SU134114A1 - Solderless Flux Free Brazing - Google Patents
Solderless Flux Free BrazingInfo
- Publication number
- SU134114A1 SU134114A1 SU653919A SU653919A SU134114A1 SU 134114 A1 SU134114 A1 SU 134114A1 SU 653919 A SU653919 A SU 653919A SU 653919 A SU653919 A SU 653919A SU 134114 A1 SU134114 A1 SU 134114A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- free brazing
- flux free
- solderless
- copper
- solderless flux
- Prior art date
Links
Description
Припой на серебр ной основе, в состав которого вход т медь, сурьма и фосфор в разных сочетани х, не дает качественного спа меди, пригодного дл работы в услови х, когда место спа нагреваетс до 400°.Solder on a silver base, which contains copper, antimony and phosphorus in various combinations, does not provide a high-quality copper spa suitable for working in conditions where the spa site is heated to 400 °.
В состав предлагаемого нрипо входит 18-23% меди, 16-18% сурьмы , 2-5% фосфора и остальное серебро. Этот припой пригоден дл работы при нагреве мест спа из меди до 400°. Кроме того, предлагаемый припой может примен тьс дл бесфлюсовой пайки медных токопровод идих силовых изделий в электромеханической промышленности, которые при эксплуатации нагреваютс до 400°.The composition of the proposed nripo includes 18-23% copper, 16-18% antimony, 2-5% phosphorus and the rest silver. This solder is suitable for use when heating copper seats up to 400 °. In addition, the proposed solder can be used for flux-free soldering of copper conductors or of power products in the electromechanical industry, which, during operation, are heated to 400 °.
Припой может быть изготовлен в виде ирутков, обладает хорошими па льными свойствами и легко обрабатываетс .The solder can be manufactured in the form of irut, has good firing properties and is easily processed.
Предмет изобретени Subject invention
Припой дл бесфлюсовой пайки меди, состо идий из меди, сурьмьь фосфора и серебра, отличающийс тем, что, с целью получени припо высокой жидкотекучести, пригодного дл работы при температуре 400°, в его состав входит 18-23% меди, 16-18% сурьмы, 2-5% фосфора и остальное серебро.Solder for flux-free soldering of copper, states of copper, antimony, phosphorus and silver, characterized in that, in order to obtain a high flowability solder, suitable for operation at a temperature of 400 °, its composition includes 18-23% copper, 16-18% antimony, 2-5% phosphorus and the rest silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU653919A SU134114A1 (en) | 1960-02-09 | 1960-02-09 | Solderless Flux Free Brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU653919A SU134114A1 (en) | 1960-02-09 | 1960-02-09 | Solderless Flux Free Brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU134114A1 true SU134114A1 (en) | 1960-11-30 |
Family
ID=48405095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU653919A SU134114A1 (en) | 1960-02-09 | 1960-02-09 | Solderless Flux Free Brazing |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU134114A1 (en) |
-
1960
- 1960-02-09 SU SU653919A patent/SU134114A1/en active
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