JPS5741339A - Copper alloy for lead frame material of semiconductor element - Google Patents

Copper alloy for lead frame material of semiconductor element

Info

Publication number
JPS5741339A
JPS5741339A JP11608980A JP11608980A JPS5741339A JP S5741339 A JPS5741339 A JP S5741339A JP 11608980 A JP11608980 A JP 11608980A JP 11608980 A JP11608980 A JP 11608980A JP S5741339 A JPS5741339 A JP S5741339A
Authority
JP
Japan
Prior art keywords
alloy
semiconductor element
lead frame
frame material
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11608980A
Other languages
Japanese (ja)
Other versions
JPS639008B2 (en
Inventor
Ichiro Kawakatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Douwa Kogyo Kk
Dowa Holdings Co Ltd
Original Assignee
Douwa Kogyo Kk
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Douwa Kogyo Kk, Dowa Mining Co Ltd filed Critical Douwa Kogyo Kk
Priority to JP11608980A priority Critical patent/JPS5741339A/en
Publication of JPS5741339A publication Critical patent/JPS5741339A/en
Publication of JPS639008B2 publication Critical patent/JPS639008B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To enhance the heat resistance and solderability without deteriorating heat and electric conductivities peculiar to Cu by properly blending Cu with Ni-B, Sn, Si and P.
CONSTITUTION: This Cu alloy for the lead frame material of a semiconductor element consists of an Ni-B alloy contg. 9W12% B in Ni in an amount of making the B content 0.005W0.02%, 0.05W0.2% Sn and the balance Cu with inevitable impurities. To the Cu alloy may be added 0.05W0.1% Si or 0.05W0.1% P. The reason why B is added as the Ni-B alloy is that B is slightly soluble in Cu and is not alloyed uniformly. When B is added as the Ni-B alloy, it is readily soluble in Cu to prepare a solid solution and is alloyed uniformly.
COPYRIGHT: (C)1982,JPO&Japio
JP11608980A 1980-08-23 1980-08-23 Copper alloy for lead frame material of semiconductor element Granted JPS5741339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11608980A JPS5741339A (en) 1980-08-23 1980-08-23 Copper alloy for lead frame material of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11608980A JPS5741339A (en) 1980-08-23 1980-08-23 Copper alloy for lead frame material of semiconductor element

Publications (2)

Publication Number Publication Date
JPS5741339A true JPS5741339A (en) 1982-03-08
JPS639008B2 JPS639008B2 (en) 1988-02-25

Family

ID=14678431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11608980A Granted JPS5741339A (en) 1980-08-23 1980-08-23 Copper alloy for lead frame material of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5741339A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004581A (en) * 1989-07-31 1991-04-02 Toyota Jidosha Kabushiki Kaisha Dispersion strengthened copper-base alloy for overlay

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004581A (en) * 1989-07-31 1991-04-02 Toyota Jidosha Kabushiki Kaisha Dispersion strengthened copper-base alloy for overlay

Also Published As

Publication number Publication date
JPS639008B2 (en) 1988-02-25

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