SU239000A1 - Solder for soldering of semi-conductor parts - Google Patents

Solder for soldering of semi-conductor parts

Info

Publication number
SU239000A1
SU239000A1 SU1180634A SU1180634A SU239000A1 SU 239000 A1 SU239000 A1 SU 239000A1 SU 1180634 A SU1180634 A SU 1180634A SU 1180634 A SU1180634 A SU 1180634A SU 239000 A1 SU239000 A1 SU 239000A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solder
soldering
semi
conductor parts
sodium
Prior art date
Application number
SU1180634A
Other languages
Russian (ru)
Original Assignee
О. П. Ксенофонтов
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by О. П. Ксенофонтов filed Critical О. П. Ксенофонтов
Priority to SU1180634A priority Critical patent/SU239000A1/en
Application granted granted Critical
Publication of SU239000A1 publication Critical patent/SU239000A1/en

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Description

Известен легкоплавкий припой, содержащий (в о/о): кадмий , цинк 0,5-1,5, натрий до 0,3, сурьму 1-1,5, свинец - остальное .Known low-melting solder containing (in o / o): cadmium, zinc 0.5-1.5, sodium to 0.3, antimony 1-1.5, lead - the rest.

Дл  придани  припою флюсующих и геттерных свойств в состав предлагаемого припо  вход т Следующие компоненты (в %): кадмий 14-20, цинк 1-3, «атрий 2-5, свинец остальное.The solder includes flux and getter properties of the proposed solder. The following components (in%): cadmium 14-20, zinc 1-3, atrium 2-5, lead the rest.

Температура плавлени  припо  245°С. Восстановителем в Припое  вл етс  натрий, который окисл етс  «а воздухе При расплавлении припо , восстанавлива  окислы па емого металла .Melting point solder is 245 ° C. The reducing agent in Solder is sodium, which is oxidized in air. When the solder melts, it restores the oxides of the molten metal.

Врем  самофлюсовани  увеличиваетс  при увеличении содержани  натри  в припое.The self-fluxing time increases with increasing sodium content in the solder.

Кроме самофлюсующих свойств припой обладает свойствами геттера, т. е. способностью .поглощать влагу. Поглотителем влаги  вл етс  окИСЬ натри , остающа с  на поверхностиIn addition to self-fluxing properties, the solder has the properties of a getter, that is, the ability to absorb moisture. Moisture absorber is a sodium oxide remaining on the surface.

припо  после процесса самофлюсовани . После приплавлени  р-л-перехода к крнсталлОдержателю , прибор следует немедленно загерметизировать . Окись натри  поглотит пары воды из полости загерметизированного прибора, стабилизиру  характеристики собранного прибора.solder after the self-fluxing process. After melting the p-junction to the holder, the device should be sealed immediately. The sodium oxide will absorb water vapor from the cavity of the sealed instrument, stabilizing the characteristics of the assembled instrument.

Предмет изобретени Subject invention

Припой дл  пайки деталей полупроводниковых приборов, содержащий кадмий, цинк, натрий, свинец, отличающийс  тем, что, с целью придани  припою флюсующих и геттерных свойств, в его состав вход т следующие компоненты (в %):Solder for soldering parts of semiconductor devices containing cadmium, zinc, sodium, lead, characterized in that, in order to impart solder flux and getter properties, it consists of the following components (in%):

Кадмий14-20Cadmium14-20

Цинк1- 3Zinc-3

Натрий2- 5Sodium2-5

Свинецостальное.Lead

SU1180634A 1967-08-18 1967-08-18 Solder for soldering of semi-conductor parts SU239000A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU1180634A SU239000A1 (en) 1967-08-18 1967-08-18 Solder for soldering of semi-conductor parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU1180634A SU239000A1 (en) 1967-08-18 1967-08-18 Solder for soldering of semi-conductor parts

Publications (1)

Publication Number Publication Date
SU239000A1 true SU239000A1 (en) 1969-03-10

Family

ID=39970864

Family Applications (1)

Application Number Title Priority Date Filing Date
SU1180634A SU239000A1 (en) 1967-08-18 1967-08-18 Solder for soldering of semi-conductor parts

Country Status (1)

Country Link
SU (1) SU239000A1 (en)

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