-02 | 1968-01-02 | LOW-TEMPERATURE WRAPPING BAND |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU241949A1 true SU241949A1 (en) | 1969-04-18 |
Family
ID=39992235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU1207964A SU241949A1 (en) | 1968-01-02 | 1968-01-02 | LOW-TEMPERATURE WRAPPING BAND |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU241949A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996014957A1 (en) * | 1994-11-15 | 1996-05-23 | Tosoh Smd, Inc. | Backing plate reuse in sputter target/backing |
| US5593082A (en) * | 1994-11-15 | 1997-01-14 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby |
| US5653856A (en) * | 1994-11-15 | 1997-08-05 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using gallium based solder pastes and target/backing plate assemblies bonded thereby |
| RU2498889C1 (en) * | 2012-08-10 | 2013-11-20 | Открытое акционерное общество "Авангард" | Flux-free solder |
-
1968
- 1968-01-02 SU SU1207964A patent/SU241949A1/en active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996014957A1 (en) * | 1994-11-15 | 1996-05-23 | Tosoh Smd, Inc. | Backing plate reuse in sputter target/backing |
| US5522535A (en) * | 1994-11-15 | 1996-06-04 | Tosoh Smd, Inc. | Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies |
| US5593082A (en) * | 1994-11-15 | 1997-01-14 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby |
| US5653856A (en) * | 1994-11-15 | 1997-08-05 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using gallium based solder pastes and target/backing plate assemblies bonded thereby |
| RU2498889C1 (en) * | 2012-08-10 | 2013-11-20 | Открытое акционерное общество "Авангард" | Flux-free solder |
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