JPS5688329A - Gold wire for bonding semiconductor element and semiconductor element - Google Patents
Gold wire for bonding semiconductor element and semiconductor elementInfo
- Publication number
- JPS5688329A JPS5688329A JP16614779A JP16614779A JPS5688329A JP S5688329 A JPS5688329 A JP S5688329A JP 16614779 A JP16614779 A JP 16614779A JP 16614779 A JP16614779 A JP 16614779A JP S5688329 A JPS5688329 A JP S5688329A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- gold wire
- ppm
- semiconductor element
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/45644—Gold (Au) as principal constituent
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
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- H01L2924/01004—Beryllium [Be]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01083—Bismuth [Bi]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Abstract
PURPOSE:To obtain gold wire whose bonding property is excellent by the inclusion of specified amounts of Ag, Be, Ca, Fe, and Mg, in addition to Au. CONSTITUTION:By the inclusion of 2-80ppm of Ag, 0.5-30ppm of Be, 1-20ppm of Ca, 0.5-50ppm of Fe, and 0.5-50ppm of Mg in weight ppm indications, in addition to Au, the elements cooperate together in said composition range, the balance in the Au wire itself is maintained, and the excellent bonding property is indicated. If the total amount of the added elements is made to be 4.5-230wt. ppm, the secular softening of the gold wire and unstable gold ball configuration are not generated. Although Ti, Cu, Si, Sn, Bi, Mn, Pb, Ni, Cr, Co, Al, and Pd are readily mixed naturally or in the manufacturing process, the balance in the gold wire itself is not hampered if the maximum weight ppm is less than 30. However, if more than 5wt. ppm of Cd, Zn, Sb, As, B, and the like is mixed, the characteristics of the gold wire tend to decrease. In this constitution, can be obtained the bonding wire of the Au alloy which is hard to be subjected to the thermal effect, and has the thin bonding layer after the bonding and the large bonding strength.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16614779A JPS5688329A (en) | 1979-12-19 | 1979-12-19 | Gold wire for bonding semiconductor element and semiconductor element |
US06/160,302 US4330329A (en) | 1979-11-28 | 1980-06-17 | Gold bonding wire for semiconductor elements and the semiconductor element |
DE3023623A DE3023623C2 (en) | 1979-11-28 | 1980-06-24 | Gold connecting wire for semiconductor elements and its use for connection points of a silicon chip electrode in semiconductor elements |
GB8021205A GB2063913B (en) | 1979-11-28 | 1980-06-27 | Gold wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16614779A JPS5688329A (en) | 1979-12-19 | 1979-12-19 | Gold wire for bonding semiconductor element and semiconductor element |
Publications (2)
Publication Number | Publication Date |
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JPS5688329A true JPS5688329A (en) | 1981-07-17 |
JPS631749B2 JPS631749B2 (en) | 1988-01-13 |
Family
ID=15825917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16614779A Granted JPS5688329A (en) | 1979-11-28 | 1979-12-19 | Gold wire for bonding semiconductor element and semiconductor element |
Country Status (1)
Country | Link |
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JP (1) | JPS5688329A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5298219A (en) * | 1990-06-04 | 1994-03-29 | Tanaka Denshi Kogyo Kabushiki Kaisha | High purity gold bonding wire for semiconductor device |
US6123786A (en) * | 1993-09-06 | 2000-09-26 | Mitsubishi Materials Corporation | Gold materials for accessories hardened with minor alloying components |
US6991854B2 (en) * | 2003-04-14 | 2006-01-31 | Mk Electron Co., Ltd. | Gold alloy bonding wire for semiconductor device |
CN112226642A (en) * | 2020-09-18 | 2021-01-15 | 国金黄金股份有限公司 | Noble metal alloy material, preparation method thereof and gold container |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
-
1979
- 1979-12-19 JP JP16614779A patent/JPS5688329A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5298219A (en) * | 1990-06-04 | 1994-03-29 | Tanaka Denshi Kogyo Kabushiki Kaisha | High purity gold bonding wire for semiconductor device |
US5538685A (en) * | 1990-06-04 | 1996-07-23 | Tanaka Denshi Kogyo Kabushiki Kaisha | Palladium bonding wire for semiconductor device |
US6123786A (en) * | 1993-09-06 | 2000-09-26 | Mitsubishi Materials Corporation | Gold materials for accessories hardened with minor alloying components |
US6991854B2 (en) * | 2003-04-14 | 2006-01-31 | Mk Electron Co., Ltd. | Gold alloy bonding wire for semiconductor device |
CN112226642A (en) * | 2020-09-18 | 2021-01-15 | 国金黄金股份有限公司 | Noble metal alloy material, preparation method thereof and gold container |
CN112226642B (en) * | 2020-09-18 | 2022-03-11 | 国金黄金股份有限公司 | Noble metal alloy material, preparation method thereof and gold container |
Also Published As
Publication number | Publication date |
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JPS631749B2 (en) | 1988-01-13 |
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