SU183037A1 - Solder for soldering products - Google Patents
Solder for soldering productsInfo
- Publication number
- SU183037A1 SU183037A1 SU905293A SU905293A SU183037A1 SU 183037 A1 SU183037 A1 SU 183037A1 SU 905293 A SU905293 A SU 905293A SU 905293 A SU905293 A SU 905293A SU 183037 A1 SU183037 A1 SU 183037A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- soldering products
- soldering
- products
- copper
- Prior art date
Links
Landscapes
- Paints Or Removers (AREA)
Description
Известен м гкий припой дл пайки изделий из меди и его сплавов следующего состава: сурьма 2-6%, индий до 5%, медь или серебро 1-4%, олово - остальное.The soft solder is known for soldering copper products and its alloys of the following composition: antimony 2-6%, indium up to 5%, copper or silver 1-4%, tin - the rest.
С целью получени па иых соединений, ко.ррозиониостойких во всех климатических услови х , Ириной вз т в другом процентном соотношении; сурьма 1±0,3; медь 2 ±0,3; серебро 5±0,3; олово - остальное.In order to obtain paired compounds that are resistant and resistant in all climatic conditions, Irina was taken in a different percentage ratio; antimony 1 ± 0.3; copper 2 ± 0,3; silver 5 ± 0,3; tin - the rest.
Предложенный припой имеет температуру плавлени 225-250° С, пластичен и может быть изготовлен в виде листа, проволоки и фольги.The proposed solder has a melting point of 225-250 ° C, is plastic and can be made in the form of sheet, wire and foil.
Получеиные па ные не требуют защитных лакокрасочных покрытий.Potential solvents do not require protective coatings.
Предмет изобретени Subject invention
Припой дл иайки изделии, содержащий олово, сурьму, медь, серебро, отличающийс тем, что, с целью получени па ных соединений , коррозионностойких во всех климатических услови х, его состав вз т в следующем процентном соотношении: сурьма 1±0,3; медь 2 + 0,3; серебро 5 ±0,3; олово - остальиое.Solder for an iica product containing tin, antimony, copper, silver, characterized in that, in order to obtain a pair of compounds that are corrosion-resistant in all climatic conditions, its composition is taken in the following percentage ratio: antimony 1 ± 0.3; copper 2 + 0.3; silver 5 ± 0,3; tin - the remaining.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU905293A SU183037A1 (en) | 1964-06-08 | 1964-06-08 | Solder for soldering products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU905293A SU183037A1 (en) | 1964-06-08 | 1964-06-08 | Solder for soldering products |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU183037A1 true SU183037A1 (en) | 1966-06-09 |
Family
ID=39952438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU905293A SU183037A1 (en) | 1964-06-08 | 1964-06-08 | Solder for soldering products |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU183037A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4695428A (en) * | 1986-08-21 | 1987-09-22 | J. W. Harris Company | Solder composition |
| US5352407A (en) * | 1993-04-29 | 1994-10-04 | Seelig Karl F | Lead-free bismuth free tin alloy solder composition |
| US5405577A (en) * | 1993-04-29 | 1995-04-11 | Seelig; Karl F. | Lead-free and bismuth-free tin alloy solder composition |
| US5532031A (en) * | 1992-01-29 | 1996-07-02 | International Business Machines Corporation | I/O pad adhesion layer for a ceramic substrate |
| US5837191A (en) * | 1996-10-22 | 1998-11-17 | Johnson Manufacturing Company | Lead-free solder |
-
1964
- 1964-06-08 SU SU905293A patent/SU183037A1/en active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4695428A (en) * | 1986-08-21 | 1987-09-22 | J. W. Harris Company | Solder composition |
| US5532031A (en) * | 1992-01-29 | 1996-07-02 | International Business Machines Corporation | I/O pad adhesion layer for a ceramic substrate |
| US5352407A (en) * | 1993-04-29 | 1994-10-04 | Seelig Karl F | Lead-free bismuth free tin alloy solder composition |
| US5405577A (en) * | 1993-04-29 | 1995-04-11 | Seelig; Karl F. | Lead-free and bismuth-free tin alloy solder composition |
| US5837191A (en) * | 1996-10-22 | 1998-11-17 | Johnson Manufacturing Company | Lead-free solder |
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