JPS5572048A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS5572048A
JPS5572048A JP14577078A JP14577078A JPS5572048A JP S5572048 A JPS5572048 A JP S5572048A JP 14577078 A JP14577078 A JP 14577078A JP 14577078 A JP14577078 A JP 14577078A JP S5572048 A JPS5572048 A JP S5572048A
Authority
JP
Japan
Prior art keywords
solder
semiconductor
alloy
metal plate
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14577078A
Other languages
Japanese (ja)
Inventor
Yoshiyasu Koike
Akio Hori
Norio Ozawa
Tetsuo Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14577078A priority Critical patent/JPS5572048A/en
Publication of JPS5572048A publication Critical patent/JPS5572048A/en
Pending legal-status Critical Current

Links

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  • Die Bonding (AREA)

Abstract

PURPOSE: To improve reliability of bonding between semiconductor chip and metal plate using a solder of which specific amount of Ga is added into Sn or Sn alloy.
CONSTITUTION: A semiconductor and a metal plate and bonded using a preformed solder of which Ga of 0.01W0.5wt% is contained in Sn or Sn alloy. When the amount added is less than 0.01wt%, the mechanical strength and anti-oxidizability of the solder are not improved because the Ga forms a solid-solution, and when it is more than 0.5wt%, the extensibility of the solder is checked by the excessive amount of the Ga solid-solution. Also, as a strain stress is created, it leads breaking of semiconductor element and the solder inself becomes fragile. Use of the solder having the above constitution eliminates wearing or breaking of junction part, cracking of chip and melting of junction part being on the use. So a stable and highly reliable junction is obtained.
COPYRIGHT: (C)1980,JPO&Japio
JP14577078A 1978-11-25 1978-11-25 Semiconductor element Pending JPS5572048A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14577078A JPS5572048A (en) 1978-11-25 1978-11-25 Semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14577078A JPS5572048A (en) 1978-11-25 1978-11-25 Semiconductor element

Publications (1)

Publication Number Publication Date
JPS5572048A true JPS5572048A (en) 1980-05-30

Family

ID=15392754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14577078A Pending JPS5572048A (en) 1978-11-25 1978-11-25 Semiconductor element

Country Status (1)

Country Link
JP (1) JPS5572048A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0074500A2 (en) * 1981-09-16 1983-03-23 VDO Adolf Schindling AG Liquid-crystal cell
EP1166938A2 (en) * 2000-06-30 2002-01-02 Nihon Almit Co.,Ltd. PB-free soldering alloy
US6475643B1 (en) * 1999-11-01 2002-11-05 Senju Metal Industry Co., Ltd. Plated electrical leads

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0074500A2 (en) * 1981-09-16 1983-03-23 VDO Adolf Schindling AG Liquid-crystal cell
EP0074500A3 (en) * 1981-09-16 1984-04-04 VDO Adolf Schindling AG Liquid-crystal cell
US6475643B1 (en) * 1999-11-01 2002-11-05 Senju Metal Industry Co., Ltd. Plated electrical leads
EP1166938A2 (en) * 2000-06-30 2002-01-02 Nihon Almit Co.,Ltd. PB-free soldering alloy
EP1166938A3 (en) * 2000-06-30 2003-12-17 Nihon Almit Co.,Ltd. PB-free soldering alloy

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