MY122351A - Fine wire of gold alloy, method for manufacture thereof and use thereof - Google Patents

Fine wire of gold alloy, method for manufacture thereof and use thereof

Info

Publication number
MY122351A
MY122351A MYPI98005384A MYPI9805384A MY122351A MY 122351 A MY122351 A MY 122351A MY PI98005384 A MYPI98005384 A MY PI98005384A MY PI9805384 A MYPI9805384 A MY PI9805384A MY 122351 A MY122351 A MY 122351A
Authority
MY
Malaysia
Prior art keywords
gold alloy
manufacture
fine wire
gold
metaal
Prior art date
Application number
MYPI98005384A
Inventor
Christoph Dr Simons
Gunther Dr Herklotz
Lutz Schrapler
Jurgen Reuel
Y C Cho
Original Assignee
Heraeus Materials Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Materials Tech Gmbh filed Critical Heraeus Materials Tech Gmbh
Publication of MY122351A publication Critical patent/MY122351A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
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    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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Abstract

FINE WIRES OF A GOLD ALLOY CONTAINING 0.5 TO 0.9 W% OF COPPER AND SMALL PROPORTIONS OF PLATINUM OR AT LEAST ONE ELEMENT FROM THE GROUP OF ALKALINE EARTH METAAL AND RARE EARTH METALS ARE CHARACTERIZED BY A SPECIFIC ELECTRICAL RESISTANCE SIMILAR TO THAT OF GOLD AND A FAVORABLE STRENGTH-TO-ELONGATION RATIO. THEY ARE SUITABLE BOTH FOR WIRE BONDING AND FOR MAKING THE BALL BUMPS OF FLIP CHIPS.
MYPI98005384A 1997-11-29 1998-11-27 Fine wire of gold alloy, method for manufacture thereof and use thereof MY122351A (en)

Applications Claiming Priority (1)

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KR20030096985A (en) * 2002-06-18 2003-12-31 헤라우스오리엔탈하이텍 주식회사 Gold alloy wire for bonding of semiconductor device
JP4726205B2 (en) * 2005-06-14 2011-07-20 田中電子工業株式会社 Gold alloy wire for bonding wire with high initial bondability, high bond reliability, high roundness of crimped ball, high straightness and high resin flow resistance
JP4726206B2 (en) * 2005-06-14 2011-07-20 田中電子工業株式会社 Gold alloy wire for bonding wire with high initial bondability, high bond reliability, high roundness of crimped ball, high straightness, high resin flow resistance and low specific resistance
JP4596467B2 (en) * 2005-06-14 2010-12-08 田中電子工業株式会社 Gold alloy wire for bonding wire with high bonding reliability, high roundness of crimped ball, high straightness and high resin flow resistance
KR101451361B1 (en) * 2012-12-04 2014-10-15 희성금속 주식회사 Cu alloy bonding wire for semiconductor package
WO2014122233A1 (en) 2013-02-06 2014-08-14 Rolex Sa Timepiece made from rose gold alloy
SG11201901205XA (en) * 2017-03-27 2019-03-28 Subodh Pethe Hard gold alloy with zirconium, titanium and magnesium for jewelry manufacture
CN107974571B (en) * 2017-11-22 2019-06-14 有研亿金新材料有限公司 A kind of gold porcelain alloy wire and preparation method thereof
CN108922876B (en) * 2018-06-27 2020-05-29 汕头市骏码凯撒有限公司 Gold alloy bonding wire and manufacturing method thereof
CN111394606B (en) * 2020-05-06 2021-03-16 贵研铂业股份有限公司 Gold-based high-resistance alloy, alloy material and preparation method thereof
CN114214538B (en) * 2021-11-12 2022-07-26 中国科学院金属研究所 Gold-platinum alloy inspection mass material for space gravitational wave detection inertial sensor and preparation method thereof

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DE674933C (en) * 1934-08-17 1939-04-25 Heraeus Gmbh W C Beryllium-gold alloys
GB2116208B (en) * 1981-12-04 1985-12-04 Mitsubishi Metal Corp Fine gold alloy wire for bonding of a semiconductor device
JPS63145729A (en) * 1986-03-28 1988-06-17 Nittetsu Micro Metal:Kk Gold wire for bonding semiconductor device
JP2613224B2 (en) * 1987-09-29 1997-05-21 田中貴金属工業株式会社 Gold fine wire material
JP2745065B2 (en) * 1988-05-02 1998-04-28 新日本製鐵株式会社 Bonding wire for semiconductor device
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JP3586909B2 (en) * 1995-01-20 2004-11-10 住友金属鉱山株式会社 Bonding wire
JP3367544B2 (en) * 1995-08-23 2003-01-14 田中電子工業株式会社 Gold alloy fine wire for bonding and method of manufacturing the same

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CN1085739C (en) 2002-05-29
KR19990045637A (en) 1999-06-25
JPH11222639A (en) 1999-08-17
KR100326478B1 (en) 2002-07-02
CH693209A5 (en) 2003-04-15
JP3579603B2 (en) 2004-10-20
DE19753055B4 (en) 2005-09-15
DE19753055A1 (en) 1999-06-10
CN1224767A (en) 1999-08-04

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