DE1195836B - Leg of a Peltier element made of semiconductor material - Google Patents
Leg of a Peltier element made of semiconductor materialInfo
- Publication number
- DE1195836B DE1195836B DEK43367A DEK0043367A DE1195836B DE 1195836 B DE1195836 B DE 1195836B DE K43367 A DEK43367 A DE K43367A DE K0043367 A DEK0043367 A DE K0043367A DE 1195836 B DE1195836 B DE 1195836B
- Authority
- DE
- Germany
- Prior art keywords
- leg
- peltier element
- semiconductor material
- element made
- copper plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
Schenkel eines Peltierelements aus Halbleitermaterial Die Erfindung betrifft einen Schenkel eines Peltierelements aus Halbleitermaterial mit darauf aufgelöteten Kupferplatten.Leg of a Peltier element made of semiconductor material The invention relates to a leg of a Peltier element made of semiconductor material with thereon soldered copper plates.
Die bekannten, üblicherweise aus Telluriden des Wismuts bestehenden Schenkel der Peltierelemente mit einer Verbindung von kupfernen Platten mit den Halbleiterelektroden können einen Dauerbetrieb nicht gewährleisten, weil die durch Lötung zu verbindenden Stoffe (Kupfer und die Legierungen, aus denen die Elektroden bestehen) stark unterschiedliche lineare Wärmeausdehnungskoeffizienten besitzen, so daß nach kurzfristiger Betriebsdauer in der Lötstelle Mikrorisse entstehen, die die Wirkung des Peltierelements beeinträchtigen und dieses vorzeitig unbrauchbar machen.The known, usually consisting of tellurides of bismuth Legs of the Peltier elements with a connection of copper plates with the Semiconductor electrodes cannot guarantee continuous operation because the through Solder to join substances (copper and the alloys that make up the electrodes exist) have very different linear thermal expansion coefficients, so that microcracks arise in the solder joint after a short period of operation impair the effect of the Peltier element and make it unusable prematurely do.
Der Schenkel eines Peltierelements besitzt nach der Erfindung einen 0,2 bis 0,3 mm starken 17berzug einer Legierung aus 99% Wismut und 1% Zinn. Dieser Überzug kann auf die Elektroden des Peltierelements mit Hilfe eines Lötkolbens oder auf beliebige andere Weise aufgetragen werden. Dieser überzug hat die Aufgabe, die mechanischen Spannungen, welche in der Lötstelle infolge periodisch wechselnder Temperaturen entstehen, aufzunehmen und dadurch dem Entstehen von Mikrorissen vorzubeugen.According to the invention, the leg of a Peltier element has a 0.2 to 0.3 mm thick 17 coating of an alloy of 99% bismuth and 1% tin. This Plating can be done on the electrodes of the Peltier element with the help of a soldering iron or can be applied in any other way. This coating has the task of mechanical stresses that occur in the solder joint as a result of periodically changing Temperatures arise, absorb and thereby prevent the formation of microcracks.
An die Oberfläche des flberzugs werden auf übliche Weise kupferne Platten angelötet, wobei in diesem Falle als Lötmetall das Woodsche Metall oder eine beliebige andere Legierung verwendet wird, deren Schmelztemperatur 140° C nicht übersteigt.The surface of the coating is coated in the usual way with copper Plates soldered on, in which case Wood's metal or any other alloy is used, the melting temperature of which is not 140 ° C exceeds.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEK43367A DE1195836B (en) | 1961-04-01 | 1961-04-01 | Leg of a Peltier element made of semiconductor material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEK43367A DE1195836B (en) | 1961-04-01 | 1961-04-01 | Leg of a Peltier element made of semiconductor material |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1195836B true DE1195836B (en) | 1965-07-01 |
Family
ID=7223088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEK43367A Pending DE1195836B (en) | 1961-04-01 | 1961-04-01 | Leg of a Peltier element made of semiconductor material |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE1195836B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017204887A1 (en) * | 2017-03-23 | 2018-09-27 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Use of a liquid metal to join thermoelectric modules in a SLID process |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE751201C (en) * | 1937-06-05 | 1953-05-18 | Hartmetallwerkzeugfabrik Meuts | Flexible metal mesh insert for soldering metal pieces on tools |
-
1961
- 1961-04-01 DE DEK43367A patent/DE1195836B/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE751201C (en) * | 1937-06-05 | 1953-05-18 | Hartmetallwerkzeugfabrik Meuts | Flexible metal mesh insert for soldering metal pieces on tools |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017204887A1 (en) * | 2017-03-23 | 2018-09-27 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Use of a liquid metal to join thermoelectric modules in a SLID process |
DE102017204887B4 (en) | 2017-03-23 | 2020-07-23 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Method using a liquid metal for joining thermoelectric modules in a SLID process, and the arrangement and use produced therewith for using thermoelectric modules |
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