JPS5414675A - Bonding method for semiconductor elements - Google Patents

Bonding method for semiconductor elements

Info

Publication number
JPS5414675A
JPS5414675A JP7987777A JP7987777A JPS5414675A JP S5414675 A JPS5414675 A JP S5414675A JP 7987777 A JP7987777 A JP 7987777A JP 7987777 A JP7987777 A JP 7987777A JP S5414675 A JPS5414675 A JP S5414675A
Authority
JP
Japan
Prior art keywords
semiconductor elements
bonding method
tin
metal
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7987777A
Other languages
Japanese (ja)
Inventor
Toru Kawanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7987777A priority Critical patent/JPS5414675A/en
Publication of JPS5414675A publication Critical patent/JPS5414675A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make the accurate connection between a bump electrode of a semiconductor pellet, formed of a material obtained by covering the surface of this copper metal with tin-system metal, and a conductor layer by using a composite plate of gold and tin system metals.
COPYRIGHT: (C)1979,JPO&Japio
JP7987777A 1977-07-06 1977-07-06 Bonding method for semiconductor elements Pending JPS5414675A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7987777A JPS5414675A (en) 1977-07-06 1977-07-06 Bonding method for semiconductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7987777A JPS5414675A (en) 1977-07-06 1977-07-06 Bonding method for semiconductor elements

Publications (1)

Publication Number Publication Date
JPS5414675A true JPS5414675A (en) 1979-02-03

Family

ID=13702450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7987777A Pending JPS5414675A (en) 1977-07-06 1977-07-06 Bonding method for semiconductor elements

Country Status (1)

Country Link
JP (1) JPS5414675A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02209742A (en) * 1988-09-16 1990-08-21 Natl Semiconductor Corp <Ns> Gold/tin entectic bonding for tape automaization bonding process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02209742A (en) * 1988-09-16 1990-08-21 Natl Semiconductor Corp <Ns> Gold/tin entectic bonding for tape automaization bonding process

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