JPS5333570A - Semiconductor material cutting method - Google Patents
Semiconductor material cutting methodInfo
- Publication number
- JPS5333570A JPS5333570A JP10777676A JP10777676A JPS5333570A JP S5333570 A JPS5333570 A JP S5333570A JP 10777676 A JP10777676 A JP 10777676A JP 10777676 A JP10777676 A JP 10777676A JP S5333570 A JPS5333570 A JP S5333570A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor material
- cutting method
- material cutting
- film
- specimen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
PURPOSE: To prevent the degradation in strength of semiconductor chips by bonding an evaporated film of Al, gold, silver and a film of petroleum base wax to an auxiliary material to make a specimen and cutting this.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10777676A JPS5333570A (en) | 1976-09-10 | 1976-09-10 | Semiconductor material cutting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10777676A JPS5333570A (en) | 1976-09-10 | 1976-09-10 | Semiconductor material cutting method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5333570A true JPS5333570A (en) | 1978-03-29 |
JPS5444633B2 JPS5444633B2 (en) | 1979-12-27 |
Family
ID=14467717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10777676A Granted JPS5333570A (en) | 1976-09-10 | 1976-09-10 | Semiconductor material cutting method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5333570A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57197118A (en) * | 1981-05-30 | 1982-12-03 | Dainippon Printing Co Ltd | Method of cutting color separating filter |
-
1976
- 1976-09-10 JP JP10777676A patent/JPS5333570A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57197118A (en) * | 1981-05-30 | 1982-12-03 | Dainippon Printing Co Ltd | Method of cutting color separating filter |
JPH0379681B2 (en) * | 1981-05-30 | 1991-12-19 | Dainippon Printing Co Ltd |
Also Published As
Publication number | Publication date |
---|---|
JPS5444633B2 (en) | 1979-12-27 |
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