SU170268A1 - Solder for soldering - Google Patents
Solder for solderingInfo
- Publication number
- SU170268A1 SU170268A1 SU837846A SU837846A SU170268A1 SU 170268 A1 SU170268 A1 SU 170268A1 SU 837846 A SU837846 A SU 837846A SU 837846 A SU837846 A SU 837846A SU 170268 A1 SU170268 A1 SU 170268A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- silver
- soldering
- antimony
- copper
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Известны олов нносвинцовые принои, содержащие также 1,5-2% сурьмы и 0,10-0,15% меди.Known tins are known as lead, containing also 1.5-2% antimony and 0.10-0.15% copper.
Предлагаемый припой дл пайки электрических проводников к силикатносеребр ным шинкам на стекле или керамике отличаетс от известных тем, что в его состав введено 5% серебра и 0,1% фосфора.The proposed solder for soldering electrical conductors to silicate-silver shells on glass or ceramics differs from the known ones in that it contains 5% silver and 0.1% phosphorus.
Еведе1 ие серебра в припой уменьшает растворение серебра силикатносеребр ных шинок II припое и повышает прочность соединени .The supply of silver in solder reduces the dissolution of silver silicate-silver tires II solder and increases the strength of the joint.
Состав описываемого припо следующий (в о): олова 40; серебра 5; меди 5; сурьмы 1,5; (росфора 0,1; свинец - остальное.The composition of the described solder is the following (in o): tin 40; silver 5; copper 5; antimony 1.5; (Rossora 0.1; lead - the rest.
Температура плавлени припо 300°С, пайка может производитьс без флюса.The melting point of the solder is 300 ° C; soldering can be done without flux.
Предмет изобретени Subject invention
Припой дл пайки электрических проводников с силикатносеребр ным щинками, содержащий олово, свинец, сурьму, медь, отличающийс тем, что, с целью уменьшени paCTiiOрени серебра силикатносеребр ных щинок н повышени прочности соединени ,- в его состав введены серебро в количестве 5%, фосфор 0,1%, а остальные компоненты вз ты в следующем процентном соотношении: олово 40; медь 5; сурьма 1,5; свинец - остальное.Solder for soldering electrical conductors with silicate-silver stitching, containing tin, lead, antimony, copper, characterized in that, in order to reduce paCTii Silver silver silicate splint level and increase the strength of the compound, silver 5% of phosphorus 0 , 1%, and the remaining components are taken in the following percentage: tin 40; copper 5; antimony 1.5; lead - the rest.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU837846A SU170268A1 (en) | 1963-05-17 | 1963-05-17 | Solder for soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU837846A SU170268A1 (en) | 1963-05-17 | 1963-05-17 | Solder for soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU170268A1 true SU170268A1 (en) | 1965-04-09 |
Family
ID=39951489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU837846A SU170268A1 (en) | 1963-05-17 | 1963-05-17 | Solder for soldering |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU170268A1 (en) |
-
1963
- 1963-05-17 SU SU837846A patent/SU170268A1/en active
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