GB774800A - Improvements in or relating to the manufacture of semi-conductor devices - Google Patents

Improvements in or relating to the manufacture of semi-conductor devices

Info

Publication number
GB774800A
GB774800A GB12827/54A GB1282754A GB774800A GB 774800 A GB774800 A GB 774800A GB 12827/54 A GB12827/54 A GB 12827/54A GB 1282754 A GB1282754 A GB 1282754A GB 774800 A GB774800 A GB 774800A
Authority
GB
United Kingdom
Prior art keywords
wire
bead
indium
germanium
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB12827/54A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALEXANDER ROBERT FREDERICK PLU
General Electric Co PLC
Original Assignee
ALEXANDER ROBERT FREDERICK PLU
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ALEXANDER ROBERT FREDERICK PLU, General Electric Co PLC filed Critical ALEXANDER ROBERT FREDERICK PLU
Priority to GB12827/54A priority Critical patent/GB774800A/en
Publication of GB774800A publication Critical patent/GB774800A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2924/0001—Technical content checked by a classifier
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

774,800. Soldering. GENERAL ELECTRIC CO., Ltd., and PLUMMER, A. R. F. Aug. 3, 1955 [May 3, 1954], No. 12827/54. Class 83 (4). [Also in Group XXXVI] A lead wire is secured to an alloy junction electrode on a semi-conductor device, by heating the wire from a source shielded from the bead, so as to melt a portion of the bead adjacent the end of the wire, immersing the wire in the molten material and then cooling. The Figure shows a germanium wafer 1 having alloy junction electrodes 2 and 3 formed by fusing a bead of indium, or other accepter or donot material, into the surface of the germanium to form a PNP transistor. Wafer 1 is supported in a holder 6, and a tinned copper wire 13 with a coating of indium is supported by a pivoted arm 8. The wire 13 is surrounded by a heating coil 11, and passes through a hole in shield 12. The holder 6 is microscopically adjusted so that indium bead 3 engages wire 13 to lift arm 8 slightly above the horizontal, and then the heater coil 11 operated until 13 becomes immersed in the molten portion of bead 3. The arrangement may be modified so that another wire is simultaneously secured to the opposite bead 2. The Provisional Specification states that a mixture of antimony and lead may be used for P-type germanium in place of indium.
GB12827/54A 1954-05-03 1954-05-03 Improvements in or relating to the manufacture of semi-conductor devices Expired GB774800A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB12827/54A GB774800A (en) 1954-05-03 1954-05-03 Improvements in or relating to the manufacture of semi-conductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB12827/54A GB774800A (en) 1954-05-03 1954-05-03 Improvements in or relating to the manufacture of semi-conductor devices

Publications (1)

Publication Number Publication Date
GB774800A true GB774800A (en) 1957-05-15

Family

ID=10011867

Family Applications (1)

Application Number Title Priority Date Filing Date
GB12827/54A Expired GB774800A (en) 1954-05-03 1954-05-03 Improvements in or relating to the manufacture of semi-conductor devices

Country Status (1)

Country Link
GB (1) GB774800A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1165755B (en) * 1957-09-26 1964-03-19 Philco Corp Eine Ges Nach Den Method for fastening leads to the contact electrodes of semiconductor bodies and device for carrying out the method
DE1166378B (en) * 1957-09-20 1964-03-26 Philco Corp Eine Ges Nach Den Method for attaching a connecting line to a barrier layer electrode of a semiconductor arrangement and device for carrying out the method
DE1172376B (en) * 1960-11-21 1964-06-18 Siemens Ag Method for soldering connecting wires to electrical capacitors or similar electrical components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1166378B (en) * 1957-09-20 1964-03-26 Philco Corp Eine Ges Nach Den Method for attaching a connecting line to a barrier layer electrode of a semiconductor arrangement and device for carrying out the method
DE1165755B (en) * 1957-09-26 1964-03-19 Philco Corp Eine Ges Nach Den Method for fastening leads to the contact electrodes of semiconductor bodies and device for carrying out the method
DE1172376B (en) * 1960-11-21 1964-06-18 Siemens Ag Method for soldering connecting wires to electrical capacitors or similar electrical components

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