DE1195836B - Leg of a Peltier element made of semiconductor material - Google Patents

Leg of a Peltier element made of semiconductor material

Info

Publication number
DE1195836B
DE1195836B DEK43367A DEK0043367A DE1195836B DE 1195836 B DE1195836 B DE 1195836B DE K43367 A DEK43367 A DE K43367A DE K0043367 A DEK0043367 A DE K0043367A DE 1195836 B DE1195836 B DE 1195836B
Authority
DE
Germany
Prior art keywords
leg
peltier element
semiconductor material
element made
copper plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEK43367A
Other languages
German (de)
Inventor
Jewgenij A Kolenko
Anatolij G Schtscherbina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JEWGENIJ A KOLENKO
Original Assignee
JEWGENIJ A KOLENKO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JEWGENIJ A KOLENKO filed Critical JEWGENIJ A KOLENKO
Priority to DEK43367A priority Critical patent/DE1195836B/en
Publication of DE1195836B publication Critical patent/DE1195836B/en
Pending legal-status Critical Current

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Description

Schenkel eines Peltierelements aus Halbleitermaterial Die Erfindung betrifft einen Schenkel eines Peltierelements aus Halbleitermaterial mit darauf aufgelöteten Kupferplatten.Leg of a Peltier element made of semiconductor material The invention relates to a leg of a Peltier element made of semiconductor material with thereon soldered copper plates.

Die bekannten, üblicherweise aus Telluriden des Wismuts bestehenden Schenkel der Peltierelemente mit einer Verbindung von kupfernen Platten mit den Halbleiterelektroden können einen Dauerbetrieb nicht gewährleisten, weil die durch Lötung zu verbindenden Stoffe (Kupfer und die Legierungen, aus denen die Elektroden bestehen) stark unterschiedliche lineare Wärmeausdehnungskoeffizienten besitzen, so daß nach kurzfristiger Betriebsdauer in der Lötstelle Mikrorisse entstehen, die die Wirkung des Peltierelements beeinträchtigen und dieses vorzeitig unbrauchbar machen.The known, usually consisting of tellurides of bismuth Legs of the Peltier elements with a connection of copper plates with the Semiconductor electrodes cannot guarantee continuous operation because the through Solder to join substances (copper and the alloys that make up the electrodes exist) have very different linear thermal expansion coefficients, so that microcracks arise in the solder joint after a short period of operation impair the effect of the Peltier element and make it unusable prematurely do.

Der Schenkel eines Peltierelements besitzt nach der Erfindung einen 0,2 bis 0,3 mm starken 17berzug einer Legierung aus 99% Wismut und 1% Zinn. Dieser Überzug kann auf die Elektroden des Peltierelements mit Hilfe eines Lötkolbens oder auf beliebige andere Weise aufgetragen werden. Dieser überzug hat die Aufgabe, die mechanischen Spannungen, welche in der Lötstelle infolge periodisch wechselnder Temperaturen entstehen, aufzunehmen und dadurch dem Entstehen von Mikrorissen vorzubeugen.According to the invention, the leg of a Peltier element has a 0.2 to 0.3 mm thick 17 coating of an alloy of 99% bismuth and 1% tin. This Plating can be done on the electrodes of the Peltier element with the help of a soldering iron or can be applied in any other way. This coating has the task of mechanical stresses that occur in the solder joint as a result of periodically changing Temperatures arise, absorb and thereby prevent the formation of microcracks.

An die Oberfläche des flberzugs werden auf übliche Weise kupferne Platten angelötet, wobei in diesem Falle als Lötmetall das Woodsche Metall oder eine beliebige andere Legierung verwendet wird, deren Schmelztemperatur 140° C nicht übersteigt.The surface of the coating is coated in the usual way with copper Plates soldered on, in which case Wood's metal or any other alloy is used, the melting temperature of which is not 140 ° C exceeds.

Claims (2)

Patentansprüche: 1. Schenkel eines Peltierelements aus Halbleitenriaterial, gekennzeichnet durch einen 0,2 bis 0,3 mm starken überzug aus 99 % Wismut und etwa 1% Zinn sowie durch darauf aufgelötete Kupferplatten. Claims: 1. Leg of a Peltier element made of semiconductor material, characterized by a 0.2 to 0.3 mm thick coating of 99% bismuth and approximately 1% tin as well as copper plates soldered onto it. 2. Schenkel nach Anspruch 1, dadurch gekennzeichnet, daß die Kupferplatten mit Woodschem Metall oder einem anderen unter-140°C schmelzenden Metall aufgelötet sind. In. Betracht gezogene Druckschriften: Deutsche Patentschrift Nr. 751201.2. Leg according to claim 1, characterized in that the copper plates with Wood's metal or a other metal that melts below -140 ° C are soldered on. In. Considered publications: German patent specification No. 751201.
DEK43367A 1961-04-01 1961-04-01 Leg of a Peltier element made of semiconductor material Pending DE1195836B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DEK43367A DE1195836B (en) 1961-04-01 1961-04-01 Leg of a Peltier element made of semiconductor material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEK43367A DE1195836B (en) 1961-04-01 1961-04-01 Leg of a Peltier element made of semiconductor material

Publications (1)

Publication Number Publication Date
DE1195836B true DE1195836B (en) 1965-07-01

Family

ID=7223088

Family Applications (1)

Application Number Title Priority Date Filing Date
DEK43367A Pending DE1195836B (en) 1961-04-01 1961-04-01 Leg of a Peltier element made of semiconductor material

Country Status (1)

Country Link
DE (1) DE1195836B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017204887A1 (en) * 2017-03-23 2018-09-27 Deutsches Zentrum für Luft- und Raumfahrt e.V. Use of a liquid metal to join thermoelectric modules in a SLID process

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE751201C (en) * 1937-06-05 1953-05-18 Hartmetallwerkzeugfabrik Meuts Flexible metal mesh insert for soldering metal pieces on tools

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE751201C (en) * 1937-06-05 1953-05-18 Hartmetallwerkzeugfabrik Meuts Flexible metal mesh insert for soldering metal pieces on tools

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017204887A1 (en) * 2017-03-23 2018-09-27 Deutsches Zentrum für Luft- und Raumfahrt e.V. Use of a liquid metal to join thermoelectric modules in a SLID process
DE102017204887B4 (en) 2017-03-23 2020-07-23 Deutsches Zentrum für Luft- und Raumfahrt e.V. Method using a liquid metal for joining thermoelectric modules in a SLID process, and the arrangement and use produced therewith for using thermoelectric modules

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