JPS5562752A - Method of sealing substrate carrying special element by metallic cap - Google Patents

Method of sealing substrate carrying special element by metallic cap

Info

Publication number
JPS5562752A
JPS5562752A JP13370678A JP13370678A JPS5562752A JP S5562752 A JPS5562752 A JP S5562752A JP 13370678 A JP13370678 A JP 13370678A JP 13370678 A JP13370678 A JP 13370678A JP S5562752 A JPS5562752 A JP S5562752A
Authority
JP
Japan
Prior art keywords
solder
substrate
cap
special element
tref
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13370678A
Other languages
Japanese (ja)
Inventor
Shinya Niizaki
Hitomi Nagayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13370678A priority Critical patent/JPS5562752A/en
Publication of JPS5562752A publication Critical patent/JPS5562752A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent deterioration of sealing caused by metallic cap and improper connection of a special element by selecting solder melting point for connecting the cap to a hybrid IC substrate and reflow temperature between the reflow temperatuer of solder for connecting the substrate to the mother substrate and the melting point of the solder for connecting the special element to the substrate.
CONSTITUTION: The melting point TM of solder used for the connecting portion 15 of a lower conductor 2 to a flip chip 7, the connecting portion 16 of an upper conductor 4 for mounting a cap to a metallic cap 8, and the connecting portion 14 of a hybrid IC substrate 12 to a mother substrate 13, and their reflow temperature TREF are so selected at to become TREF1>TM1>TREF2>TM2>TREF3>TM3. When using solder containing 90% of lead and 10% of tin for the portion 15, 40% of lead and 60% of tin for the portion 14, solder containing 10% of gold and 90% of tin may be used for the portion 16. Thus, by setting suitable melting point and reflow temperature, it can prevent deterioration of sealing by the cap and improper connection of a special element thereto.
COPYRIGHT: (C)1980,JPO&Japio
JP13370678A 1978-11-01 1978-11-01 Method of sealing substrate carrying special element by metallic cap Pending JPS5562752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13370678A JPS5562752A (en) 1978-11-01 1978-11-01 Method of sealing substrate carrying special element by metallic cap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13370678A JPS5562752A (en) 1978-11-01 1978-11-01 Method of sealing substrate carrying special element by metallic cap

Publications (1)

Publication Number Publication Date
JPS5562752A true JPS5562752A (en) 1980-05-12

Family

ID=15110977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13370678A Pending JPS5562752A (en) 1978-11-01 1978-11-01 Method of sealing substrate carrying special element by metallic cap

Country Status (1)

Country Link
JP (1) JPS5562752A (en)

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