JPS5591133A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5591133A JPS5591133A JP16487678A JP16487678A JPS5591133A JP S5591133 A JPS5591133 A JP S5591133A JP 16487678 A JP16487678 A JP 16487678A JP 16487678 A JP16487678 A JP 16487678A JP S5591133 A JPS5591133 A JP S5591133A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- electrode
- semiconductor element
- circuit
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To prevent short-circuit of the lead wire by absorbing connecting metal running out with a recess provided near the connection point of the lead wire when the lead wire having a plating layer on the surface thereof is connected to the electrode provided on the semiconductor element.
CONSTITUTION: A lead wire 13 having a tin plating 13' on the surface thereof is connected to a projected electrode 12 formed on a semiconductor element 1 employing a gold-tin eutectic alloy 15. In this process, a recess 17 is formed on the lead wire near a point surrounding the electrode 12 to absorb excess alloy running melted by heat during the connection through the surface tension. This eliminates metal grain mass which otherwise causes a short-circuit of the lead wire. Even if a lead wire having a thick plating layer is used to improve the wetting property of the solder, the reliability of the element will not be lowered.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16487678A JPS5591133A (en) | 1978-12-27 | 1978-12-27 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16487678A JPS5591133A (en) | 1978-12-27 | 1978-12-27 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5591133A true JPS5591133A (en) | 1980-07-10 |
JPS6153853B2 JPS6153853B2 (en) | 1986-11-19 |
Family
ID=15801588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16487678A Granted JPS5591133A (en) | 1978-12-27 | 1978-12-27 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5591133A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH052366U (en) * | 1991-06-24 | 1993-01-14 | 富士電気化学株式会社 | Cylindrical alkaline battery |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51128467U (en) * | 1975-04-11 | 1976-10-16 | ||
JPS6029218A (en) * | 1983-07-14 | 1985-02-14 | Oyo Jiki Kenkyusho:Kk | Wire-cut machining method |
-
1978
- 1978-12-27 JP JP16487678A patent/JPS5591133A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51128467U (en) * | 1975-04-11 | 1976-10-16 | ||
JPS6029218A (en) * | 1983-07-14 | 1985-02-14 | Oyo Jiki Kenkyusho:Kk | Wire-cut machining method |
Also Published As
Publication number | Publication date |
---|---|
JPS6153853B2 (en) | 1986-11-19 |
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