JPS5741339A - Copper alloy for lead frame material of semiconductor element - Google Patents
Copper alloy for lead frame material of semiconductor elementInfo
- Publication number
- JPS5741339A JPS5741339A JP11608980A JP11608980A JPS5741339A JP S5741339 A JPS5741339 A JP S5741339A JP 11608980 A JP11608980 A JP 11608980A JP 11608980 A JP11608980 A JP 11608980A JP S5741339 A JPS5741339 A JP S5741339A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- semiconductor element
- lead frame
- frame material
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To enhance the heat resistance and solderability without deteriorating heat and electric conductivities peculiar to Cu by properly blending Cu with Ni-B, Sn, Si and P.
CONSTITUTION: This Cu alloy for the lead frame material of a semiconductor element consists of an Ni-B alloy contg. 9W12% B in Ni in an amount of making the B content 0.005W0.02%, 0.05W0.2% Sn and the balance Cu with inevitable impurities. To the Cu alloy may be added 0.05W0.1% Si or 0.05W0.1% P. The reason why B is added as the Ni-B alloy is that B is slightly soluble in Cu and is not alloyed uniformly. When B is added as the Ni-B alloy, it is readily soluble in Cu to prepare a solid solution and is alloyed uniformly.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11608980A JPS5741339A (en) | 1980-08-23 | 1980-08-23 | Copper alloy for lead frame material of semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11608980A JPS5741339A (en) | 1980-08-23 | 1980-08-23 | Copper alloy for lead frame material of semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5741339A true JPS5741339A (en) | 1982-03-08 |
JPS639008B2 JPS639008B2 (en) | 1988-02-25 |
Family
ID=14678431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11608980A Granted JPS5741339A (en) | 1980-08-23 | 1980-08-23 | Copper alloy for lead frame material of semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5741339A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5004581A (en) * | 1989-07-31 | 1991-04-02 | Toyota Jidosha Kabushiki Kaisha | Dispersion strengthened copper-base alloy for overlay |
-
1980
- 1980-08-23 JP JP11608980A patent/JPS5741339A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5004581A (en) * | 1989-07-31 | 1991-04-02 | Toyota Jidosha Kabushiki Kaisha | Dispersion strengthened copper-base alloy for overlay |
Also Published As
Publication number | Publication date |
---|---|
JPS639008B2 (en) | 1988-02-25 |
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