JPS5567155A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPS5567155A
JPS5567155A JP13934278A JP13934278A JPS5567155A JP S5567155 A JPS5567155 A JP S5567155A JP 13934278 A JP13934278 A JP 13934278A JP 13934278 A JP13934278 A JP 13934278A JP S5567155 A JPS5567155 A JP S5567155A
Authority
JP
Japan
Prior art keywords
lead
silver
plating
plating layer
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13934278A
Other languages
Japanese (ja)
Inventor
Yoshio Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13934278A priority Critical patent/JPS5567155A/en
Publication of JPS5567155A publication Critical patent/JPS5567155A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To better the soldering properties of an exposed lead of this resin sealing type semiconductor device, by plating an upper portion of a copper plating layer with not less than approximate 3μ thickness with tin or solder.
CONSTITUTION: A semiconductor element is welded to a lead frame plate with silver, connected to a wire and sealed with resin. A lead exposed to the outside is washed with chemicals, and thickness is formed in not less than 3μ by first plating the lead with copper. With the lead 12, there is an oxide film 14 on a surface of a blank 13, there is a silver plating layer 15 on that and a copper plating film 16 and a tin or solder plating layer 17 are successively formed on the surface. When the lead 12 is inserted into a hole of a print substrate 11 and soldered, silver does not liquate out differing from phenomena in conventional devices, and soldering properties are remarkably inproved.
COPYRIGHT: (C)1980,JPO&Japio
JP13934278A 1978-11-14 1978-11-14 Preparation of semiconductor device Pending JPS5567155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13934278A JPS5567155A (en) 1978-11-14 1978-11-14 Preparation of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13934278A JPS5567155A (en) 1978-11-14 1978-11-14 Preparation of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5567155A true JPS5567155A (en) 1980-05-21

Family

ID=15243089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13934278A Pending JPS5567155A (en) 1978-11-14 1978-11-14 Preparation of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5567155A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707724A (en) * 1984-06-04 1987-11-17 Hitachi, Ltd. Semiconductor device and method of manufacturing thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707724A (en) * 1984-06-04 1987-11-17 Hitachi, Ltd. Semiconductor device and method of manufacturing thereof

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