SU756739A1 - Solder for free soldering - Google Patents

Solder for free soldering

Info

Publication number
SU756739A1
SU756739A1 SU2747208/27A SU2747208A SU756739A1 SU 756739 A1 SU756739 A1 SU 756739A1 SU 2747208/27 A SU2747208/27 A SU 2747208/27A SU 2747208 A SU2747208 A SU 2747208A SU 756739 A1 SU756739 A1 SU 756739A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solder
free soldering
bismuth
cadmium
indium
Prior art date
Application number
SU2747208/27A
Other languages
Russian (ru)
Inventor
С.П. Яценко
Л.М. Скачкова
А.М. Сасов
Original Assignee
Институт химии Уральского научного центра АН СССР
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Институт химии Уральского научного центра АН СССР filed Critical Институт химии Уральского научного центра АН СССР
Priority to SU2747208/27A priority Critical patent/SU756739A1/en
Application granted granted Critical
Publication of SU756739A1 publication Critical patent/SU756739A1/en

Links

Abstract

Припой для бесфлюсовой пайки, содержащий медь, висмут, свинец, индий, олово, кадмий, галлий, отличающийся тем, что, с целью повышения механической прочности припоя и прочности паяного шва, он содержит дополнительно серебро при следующем соотношении компонентов, вес.%:Медь - 40 - 50Висмут - 14,1 - 22,2Свинец - 7,0 - 11,0Индий - 6,7 - 10,7Олово - 3,9 - 6,1Кадмий - 2,3 - 3,5Галлий - 1,0 - 1,5Серебро - 5 - 15Solder for flux-free soldering, containing copper, bismuth, lead, indium, tin, cadmium, gallium, characterized in that, in order to increase the mechanical strength of the solder and the strength of the solder joint, it also contains silver in the following ratio of components, wt.%: Copper - 40 - 50 Bismuth - 14.1 - 22.2 Lead - 7.0 - 11.0 Indium - 6.7 - 10.7 Tin - 3.9 - 6.1 Cadmium - 2.3 - 3.5 Gally - 1.0 - 1 , 5 Silver - 5 - 15

SU2747208/27A 1979-04-05 1979-04-05 Solder for free soldering SU756739A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU2747208/27A SU756739A1 (en) 1979-04-05 1979-04-05 Solder for free soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU2747208/27A SU756739A1 (en) 1979-04-05 1979-04-05 Solder for free soldering

Publications (1)

Publication Number Publication Date
SU756739A1 true SU756739A1 (en) 2000-05-10

Family

ID=60523303

Family Applications (1)

Application Number Title Priority Date Filing Date
SU2747208/27A SU756739A1 (en) 1979-04-05 1979-04-05 Solder for free soldering

Country Status (1)

Country Link
SU (1) SU756739A1 (en)

Similar Documents

Publication Publication Date Title
KR840009237A (en) Improved Steam Phase Soldering Method
KR940006693A (en) Use of silver alloy as cadmium member solder
SU756739A1 (en) Solder for free soldering
GB927380A (en) Improvements in or relating to solders
ES8501276A1 (en) Solder alloys for brazing contact materials.
SU236215A1 (en) PASTE BRAIN FOR SOLDERING OF ELECTRIC AND ACCUMULATOR DETAILS
SU1672700A1 (en) Solder for free soldering
SU1394603A1 (en) Solder for low temperature soldering
JPS56144893A (en) Solder alloy for fitting lead on silver electrode
SU239000A1 (en) Solder for soldering of semi-conductor parts
SU241950A1 (en) N.V. Kurguzov, I.K. Sklre and A.I. Golubev
SU194528A1 (en) Solder for soldering thermoelements
SU170268A1 (en) Solder for soldering
GB2029652B (en) Solder bearing terminal clip
SU1466147A1 (en) Solder for low-temperature non-flux soldering
SU516489A1 (en) Solder for low-temperature soldering
SU1115337A1 (en) Solder for free soldering
SU1494386A1 (en) Solder for soldering copper and its alloys
TH3824B (en) Copper-doped low melting point solder for assembly and re-soldering
SU928736A1 (en) Solder for soldering of crystals of semiconductor devices
SU176785A1 (en) Solder for soldering parts
SU539716A1 (en) Solder for soldering steel
JPS5518146A (en) Mount material of crystal oscillatoing element
JPS5299068A (en) Semiconductor device
JPS5398777A (en) Semiconductor device of resin seal type