JPS5333570A - Semiconductor material cutting method - Google Patents

Semiconductor material cutting method

Info

Publication number
JPS5333570A
JPS5333570A JP10777676A JP10777676A JPS5333570A JP S5333570 A JPS5333570 A JP S5333570A JP 10777676 A JP10777676 A JP 10777676A JP 10777676 A JP10777676 A JP 10777676A JP S5333570 A JPS5333570 A JP S5333570A
Authority
JP
Japan
Prior art keywords
semiconductor material
cutting method
material cutting
film
specimen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10777676A
Other languages
Japanese (ja)
Other versions
JPS5444633B2 (en
Inventor
Yuji Ochiai
Tsuneo Uga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10777676A priority Critical patent/JPS5333570A/en
Publication of JPS5333570A publication Critical patent/JPS5333570A/en
Publication of JPS5444633B2 publication Critical patent/JPS5444633B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

PURPOSE: To prevent the degradation in strength of semiconductor chips by bonding an evaporated film of Al, gold, silver and a film of petroleum base wax to an auxiliary material to make a specimen and cutting this.
COPYRIGHT: (C)1978,JPO&Japio
JP10777676A 1976-09-10 1976-09-10 Semiconductor material cutting method Granted JPS5333570A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10777676A JPS5333570A (en) 1976-09-10 1976-09-10 Semiconductor material cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10777676A JPS5333570A (en) 1976-09-10 1976-09-10 Semiconductor material cutting method

Publications (2)

Publication Number Publication Date
JPS5333570A true JPS5333570A (en) 1978-03-29
JPS5444633B2 JPS5444633B2 (en) 1979-12-27

Family

ID=14467717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10777676A Granted JPS5333570A (en) 1976-09-10 1976-09-10 Semiconductor material cutting method

Country Status (1)

Country Link
JP (1) JPS5333570A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57197118A (en) * 1981-05-30 1982-12-03 Dainippon Printing Co Ltd Method of cutting color separating filter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57197118A (en) * 1981-05-30 1982-12-03 Dainippon Printing Co Ltd Method of cutting color separating filter
JPH0379681B2 (en) * 1981-05-30 1991-12-19 Dainippon Printing Co Ltd

Also Published As

Publication number Publication date
JPS5444633B2 (en) 1979-12-27

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