JPS5649534A - Bonding wire for semiconductor device - Google Patents
Bonding wire for semiconductor deviceInfo
- Publication number
- JPS5649534A JPS5649534A JP12494879A JP12494879A JPS5649534A JP S5649534 A JPS5649534 A JP S5649534A JP 12494879 A JP12494879 A JP 12494879A JP 12494879 A JP12494879 A JP 12494879A JP S5649534 A JPS5649534 A JP S5649534A
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- purity
- bonding
- strength
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To improve the mechanical strength and bonding strength of an Si chip to a pad by a constitution wherein a bonding wire contains Au and Pt with the predetermined purity and composition and a very small amount of at least one of Be, Ca and Ge with a predetermined content. CONSTITUTION:A bonding wire for a semiconductor device is formed by adding 1-30W/O of high purity Pt with the purity not less than 99.9W/O to high purity Au with the purity not less than 99.99W/O. Then, at least one of Be, Ca and Ge is added to thus obtained Au and Pt by 0.0003-0.05W/O in total amount, as required. By so doing, it becomes possible to obtain the bonding wire superior in the mechanical strength, particularly in the fructure strength at the bonding time, and increase the tensile strength in the state after an Si chip is bonded to a pad. Thus, a diameter of the bonding wire can be reduced to several tens mum to form a very fine wire and the size of the pad can be also reduced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12494879A JPS5649534A (en) | 1979-09-28 | 1979-09-28 | Bonding wire for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12494879A JPS5649534A (en) | 1979-09-28 | 1979-09-28 | Bonding wire for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5649534A true JPS5649534A (en) | 1981-05-06 |
JPS6223454B2 JPS6223454B2 (en) | 1987-05-22 |
Family
ID=14898159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12494879A Granted JPS5649534A (en) | 1979-09-28 | 1979-09-28 | Bonding wire for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5649534A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989011161A1 (en) * | 1988-05-02 | 1989-11-16 | Nippon Steel Corporation | Bonding wire for semiconductor elements |
US4885135A (en) * | 1981-12-04 | 1989-12-05 | Mitsubishi Kinzoku Kabushiki Kaisha | Fine gold alloy wire for bonding of a semi-conductor device |
JPH03259044A (en) * | 1990-03-06 | 1991-11-19 | Fuji Oil Co Ltd | Production of soybean protein film |
AT407830B (en) * | 1999-09-10 | 2001-06-25 | Degussa Huels Cee Gmbh | HIGH GOLDEN YELLOW DENTAL ALLOY |
SG87207A1 (en) * | 2000-06-19 | 2002-03-19 | Tanaka Electronics Ind | Gold wire for semiconductor element bonding |
JP5582484B1 (en) * | 2013-12-20 | 2014-09-03 | 田中貴金属工業株式会社 | Medical alloy and method for producing the same |
-
1979
- 1979-09-28 JP JP12494879A patent/JPS5649534A/en active Granted
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4885135A (en) * | 1981-12-04 | 1989-12-05 | Mitsubishi Kinzoku Kabushiki Kaisha | Fine gold alloy wire for bonding of a semi-conductor device |
US5071619A (en) * | 1981-12-04 | 1991-12-10 | Mitsubishi Kinzoku Kabushiki Kaisha | Fine gold alloy wire for bonding of a semiconductor device |
WO1989011161A1 (en) * | 1988-05-02 | 1989-11-16 | Nippon Steel Corporation | Bonding wire for semiconductor elements |
JPH02119148A (en) * | 1988-05-02 | 1990-05-07 | Nippon Steel Corp | Bonding wire for semiconductor element |
JPH03259044A (en) * | 1990-03-06 | 1991-11-19 | Fuji Oil Co Ltd | Production of soybean protein film |
AT407830B (en) * | 1999-09-10 | 2001-06-25 | Degussa Huels Cee Gmbh | HIGH GOLDEN YELLOW DENTAL ALLOY |
SG87207A1 (en) * | 2000-06-19 | 2002-03-19 | Tanaka Electronics Ind | Gold wire for semiconductor element bonding |
JP5582484B1 (en) * | 2013-12-20 | 2014-09-03 | 田中貴金属工業株式会社 | Medical alloy and method for producing the same |
WO2015093064A1 (en) * | 2013-12-20 | 2015-06-25 | 田中貴金属工業株式会社 | Alloy for medical use, and method for producing same |
CN105917012A (en) * | 2013-12-20 | 2016-08-31 | 田中贵金属工业株式会社 | Alloy for medical use, and method for producing same |
US10883162B2 (en) | 2013-12-20 | 2021-01-05 | Tanaka Kikinzoku Kogyo K.K. | Alloy for medical use, and method for producing same |
US11345986B2 (en) | 2013-12-20 | 2022-05-31 | Tanaka Kikinzoku Kogyo K.K. | Alloy for medical use, and method for producing same |
Also Published As
Publication number | Publication date |
---|---|
JPS6223454B2 (en) | 1987-05-22 |
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