JPS63109130A - Copper alloy for electronic equipment - Google Patents

Copper alloy for electronic equipment

Info

Publication number
JPS63109130A
JPS63109130A JP61252644A JP25264486A JPS63109130A JP S63109130 A JPS63109130 A JP S63109130A JP 61252644 A JP61252644 A JP 61252644A JP 25264486 A JP25264486 A JP 25264486A JP S63109130 A JPS63109130 A JP S63109130A
Authority
JP
Japan
Prior art keywords
copper alloy
electronic equipment
20ppm
cr
mg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61252644A
Other versions
JPH0784631B2 (en
JPS63109130K1 (en
Inventor
Masato Asai
Yoshimasa Oyama
Shoji Shiga
Shigeo Shinozaki
Original Assignee
Furukawa Electric Co Ltd:The
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd:The filed Critical Furukawa Electric Co Ltd:The
Priority to JP61252644A priority Critical patent/JPH0784631B2/en
Publication of JPS63109130A publication Critical patent/JPS63109130A/en
Publication of JPS63109130K1 publication Critical patent/JPS63109130K1/ja
Publication of JPH0784631B2 publication Critical patent/JPH0784631B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a copper alloy for electronic equipment excellent in strength, electric conductivity, and heat resistance and having superior plating suitability, moldability, and bonding characteristics, by specifying a composition consisting of elements such as Mg, Cr, B, etc., and Cu and also by properly limiting O2 content.
CONSTITUTION: The copper alloy for electronic equipment has a composition which contains, by weight, 0.0005W0.3.% Mg and 0.01W1.0% Cr and further contains 0.003W0.8%, in total, of at least one or more kinds selected from the group consisting of 0.0005W0.3% each of B, Ca, Y, Re, V, Hf, Ga, Ge, In, Ag, Zr, Sb, Bi, Te, and Nb, 0.001W0.8% each of Ti, Mn, Zn, Sn, Si, Ni, Co, and Al, and 0.003W0.8% Fe and in which O2 is limited to ≤20ppm and further, preferably, P, S, and the size of a precipitate are limited to ≤50ppm, ≤20ppm, and ≤10μm, respectively, and which has the balance Cu with inevitable impurities. This copper alloy has various excellent characteristics suitable for semiconductor lead frames, etc.
COPYRIGHT: (C)1988,JPO&Japio
JP61252644A 1986-10-23 1986-10-23 Copper alloy for electronic devices Expired - Fee Related JPH0784631B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61252644A JPH0784631B2 (en) 1986-10-23 1986-10-23 Copper alloy for electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61252644A JPH0784631B2 (en) 1986-10-23 1986-10-23 Copper alloy for electronic devices

Publications (3)

Publication Number Publication Date
JPS63109130A true JPS63109130A (en) 1988-05-13
JPS63109130K1 JPS63109130K1 (en) 1988-05-13
JPH0784631B2 JPH0784631B2 (en) 1995-09-13

Family

ID=17240219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61252644A Expired - Fee Related JPH0784631B2 (en) 1986-10-23 1986-10-23 Copper alloy for electronic devices

Country Status (1)

Country Link
JP (1) JPH0784631B2 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63109132A (en) * 1986-10-28 1988-05-13 Furukawa Electric Co Ltd:The High-strength conductive copper alloy and its production
JPH01306534A (en) * 1988-05-31 1989-12-11 Yazaki Corp Copper alloy conductor for thin wire
KR100631041B1 (en) 2005-03-04 2006-10-04 주식회사 풍산 free cutting brass alloy having an improved of machinability and workability
CN102181744A (en) * 2011-04-27 2011-09-14 东莞市嘉盛铜材有限公司 High-performance beryllium-copper alloy and preparation method thereof
EP2540847A2 (en) * 2010-02-24 2013-01-02 Poongsan Corporation High-strength and highly conductive copper alloy, and method for manufacturing same
CN102890976A (en) * 2011-07-21 2013-01-23 日立电线株式会社 Soft dilute copper alloy wire, soft dilute copper alloy plate and soft dilute copper alloy stranded wire
JP2013040384A (en) * 2011-08-17 2013-02-28 Hitachi Cable Ltd Wiring material and plate material using soft dilute copper alloy
CN104004938A (en) * 2014-05-24 2014-08-27 安徽永杰铜业有限公司 Red copper and casting method thereof
US20140284211A1 (en) * 2012-01-23 2014-09-25 Jx Nippon Mining & Metals Corporation High Purity Copper-Manganese Alloy Sputtering Target
US20140318827A1 (en) * 2010-10-20 2014-10-30 Hitachi Metals, Ltd. Audio/Video Cable
CN105132734A (en) * 2015-07-13 2015-12-09 南通长江电器实业有限公司 High-strength and high-electric-conductivity copper alloy material
US9809872B2 (en) 2009-04-17 2017-11-07 Hitachi Metals, Ltd. Dilute copper alloy material, dilute copper alloy wire, dilute copper alloy twisted wire and cable using the same, coaxial cable and composite cable, and method of manufacturing dilute copper alloy material and dilute copper alloy wire
CN110747365A (en) * 2019-11-14 2020-02-04 中南大学 High-plasticity high-strength high-conductivity CuCrZr copper alloy and preparation method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1327017C (en) * 2004-07-22 2007-07-18 同济大学 Novel elastic conductive alloy and its preparing method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4871323A (en) * 1971-12-28 1973-09-27
JPS58123862A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Manufacture of copper alloy for lead material for semiconductor apparatus
JPS59193233A (en) * 1983-04-15 1984-11-01 Toshiba Corp Copper alloy
JPS6045698A (en) * 1983-08-19 1985-03-12 Rei Tech Inc Papermaking method for performing internal sizing of amphoteric starch
JPS60194030A (en) * 1984-03-15 1985-10-02 Mitsubishi Metal Corp Copper alloy for lead material for semiconductor device
JPS60221541A (en) * 1984-04-07 1985-11-06 Kobe Steel Ltd Copper alloy superior in hot workability
JPS60245752A (en) * 1984-05-22 1985-12-05 Nippon Mining Co Ltd High strength copper alloy having high electric conductivity

