GB2229859B - Bonding wire for semiconductor elememt - Google Patents

Bonding wire for semiconductor elememt

Info

Publication number
GB2229859B
GB2229859B GB8928848A GB8928848A GB2229859B GB 2229859 B GB2229859 B GB 2229859B GB 8928848 A GB8928848 A GB 8928848A GB 8928848 A GB8928848 A GB 8928848A GB 2229859 B GB2229859 B GB 2229859B
Authority
GB
United Kingdom
Prior art keywords
bonding wire
semiconductor
elememt
bonding
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8928848A
Other versions
GB8928848D0 (en
GB2229859A (en
Inventor
Yasuhide Ono
Yoshio Ozeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Publication of GB8928848D0 publication Critical patent/GB8928848D0/en
Publication of GB2229859A publication Critical patent/GB2229859A/en
Application granted granted Critical
Publication of GB2229859B publication Critical patent/GB2229859B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B5/00—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • B23B5/08—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor for turning axles, bars, rods, tubes, rolls, i.e. shaft-turning lathes, roll lathes; Centreless turning
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

A bonding wire (3) for connecting an electrode of a semiconductor element to an external lead (2), which comprises 1 to less than 5 wt % of copper and the balance of gold and unavoidable impurities, and which has excellent break strength and bonding strength to provide reliable connection even in a thickness as small as about 10 mu m in diameter.
GB8928848A 1988-05-02 1989-12-21 Bonding wire for semiconductor elememt Expired - Fee Related GB2229859B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10958788 1988-05-02
PCT/JP1989/000463 WO1989011161A1 (en) 1988-05-02 1989-05-02 Bonding wire for semiconductor elements

Publications (3)

Publication Number Publication Date
GB8928848D0 GB8928848D0 (en) 1990-06-13
GB2229859A GB2229859A (en) 1990-10-03
GB2229859B true GB2229859B (en) 1993-01-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB8928848A Expired - Fee Related GB2229859B (en) 1988-05-02 1989-12-21 Bonding wire for semiconductor elememt

Country Status (5)

Country Link
JP (1) JP2745065B2 (en)
KR (1) KR930001265B1 (en)
DE (1) DE3990432C1 (en)
GB (1) GB2229859B (en)
WO (1) WO1989011161A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233408A (en) * 1997-02-21 1998-09-02 Nec Corp Metal junction structure and semiconductor device
JP3426473B2 (en) * 1997-07-01 2003-07-14 新日本製鐵株式会社 Gold alloy wires for semiconductor devices
DE19740004A1 (en) * 1997-09-11 1998-11-19 Siemens Ag Bond wire for semiconductor device contact terminal
DE19753055B4 (en) * 1997-11-29 2005-09-15 W.C. Heraeus Gmbh Fine wire of a gold alloy, process for its preparation and its use

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112060A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor
JPS6049534A (en) * 1983-08-26 1985-03-18 三菱電機株式会社 Circuit breaker
JPS6076556A (en) * 1983-08-15 1985-05-01 ゼネラル・エレクトリツク・カンパニイ Flame retardant non-fire dripping polycarbonate composition
EP0288776A2 (en) * 1987-04-28 1988-11-02 Texas Instruments Incorporated Gold alloy wire connection to copper doped aluminum semiconductor circuit interconnection bonding pad

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769006A (en) * 1972-01-27 1973-10-30 Gold Refining W Co Bright cast alloy, and composition
JPS55127041A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Resin-sealed semiconductor device
JPS5649534A (en) * 1979-09-28 1981-05-06 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor device
JPS5676556A (en) * 1979-11-28 1981-06-24 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor element
DE3153395C2 (en) * 1981-02-12 1987-11-19 W.C. Heraeus Gmbh, 6450 Hanau, De Use of a very fine wire made of a copper/tin alloy
DD201156A1 (en) * 1981-10-02 1983-07-06 Daut Hans Heiner Precious metal alloys for micro-wire materials
JPH0221201A (en) * 1988-08-25 1990-01-24 Amada Co Ltd Distance detector for processing machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112060A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor
JPS6076556A (en) * 1983-08-15 1985-05-01 ゼネラル・エレクトリツク・カンパニイ Flame retardant non-fire dripping polycarbonate composition
JPS6049534A (en) * 1983-08-26 1985-03-18 三菱電機株式会社 Circuit breaker
EP0288776A2 (en) * 1987-04-28 1988-11-02 Texas Instruments Incorporated Gold alloy wire connection to copper doped aluminum semiconductor circuit interconnection bonding pad

Also Published As

Publication number Publication date
JP2745065B2 (en) 1998-04-28
JPH02119148A (en) 1990-05-07
GB8928848D0 (en) 1990-06-13
GB2229859A (en) 1990-10-03
DE3990432C1 (en) 1994-06-23
WO1989011161A1 (en) 1989-11-16
KR900700217A (en) 1990-08-11
KR930001265B1 (en) 1993-02-22

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PCNP Patent ceased through non-payment of renewal fee

Effective date: 20050502