GB768103A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB768103A
GB768103A GB2393354A GB2393354A GB768103A GB 768103 A GB768103 A GB 768103A GB 2393354 A GB2393354 A GB 2393354A GB 2393354 A GB2393354 A GB 2393354A GB 768103 A GB768103 A GB 768103A
Authority
GB
United Kingdom
Prior art keywords
semi
sealed
conductor
fins
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2393354A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JAMES IVOR MISSEN
General Electric Co PLC
Original Assignee
JAMES IVOR MISSEN
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JAMES IVOR MISSEN, General Electric Co PLC filed Critical JAMES IVOR MISSEN
Priority to GB2393354A priority Critical patent/GB768103A/en
Publication of GB768103A publication Critical patent/GB768103A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

768,103. Semi-conductor devices. GENERAL ELECTRIC CO., Ltd., JONES, D. D., and MISSEN, J. I. July 26, 1955 [Aug. 17, 1954], No. 23933/54. Class 37. A semi-conductor device including a semi-conductor body disposed in a sealed envelope and in thermal contact with a metal part thereof and provided with a set of metal cooling fins which partially surround the envelope has at least one of its leads connected to an insulated terminal on one of the fins. In the device shown the cooling fins are a set of U-shaped A1 channel members 6-10 riveted together at their bases. The semi-conductor device is an N-type Ge body soldered to copper block 1 which is clamped to the fins by nut 12 engaging its threaded part 2. The Ge body, to the upper surface of which a junction forming In electrode is fused, is enclosed by copper cap 3 sealed to the block. A Ni wire from the electrode is sealed into a Ni tube 4 sealed through the cap by a glass to metal seal 5. The tube 4 fits into connector 13 from which wire 14 extends to terminal 15 in an insulating bush 16.
GB2393354A 1954-08-17 1954-08-17 Improvements in or relating to semiconductor devices Expired GB768103A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2393354A GB768103A (en) 1954-08-17 1954-08-17 Improvements in or relating to semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2393354A GB768103A (en) 1954-08-17 1954-08-17 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB768103A true GB768103A (en) 1957-02-13

Family

ID=10203655

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2393354A Expired GB768103A (en) 1954-08-17 1954-08-17 Improvements in or relating to semiconductor devices

Country Status (1)

Country Link
GB (1) GB768103A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2932684A (en) * 1956-09-10 1960-04-12 Philco Corp Semi-conductor units and methods of making them
DE1156456B (en) * 1962-01-10 1963-10-31 R & E Hopt K G Arrangement containing a power transistor and a variable capacitor
US3147802A (en) * 1961-08-04 1964-09-08 Astro Dynamics Inc Heat radiator
US3147801A (en) * 1961-02-09 1964-09-08 Astro Dynamics Inc Heat radiator
DE1178479B (en) * 1960-09-08 1964-09-24 Siemens Ag Device for electrical communications and measurement technology equipped with transistors
US3187812A (en) * 1963-02-11 1965-06-08 Staver Co Heat dissipator for electronic circuitry
US3212569A (en) * 1961-06-26 1965-10-19 Int Electronic Res Corp Heat dissipator for electronic components
US3246213A (en) * 1961-05-04 1966-04-12 Westinghouse Brake & Signal Rectifier mounting and heat dissipating structure
US3247896A (en) * 1963-12-27 1966-04-26 Ibm Component heat removal device
DE1216988B (en) * 1960-02-16 1966-05-18 Viktoria Dietmayer Geb Hoesl Heavy-duty direct current converter with transistors
US3277346A (en) * 1962-08-29 1966-10-04 Int Electronic Res Corp Cooler package for electronic components
DE1270635B (en) * 1959-07-27 1968-06-20 Motorola Inc Intercom
US3716098A (en) * 1971-01-28 1973-02-13 G Dotto Automotive apparatus
FR2448804A1 (en) * 1979-02-07 1980-09-05 Bosch Gmbh Robert RECTIFIER DEVICE FOR THREE-PHASE ALTERNATOR
US6640883B2 (en) * 2002-02-14 2003-11-04 Glacialtech Inc. Computer heat sink

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2932684A (en) * 1956-09-10 1960-04-12 Philco Corp Semi-conductor units and methods of making them
DE1270635B (en) * 1959-07-27 1968-06-20 Motorola Inc Intercom
DE1216988B (en) * 1960-02-16 1966-05-18 Viktoria Dietmayer Geb Hoesl Heavy-duty direct current converter with transistors
DE1178479B (en) * 1960-09-08 1964-09-24 Siemens Ag Device for electrical communications and measurement technology equipped with transistors
US3147801A (en) * 1961-02-09 1964-09-08 Astro Dynamics Inc Heat radiator
US3246213A (en) * 1961-05-04 1966-04-12 Westinghouse Brake & Signal Rectifier mounting and heat dissipating structure
US3212569A (en) * 1961-06-26 1965-10-19 Int Electronic Res Corp Heat dissipator for electronic components
US3147802A (en) * 1961-08-04 1964-09-08 Astro Dynamics Inc Heat radiator
DE1156456B (en) * 1962-01-10 1963-10-31 R & E Hopt K G Arrangement containing a power transistor and a variable capacitor
US3277346A (en) * 1962-08-29 1966-10-04 Int Electronic Res Corp Cooler package for electronic components
US3187812A (en) * 1963-02-11 1965-06-08 Staver Co Heat dissipator for electronic circuitry
US3247896A (en) * 1963-12-27 1966-04-26 Ibm Component heat removal device
US3716098A (en) * 1971-01-28 1973-02-13 G Dotto Automotive apparatus
FR2448804A1 (en) * 1979-02-07 1980-09-05 Bosch Gmbh Robert RECTIFIER DEVICE FOR THREE-PHASE ALTERNATOR
US6640883B2 (en) * 2002-02-14 2003-11-04 Glacialtech Inc. Computer heat sink

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