JPS5591133A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5591133A
JPS5591133A JP16487678A JP16487678A JPS5591133A JP S5591133 A JPS5591133 A JP S5591133A JP 16487678 A JP16487678 A JP 16487678A JP 16487678 A JP16487678 A JP 16487678A JP S5591133 A JPS5591133 A JP S5591133A
Authority
JP
Japan
Prior art keywords
lead wire
electrode
semiconductor element
circuit
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16487678A
Other languages
Japanese (ja)
Other versions
JPS6153853B2 (en
Inventor
Toshio Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP16487678A priority Critical patent/JPS5591133A/en
Publication of JPS5591133A publication Critical patent/JPS5591133A/en
Publication of JPS6153853B2 publication Critical patent/JPS6153853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent short-circuit of the lead wire by absorbing connecting metal running out with a recess provided near the connection point of the lead wire when the lead wire having a plating layer on the surface thereof is connected to the electrode provided on the semiconductor element.
CONSTITUTION: A lead wire 13 having a tin plating 13' on the surface thereof is connected to a projected electrode 12 formed on a semiconductor element 1 employing a gold-tin eutectic alloy 15. In this process, a recess 17 is formed on the lead wire near a point surrounding the electrode 12 to absorb excess alloy running melted by heat during the connection through the surface tension. This eliminates metal grain mass which otherwise causes a short-circuit of the lead wire. Even if a lead wire having a thick plating layer is used to improve the wetting property of the solder, the reliability of the element will not be lowered.
COPYRIGHT: (C)1980,JPO&Japio
JP16487678A 1978-12-27 1978-12-27 Semiconductor device Granted JPS5591133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16487678A JPS5591133A (en) 1978-12-27 1978-12-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16487678A JPS5591133A (en) 1978-12-27 1978-12-27 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5591133A true JPS5591133A (en) 1980-07-10
JPS6153853B2 JPS6153853B2 (en) 1986-11-19

Family

ID=15801588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16487678A Granted JPS5591133A (en) 1978-12-27 1978-12-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5591133A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH052366U (en) * 1991-06-24 1993-01-14 富士電気化学株式会社 Cylindrical alkaline battery

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51128467U (en) * 1975-04-11 1976-10-16
JPS6029218A (en) * 1983-07-14 1985-02-14 Oyo Jiki Kenkyusho:Kk Wire-cut machining method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51128467U (en) * 1975-04-11 1976-10-16
JPS6029218A (en) * 1983-07-14 1985-02-14 Oyo Jiki Kenkyusho:Kk Wire-cut machining method

Also Published As

Publication number Publication date
JPS6153853B2 (en) 1986-11-19

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