SU194528A1 - Solder for soldering thermoelements - Google Patents

Solder for soldering thermoelements

Info

Publication number
SU194528A1
SU194528A1 SU1047806A SU1047806A SU194528A1 SU 194528 A1 SU194528 A1 SU 194528A1 SU 1047806 A SU1047806 A SU 1047806A SU 1047806 A SU1047806 A SU 1047806A SU 194528 A1 SU194528 A1 SU 194528A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solder
thermoelements
soldering
bismuth
rest
Prior art date
Application number
SU1047806A
Other languages
Russian (ru)
Original Assignee
Ю. Ф. Буткин, Н. А. Костромин, А. П. Садиков , А. Г. Щербина
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ю. Ф. Буткин, Н. А. Костромин, А. П. Садиков , А. Г. Щербина filed Critical Ю. Ф. Буткин, Н. А. Костромин, А. П. Садиков , А. Г. Щербина
Priority to SU1047806A priority Critical patent/SU194528A1/en
Application granted granted Critical
Publication of SU194528A1 publication Critical patent/SU194528A1/en

Links

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Description

Известен припой дл  пайки термоэлементов, состо щий из олова 10-30% и висмута - остальное.A solder for soldering thermoelements is known, consisting of tin 10-30% and bismuth - the rest.

С целью уменьшени  интервала кристаллизации припо , и повышени  качества па ного соединени  в состав припо  вместо олова введена сурьма В количестве 4+0,2%, висмут - остальное.In order to reduce the crystallization interval of solder, and to improve the quality of the paired compound, antimony was added to the solder instead of tin. In an amount of 4 + 0.2%, bismuth is the rest.

Припой предложенного состава позвол ет при пайке термоэлементов снизить толщину залудки и получить гладкую поверхность, обеспечивающую малые теплоэлектрические потерн на спа х.Solder of the proposed composition allows, when soldering thermoelements, to reduce the thickness of the nozzle and to obtain a smooth surface that provides small thermal electric losses at the joints.

Припой по своим свойствам близок к эвтектическому .Solder in its properties close to the eutectic.

Предмет изобретени Subject invention

Припой дл  пайки термоэлементов, содержащий висмут, отличающийс  тем, что, с целью уменьшени  интервала кристаллизации припо  и повышени  качества па ного соединени , в его состав введена сурьма в количестве 4+0,2%, висмут - остальное.Solder for soldering thermoelements containing bismuth, characterized in that, in order to reduce the solder crystallization interval and improve the quality of the solder compound, antimony is added to its composition in an amount of 4 + 0.2%, bismuth - the rest.

SU1047806A 1966-01-10 1966-01-10 Solder for soldering thermoelements SU194528A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU1047806A SU194528A1 (en) 1966-01-10 1966-01-10 Solder for soldering thermoelements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU1047806A SU194528A1 (en) 1966-01-10 1966-01-10 Solder for soldering thermoelements

Related Child Applications (1)

Application Number Title Priority Date Filing Date
SU843809452A Addition SU1216103A2 (en) 1984-11-11 1984-11-11 Device for fixing motor car in case of unloading

Publications (1)

Publication Number Publication Date
SU194528A1 true SU194528A1 (en) 1967-03-30

Family

ID=39967487

Family Applications (1)

Application Number Title Priority Date Filing Date
SU1047806A SU194528A1 (en) 1966-01-10 1966-01-10 Solder for soldering thermoelements

Country Status (1)

Country Link
SU (1) SU194528A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2673870C1 (en) * 2018-03-06 2018-11-30 Федеральное государственное учреждение "Федеральный научно-исследовательский центр "Кристаллография и фотоника" Российской академии наук" Magnetoresistive alloy based on bismuth

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2673870C1 (en) * 2018-03-06 2018-11-30 Федеральное государственное учреждение "Федеральный научно-исследовательский центр "Кристаллография и фотоника" Российской академии наук" Magnetoresistive alloy based on bismuth

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