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4871323A (en) * 1971-12-28 1973-09-27
JPS58123862A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Manufacture of copper alloy for lead material for semiconductor apparatus
JPS59193233A (en) * 1983-04-15 1984-11-01 Toshiba Corp Copper alloy
JPS6045698A (en) * 1983-08-19 1985-03-12 Rei Tech Inc Papermaking method for performing internal sizing of amphoteric starch
JPS60194030A (en) * 1984-03-15 1985-10-02 Mitsubishi Metal Corp Copper alloy for lead material for semiconductor device
JPS60221541A (en) * 1984-04-07 1985-11-06 Kobe Steel Ltd Copper alloy superior in hot workability
JPS60245752A (en) * 1984-05-22 1985-12-05 Nippon Mining Co Ltd High strength copper alloy having high electric conductivity

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63109132A (en) * 1986-10-28 1988-05-13 Furukawa Electric Co Ltd:The High-strength conductive copper alloy and its production
JPH0575812B2 (en) * 1986-10-28 1993-10-21 Furukawa Electric Co Ltd
JPH01306534A (en) * 1988-05-31 1989-12-11 Yazaki Corp Copper alloy conductor for thin wire
KR100631041B1 (en) 2005-03-04 2006-10-04 주식회사 풍산 free cutting brass alloy having an improved of machinability and workability
US9809872B2 (en) 2009-04-17 2017-11-07 Hitachi Metals, Ltd. Dilute copper alloy material, dilute copper alloy wire, dilute copper alloy twisted wire and cable using the same, coaxial cable and composite cable, and method of manufacturing dilute copper alloy material and dilute copper alloy wire
EP2540847A2 (en) * 2010-02-24 2013-01-02 Poongsan Corporation High-strength and highly conductive copper alloy, and method for manufacturing same
EP2540847A4 (en) * 2010-02-24 2014-08-13 Poongsan Corp High-strength and highly conductive copper alloy, and method for manufacturing same
US9293231B2 (en) * 2010-10-20 2016-03-22 Hitachi Metals, Ltd. Audio/Video cable
US20140318827A1 (en) * 2010-10-20 2014-10-30 Hitachi Metals, Ltd. Audio/Video Cable
CN102181744A (en) * 2011-04-27 2011-09-14 东莞市嘉盛铜材有限公司 High-performance beryllium-copper alloy and preparation method thereof
JP2013023736A (en) * 2011-07-21 2013-02-04 Hitachi Cable Ltd Soft dilute copper alloy wire, soft dilute copper alloy sheet and soft dilute copper alloy twisted wire
CN102890976B (en) * 2011-07-21 2016-09-07 日立金属株式会社 Soft dilute copper alloy line, soft dilute copper alloy plate and soft dilute copper alloy are twisted thread
CN102890976A (en) * 2011-07-21 2013-01-23 日立电线株式会社 Soft dilute copper alloy wire, soft dilute copper alloy plate and soft dilute copper alloy stranded wire
JP2013040384A (en) * 2011-08-17 2013-02-28 Hitachi Cable Ltd Wiring material and plate material using soft dilute copper alloy
US9165750B2 (en) * 2012-01-23 2015-10-20 Jx Nippon Mining & Metals Corporation High purity copper—manganese alloy sputtering target
US20140284211A1 (en) * 2012-01-23 2014-09-25 Jx Nippon Mining & Metals Corporation High Purity Copper-Manganese Alloy Sputtering Target
CN104004938A (en) * 2014-05-24 2014-08-27 安徽永杰铜业有限公司 Red copper and casting method thereof
CN105132734A (en) * 2015-07-13 2015-12-09 南通长江电器实业有限公司 High-strength and high-electric-conductivity copper alloy material
CN110747365A (en) * 2019-11-14 2020-02-04 中南大学 High-plasticity high-strength high-conductivity CuCrZr copper alloy and preparation method thereof

Also Published As

Publication number Publication date
JPS63109130K1 (en) 1988-05-13
JPH0784631B2 (en) 1995-09-13

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Legal Events

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