SU242648A1 - Solder for soldering of semi-conductor parts - Google Patents

Solder for soldering of semi-conductor parts

Info

Publication number
SU242648A1
SU242648A1 SU1179394A SU1179394A SU242648A1 SU 242648 A1 SU242648 A1 SU 242648A1 SU 1179394 A SU1179394 A SU 1179394A SU 1179394 A SU1179394 A SU 1179394A SU 242648 A1 SU242648 A1 SU 242648A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solder
soldering
semi
conductor parts
fluxing
Prior art date
Application number
SU1179394A
Other languages
Russian (ru)
Original Assignee
О. П. Ксенофонтов
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by О. П. Ксенофонтов filed Critical О. П. Ксенофонтов
Priority to SU1179394A priority Critical patent/SU242648A1/en
Application granted granted Critical
Publication of SU242648A1 publication Critical patent/SU242648A1/en

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Description

Известен легкоилавкий припой на основе кадмий - цинк (82,6-17,4%).Known alloy solder based on cadmium - zinc (82.6-17.4%).

Предлагаемый припой отличаетс  от известного тем, что в его состав введен натрий в количестве 2-5%, а остальные компоненты вз ты в следующем соотношении в %: кадмий 75-87, 1ЦИНК 10-20. Это придает припою самофлюсующие и геттерные свойства.The proposed solder differs from the known one in that sodium in the amount of 2-5% is introduced into its composition, and the remaining components are taken in the following ratio in%: cadmium 75-87, 1-CINC 10-20. This gives the solder self-fluxing and getter properties.

Отличие состоит также и в том, что в состав припо  может .быть также введено серебро в количестве до 3%.The difference also lies in the fact that the composition of the solder can also be introduced silver in an amount up to 3%.

Температура плавлени  припо  266-270°С.Melting point solder 266-270 ° C.

Припой предназначен дл  па ни  никелевых , медных, золотых и серебр ных поверхностей .Solder is designed for brazing nickel, copper, gold and silver surfaces.

Восстановителем в припо х  вл етс  натрий , который окисл етс  на воздухе при их расплавлении, восстанавлива  окислы па ното металла. Врем  самофлюсовани  увеличиваетс  при увеличении содержани  натри  в припое.The reducing agent in solder is sodium, which is oxidized in air as it melts, reducing the oxides of the metal trap. The self-fluxing time increases with increasing sodium content in the solder.

Припои,  вл ющиес  в исходном состо нии довольно хрупкими, станов тс  пластичными после удалени  натри  из них в процессе самофлюсовани .The solders, which in the initial state are rather fragile, become plastic after removing sodium from them during the self-fluxing process.

Кроме самофлюсующихс  свойств припой обладает свойствами геттера, т. е. способностью поглощать влагу. Поглотителем влаги  вл етс  окись натри , остающа с  на поверхности припо  после самофлюсовани . Если после приплавлени  р-д-иерехода к кристаллодержателю прибор немедленно загерметизировать, окись натри  поглотит пары воды из полости загерметизированногоIn addition to self-fluxing properties, the solder has the properties of a getter, that is, the ability to absorb moisture. The moisture absorber is sodium oxide remaining on the surface of the solder after self-fluxing. If the device is immediately sealed after the pd is welded to the crystal holder, sodium oxide will absorb water vapors from the sealed cavity

прибора, (стабилизиру  хара ктеристики собранного нрибора.device, (stabilizing the characteristics of the assembled device.

Предмет изобретени Subject invention

Claims (2)

1. Припой дл  пайки деталей полупроводниковых приборов, содержащий кадмий, .цинк, отличающийс  тем, что, с целью придани  припою са мофлюсующих и геттерных свойств, в его состав введен натрий в количестве1. Solder for soldering parts of semiconductor devices containing cadmium, zinc, characterized in that, in order to impart solder self-fluxing and getter properties, sodium in the amount of 2-5%, а остальные компоненты вз ты в следующем соотношении в %: кадмий 75-87; ЦИН1К 10-20.2-5%, and the remaining components are taken in the following ratio in%: cadmium 75-87; ZIN1K 10-20. 2. Припой по п. 1, отличающийс  тем, что в его состав может быть введено серебро в2. Solder according to claim 1, characterized in that silver may be included in its composition. количестве до 3%.amount up to 3%.
SU1179394A 1967-08-14 1967-08-14 Solder for soldering of semi-conductor parts SU242648A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU1179394A SU242648A1 (en) 1967-08-14 1967-08-14 Solder for soldering of semi-conductor parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU1179394A SU242648A1 (en) 1967-08-14 1967-08-14 Solder for soldering of semi-conductor parts

Publications (1)

Publication Number Publication Date
SU242648A1 true SU242648A1 (en) 1969-04-25

Family

ID=39992814

Family Applications (1)

Application Number Title Priority Date Filing Date
SU1179394A SU242648A1 (en) 1967-08-14 1967-08-14 Solder for soldering of semi-conductor parts

Country Status (1)

Country Link
SU (1) SU242648A1 (en)

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