GB2229859A - Roll surface cutting method - Google Patents

Roll surface cutting method

Info

Publication number
GB2229859A
GB2229859A GB8928848A GB8928848A GB2229859A GB 2229859 A GB2229859 A GB 2229859A GB 8928848 A GB8928848 A GB 8928848A GB 8928848 A GB8928848 A GB 8928848A GB 2229859 A GB2229859 A GB 2229859A
Authority
GB
United Kingdom
Prior art keywords
cutting method
roll surface
surface cutting
strength
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8928848A
Other versions
GB8928848D0 (en
GB2229859B (en
Inventor
Yasuhide Ono
Yoshio Ozeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Publication of GB8928848D0 publication Critical patent/GB8928848D0/en
Publication of GB2229859A publication Critical patent/GB2229859A/en
Application granted granted Critical
Publication of GB2229859B publication Critical patent/GB2229859B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B5/00Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • B23B5/08Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor for turning axles, bars, rods, tubes, rolls, i.e. shaft-turning lathes, roll lathes; Centreless turning
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/02Alloys based on gold
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    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
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  • Manufacturing & Machinery (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

A bonding wire (3) for connecting an electrode of a semiconductor element to an external lead (2), which comprises 1 to less than 5 wt % of copper and the balance of gold and unavoidable impurities, and which has excellent break strength and bonding strength to provide reliable connection even in a thickness as small as about 10 mu m in diameter.
GB8928848A 1988-05-02 1989-12-21 Bonding wire for semiconductor elememt Expired - Fee Related GB2229859B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10958788 1988-05-02
PCT/JP1989/000463 WO1989011161A1 (en) 1988-05-02 1989-05-02 Bonding wire for semiconductor elements

Publications (3)

Publication Number Publication Date
GB8928848D0 GB8928848D0 (en) 1990-06-13
GB2229859A true GB2229859A (en) 1990-10-03
GB2229859B GB2229859B (en) 1993-01-06

Family

ID=14514045

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8928848A Expired - Fee Related GB2229859B (en) 1988-05-02 1989-12-21 Bonding wire for semiconductor elememt

Country Status (5)

Country Link
JP (1) JP2745065B2 (en)
KR (1) KR930001265B1 (en)
DE (1) DE3990432C1 (en)
GB (1) GB2229859B (en)
WO (1) WO1989011161A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233408A (en) * 1997-02-21 1998-09-02 Nec Corp Metal junction structure and semiconductor device
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Also Published As

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KR900700217A (en) 1990-08-11
GB8928848D0 (en) 1990-06-13
KR930001265B1 (en) 1993-02-22
JPH02119148A (en) 1990-05-07
JP2745065B2 (en) 1998-04-28
GB2229859B (en) 1993-01-06
DE3990432C1 (en) 1994-06-23
WO1989011161A1 (en) 1989-11-16

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