GB2229859A - Roll surface cutting method - Google Patents
Roll surface cutting methodInfo
- Publication number
- GB2229859A GB2229859A GB8928848A GB8928848A GB2229859A GB 2229859 A GB2229859 A GB 2229859A GB 8928848 A GB8928848 A GB 8928848A GB 8928848 A GB8928848 A GB 8928848A GB 2229859 A GB2229859 A GB 2229859A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cutting method
- roll surface
- surface cutting
- strength
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B5/00—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
- B23B5/08—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor for turning axles, bars, rods, tubes, rolls, i.e. shaft-turning lathes, roll lathes; Centreless turning
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
A bonding wire (3) for connecting an electrode of a semiconductor element to an external lead (2), which comprises 1 to less than 5 wt % of copper and the balance of gold and unavoidable impurities, and which has excellent break strength and bonding strength to provide reliable connection even in a thickness as small as about 10 mu m in diameter.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10958788 | 1988-05-02 | ||
PCT/JP1989/000463 WO1989011161A1 (en) | 1988-05-02 | 1989-05-02 | Bonding wire for semiconductor elements |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8928848D0 GB8928848D0 (en) | 1990-06-13 |
GB2229859A true GB2229859A (en) | 1990-10-03 |
GB2229859B GB2229859B (en) | 1993-01-06 |
Family
ID=14514045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8928848A Expired - Fee Related GB2229859B (en) | 1988-05-02 | 1989-12-21 | Bonding wire for semiconductor elememt |
Country Status (5)
Country | Link |
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JP (1) | JP2745065B2 (en) |
KR (1) | KR930001265B1 (en) |
DE (1) | DE3990432C1 (en) |
GB (1) | GB2229859B (en) |
WO (1) | WO1989011161A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10233408A (en) * | 1997-02-21 | 1998-09-02 | Nec Corp | Metal junction structure and semiconductor device |
JP3426473B2 (en) * | 1997-07-01 | 2003-07-14 | 新日本製鐵株式会社 | Gold alloy wires for semiconductor devices |
DE19740004A1 (en) * | 1997-09-11 | 1998-11-19 | Siemens Ag | Bond wire for semiconductor device contact terminal |
DE19753055B4 (en) * | 1997-11-29 | 2005-09-15 | W.C. Heraeus Gmbh | Fine wire of a gold alloy, process for its preparation and its use |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55127041A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Resin-sealed semiconductor device |
JPH0221201A (en) * | 1988-08-25 | 1990-01-24 | Amada Co Ltd | Distance detector for processing machine |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3769006A (en) * | 1972-01-27 | 1973-10-30 | Gold Refining W Co | Bright cast alloy, and composition |
JPS53112060A (en) * | 1977-03-11 | 1978-09-30 | Tanaka Electronics Ind | Gold wire for bonding semiconductor |
JPS5649534A (en) * | 1979-09-28 | 1981-05-06 | Tanaka Kikinzoku Kogyo Kk | Bonding wire for semiconductor device |
JPS5676556A (en) * | 1979-11-28 | 1981-06-24 | Tanaka Denshi Kogyo Kk | Bonding gold wire for semiconductor element |
DE3153395C2 (en) * | 1981-02-12 | 1987-11-19 | W.C. Heraeus Gmbh, 6450 Hanau, De | Use of a very fine wire made of a copper/tin alloy |
DD201156A1 (en) * | 1981-10-02 | 1983-07-06 | Daut Hans Heiner | Precious metal alloys for micro-wire materials |
US4490504A (en) * | 1983-08-15 | 1984-12-25 | General Electric Company | Flame retardant non-dripping polycarbonate compositions |
JPS6049534A (en) * | 1983-08-26 | 1985-03-18 | 三菱電機株式会社 | Circuit breaker |
EP0288776A3 (en) * | 1987-04-28 | 1989-03-22 | Texas Instruments Incorporated | Gold alloy wire connection to copper doped aluminum semiconductor circuit interconnection bonding pad |
-
1989
- 1989-05-01 JP JP1112579A patent/JP2745065B2/en not_active Expired - Fee Related
- 1989-05-02 WO PCT/JP1989/000463 patent/WO1989011161A1/en active Application Filing
- 1989-05-02 KR KR1019890702503A patent/KR930001265B1/en not_active IP Right Cessation
- 1989-05-02 DE DE3990432A patent/DE3990432C1/en not_active Expired - Fee Related
- 1989-12-21 GB GB8928848A patent/GB2229859B/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55127041A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Resin-sealed semiconductor device |
JPH0221201A (en) * | 1988-08-25 | 1990-01-24 | Amada Co Ltd | Distance detector for processing machine |
Also Published As
Publication number | Publication date |
---|---|
KR900700217A (en) | 1990-08-11 |
GB8928848D0 (en) | 1990-06-13 |
KR930001265B1 (en) | 1993-02-22 |
JPH02119148A (en) | 1990-05-07 |
JP2745065B2 (en) | 1998-04-28 |
GB2229859B (en) | 1993-01-06 |
DE3990432C1 (en) | 1994-06-23 |
WO1989011161A1 (en) | 1989-11-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20050502 |