JPS57211740A - Wire bonder - Google Patents

Wire bonder

Info

Publication number
JPS57211740A
JPS57211740A JP56096481A JP9648181A JPS57211740A JP S57211740 A JPS57211740 A JP S57211740A JP 56096481 A JP56096481 A JP 56096481A JP 9648181 A JP9648181 A JP 9648181A JP S57211740 A JPS57211740 A JP S57211740A
Authority
JP
Japan
Prior art keywords
arm
high speed
linking system
linking
movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56096481A
Other languages
Japanese (ja)
Inventor
Kenji Watanabe
Isamu Yamazaki
Yasushi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP56096481A priority Critical patent/JPS57211740A/en
Publication of JPS57211740A publication Critical patent/JPS57211740A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To perform high speed wire bonding highly accurately by constituting a linking mechanism which operates the up and down movement of a bonding arm attached to an XY table by a main linking system and a secondary linking system. CONSTITUTION:The bonding arm 13 having a capillary 16 at one end is attached to the XY table 11 so that it is moved up and down freely. The power from an up and down driving mechanism 18, which comprises a motor 19, a belt 20, a timing pulley 21, and the like, is transmitted by linking mechanism 24, which is constituted by the main linking system 25 comprising a main lever 27 and a amin rod 31 and the secondary linking system 26 comprising secondary levers 35 and 36 and a secondary rod 38. Thus the arm 13 is moved up and down. In this constitution, the high speed movement of the XY table can be made possible, the always matched, accurate movement of the arm can be performed, and the high speed wire bonding can be performed highly accurately.
JP56096481A 1981-06-24 1981-06-24 Wire bonder Pending JPS57211740A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56096481A JPS57211740A (en) 1981-06-24 1981-06-24 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56096481A JPS57211740A (en) 1981-06-24 1981-06-24 Wire bonder

Publications (1)

Publication Number Publication Date
JPS57211740A true JPS57211740A (en) 1982-12-25

Family

ID=14166244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56096481A Pending JPS57211740A (en) 1981-06-24 1981-06-24 Wire bonder

Country Status (1)

Country Link
JP (1) JPS57211740A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060843A (en) * 1989-06-07 1991-10-29 Nec Corporation Process of forming bump on electrode of semiconductor chip and apparatus used therefor
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060843A (en) * 1989-06-07 1991-10-29 Nec Corporation Process of forming bump on electrode of semiconductor chip and apparatus used therefor
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

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