JPS56122140A - Gold wire for bonding semiconductor element and semiconductor element - Google Patents
Gold wire for bonding semiconductor element and semiconductor elementInfo
- Publication number
- JPS56122140A JPS56122140A JP2547380A JP2547380A JPS56122140A JP S56122140 A JPS56122140 A JP S56122140A JP 2547380 A JP2547380 A JP 2547380A JP 2547380 A JP2547380 A JP 2547380A JP S56122140 A JPS56122140 A JP S56122140A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- gold wire
- bonding
- gold
- 5ppm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
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- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
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- H01L2924/0102—Calcium [Ca]
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- H01L2924/01022—Titanium [Ti]
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- H01L2924/01024—Chromium [Cr]
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- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
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- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H01L2924/01028—Nickel [Ni]
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- H01L2924/01029—Copper [Cu]
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- H01L2924/01046—Palladium [Pd]
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- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01083—Bismuth [Bi]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To increase the bonding strength by reducing the thermal effect in a semiconductor element by employing alloy containing predetermined amounts of silver, lead, calcium, iron, magnesium and a residue of gold as a gold wire for bonding by pressing a silicon chip electrode of the element. CONSTITUTION:Alloy of gold wire for bonding by pressing to a silicon chip electrode of a semiconductor element contains 2-8wtppm of silver, 35-150ppm of lead, 1-8ppm of calcium, 0.5-5ppm of iron and 0.5-5ppm of magnesium, and a residue of gold. It is preferred that the total amount of the first element group is contained in a range of 39-248ppm. The balance of the gold wire can be retained by containing the total content of 20ppm of Ti, Co, Si, Sn, Bi, Mn, Ni, Cr, Co, Al, and Pd or less. Thus, the gold wire having a thin junction layer after bonded and high bonding strength can be obtained, and excellent semiconductor characteristics can also be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2547380A JPS56122140A (en) | 1980-02-29 | 1980-02-29 | Gold wire for bonding semiconductor element and semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2547380A JPS56122140A (en) | 1980-02-29 | 1980-02-29 | Gold wire for bonding semiconductor element and semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56122140A true JPS56122140A (en) | 1981-09-25 |
JPS6258535B2 JPS6258535B2 (en) | 1987-12-07 |
Family
ID=12167001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2547380A Granted JPS56122140A (en) | 1980-02-29 | 1980-02-29 | Gold wire for bonding semiconductor element and semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56122140A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2618945A1 (en) * | 1986-05-26 | 1989-02-03 | Shoei Chemical Ind Co | LINK FOR USE IN A SEMICONDUCTOR DEVICE |
US4938923A (en) * | 1989-04-28 | 1990-07-03 | Takeshi Kujiraoka | Gold wire for the bonding of a semiconductor device |
CN106298721A (en) * | 2016-08-19 | 2017-01-04 | 广东佳博电子科技有限公司 | A kind of bonding gold wire and preparation method thereof |
-
1980
- 1980-02-29 JP JP2547380A patent/JPS56122140A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2618945A1 (en) * | 1986-05-26 | 1989-02-03 | Shoei Chemical Ind Co | LINK FOR USE IN A SEMICONDUCTOR DEVICE |
US4938923A (en) * | 1989-04-28 | 1990-07-03 | Takeshi Kujiraoka | Gold wire for the bonding of a semiconductor device |
CN106298721A (en) * | 2016-08-19 | 2017-01-04 | 广东佳博电子科技有限公司 | A kind of bonding gold wire and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS6258535B2 (en) | 1987-12-07 |
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