JPS5696844A - Semiconductor element - Google Patents
Semiconductor elementInfo
- Publication number
- JPS5696844A JPS5696844A JP17173279A JP17173279A JPS5696844A JP S5696844 A JPS5696844 A JP S5696844A JP 17173279 A JP17173279 A JP 17173279A JP 17173279 A JP17173279 A JP 17173279A JP S5696844 A JPS5696844 A JP S5696844A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- gold wire
- wire
- bonding
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45644—Gold (Au) as principal constituent
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01029—Copper [Cu]
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- H01L2924/01046—Palladium [Pd]
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- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/01083—Bismuth [Bi]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To obtain the high junction strength of the semiconductor element by containing infinitesimal amount of metal specified in the composition and the content in a glod wire when a fine gold wire is bonded to a silicon chip electrode. CONSTITUTION:The composition of the gold wire to be bonded to the silicon chip electrode is specified as below. That is, the bonding fine gold wire contains 2- 80wtppm of silver, 5-80wtppm of germanium, 1-20wtppm of calcium, 0.5- 10wtppm of iron, 0.5-30wtppm of magnesium and the residu of the gold. One or more of titanium, copper, silicon, tin, bismuth, manganese, lead, nickel, chromiun, cobalt, aluminum and palladium are contained in the gold in such a manner that the total content is less than 30wtppm. Or other impurity elements except these elements are contained less than 5wtppm of the total content. Thus, the gold wire wherein the tensile strength, high temperature strength, gold ball shape, bonding strength or the like can be set at an optimum in the bonding of gold wire is obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17173279A JPS5696844A (en) | 1979-12-29 | 1979-12-29 | Semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17173279A JPS5696844A (en) | 1979-12-29 | 1979-12-29 | Semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5696844A true JPS5696844A (en) | 1981-08-05 |
JPS631750B2 JPS631750B2 (en) | 1988-01-13 |
Family
ID=15928645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17173279A Granted JPS5696844A (en) | 1979-12-29 | 1979-12-29 | Semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5696844A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4938923A (en) * | 1989-04-28 | 1990-07-03 | Takeshi Kujiraoka | Gold wire for the bonding of a semiconductor device |
US5384089A (en) * | 1994-05-02 | 1995-01-24 | Diamond; Lawrence H. | Yellow karat gold casting alloys |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0528216Y2 (en) * | 1989-11-20 | 1993-07-20 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
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1979
- 1979-12-29 JP JP17173279A patent/JPS5696844A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4938923A (en) * | 1989-04-28 | 1990-07-03 | Takeshi Kujiraoka | Gold wire for the bonding of a semiconductor device |
US5384089A (en) * | 1994-05-02 | 1995-01-24 | Diamond; Lawrence H. | Yellow karat gold casting alloys |
Also Published As
Publication number | Publication date |
---|---|
JPS631750B2 (en) | 1988-01-13 |
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