GB896935A - Improvements in or relating to the manufacture of semiconductor devices - Google Patents

Improvements in or relating to the manufacture of semiconductor devices

Info

Publication number
GB896935A
GB896935A GB6359/58A GB635958A GB896935A GB 896935 A GB896935 A GB 896935A GB 6359/58 A GB6359/58 A GB 6359/58A GB 635958 A GB635958 A GB 635958A GB 896935 A GB896935 A GB 896935A
Authority
GB
United Kingdom
Prior art keywords
wire
solder
semi
tip
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6359/58A
Inventor
Alan David Weston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB6359/58A priority Critical patent/GB896935A/en
Publication of GB896935A publication Critical patent/GB896935A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/45565—Single coating layer
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    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

896,935. Soldering. GENERAL ELECTRIC CO. Ltd. Feb. 27, 1959 [Feb. 27, 1958], No. 6359/58. Class 83 (4). [Also in Group XXXVI] A lead wire is soldered to the surface of a semi-conductor body containing a PN junction by preparing the wire so that only the tip is readily wettable by the solder, and arranging for the surface of the semi-conductor to be more easily wetted by the solder than the surface of the wire contiguous with the tip. The drawing shows an N-type germanium wafer 1 with P-type emitter portion 2 and P-type collector region 4. A beryllium-copper wire 3 is first heated to provide an oxide coating 6, then cut to provide a clean surface and dipped into a tin-lead-indium solder to form a coating 7 on the clean end portion only. The wire is then brought into contact with emitter region 2, zinc chloride sprayed on as a flux while the semi-conductor is heated to just below the melting-point of the solder, and hot gas then used to melt the solder. The device is then washed in deionized water and potassium cyanide. Aluminium may be used instead of beryllium-copper, a coating of special flux being applied to the tip of the aluminium wire which renders the oxide coating process unnecessary.
GB6359/58A 1958-02-27 1958-02-27 Improvements in or relating to the manufacture of semiconductor devices Expired GB896935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB6359/58A GB896935A (en) 1958-02-27 1958-02-27 Improvements in or relating to the manufacture of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB6359/58A GB896935A (en) 1958-02-27 1958-02-27 Improvements in or relating to the manufacture of semiconductor devices

Publications (1)

Publication Number Publication Date
GB896935A true GB896935A (en) 1962-05-23

Family

ID=9813082

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6359/58A Expired GB896935A (en) 1958-02-27 1958-02-27 Improvements in or relating to the manufacture of semiconductor devices

Country Status (1)

Country Link
GB (1) GB896935A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110662365A (en) * 2019-09-25 2020-01-07 安徽熙泰智能科技有限公司 Micro-display wire welding method and wire welding equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110662365A (en) * 2019-09-25 2020-01-07 安徽熙泰智能科技有限公司 Micro-display wire welding method and wire welding equipment

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