GB753488A - Improvements in or relating to electrical couplings to semiconductor elements - Google Patents

Improvements in or relating to electrical couplings to semiconductor elements

Info

Publication number
GB753488A
GB753488A GB19173/53A GB1917353A GB753488A GB 753488 A GB753488 A GB 753488A GB 19173/53 A GB19173/53 A GB 19173/53A GB 1917353 A GB1917353 A GB 1917353A GB 753488 A GB753488 A GB 753488A
Authority
GB
United Kingdom
Prior art keywords
wire
germanium
soldering
solder
july
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB19173/53A
Inventor
Stanley Carden Shepard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE512559D priority Critical patent/BE512559A/xx
Priority to BE530249D priority patent/BE530249A/xx
Priority to BE538791D priority patent/BE538791A/xx
Priority to NL86185D priority patent/NL86185C/xx
Priority to DENDAT1069726D priority patent/DE1069726B/en
Priority to NLAANVRAGE7703161,A priority patent/NL170157B/en
Priority to BE554903D priority patent/BE554903A/xx
Priority to NL238107D priority patent/NL238107A/xx
Priority to LU37433D priority patent/LU37433A1/xx
Priority to FR1066148D priority patent/FR1066148A/en
Priority to US292304A priority patent/US2785349A/en
Priority to DEI5966A priority patent/DE968077C/en
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB19173/53A priority patent/GB753488A/en
Priority to FR66909D priority patent/FR66909E/en
Priority to DEI8884A priority patent/DE1060992B/en
Priority to DEI10229A priority patent/DE1015934B/en
Priority to GB15973/55A priority patent/GB795113A/en
Priority to FR69762D priority patent/FR69762E/en
Priority to CH342657D priority patent/CH342657A/en
Priority to GB4261/56A priority patent/GB797822A/en
Publication of GB753488A publication Critical patent/GB753488A/en
Priority to FR71643D priority patent/FR71643E/en
Priority to DEST13682A priority patent/DE1098102B/en
Priority to GB13142/59A priority patent/GB914592A/en
Priority to FR792952A priority patent/FR75616E/en
Priority to DEST15123A priority patent/DE1255823B/en
Priority to FR800665A priority patent/FR76055E/en
Priority to GB25349/59A priority patent/GB884824A/en
Priority to GB16156/60A priority patent/GB877644A/en
Priority to CH543660A priority patent/CH384722A/en
Priority to FR827169A priority patent/FR77758E/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/04—Cells with aqueous electrolyte
    • H01M6/06—Dry cells, i.e. cells wherein the electrolyte is rendered non-fluid
    • H01M6/10—Dry cells, i.e. cells wherein the electrolyte is rendered non-fluid with wound or folded electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/26—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20—Seals between parts of vessels
    • H01J5/22—Vacuum-tight joints between parts of vessel
    • H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
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    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
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    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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    • H01M4/36—Selection of substances as active materials, active masses, active liquids
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    • H01M4/50—Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese
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    • H01M6/045—Cells with aqueous electrolyte characterised by aqueous electrolyte
    • H—ELECTRICITY
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    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/04—Cells with aqueous electrolyte
    • H01M6/06—Dry cells, i.e. cells wherein the electrolyte is rendered non-fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037—Solid sealing members other than lamp bases
    • H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
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    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01032—Germanium [Ge]
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    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10252—Germanium [Ge]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Food Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

753,488. Semiconductor devices. STANDARD TELEPHONES & CABLES, Ltd. July 2, 1954 [July 10, 1953], No. 19173/53. Class 37. [Also in Group XXII] A conductor wire 11 is electrically connected to a wafer 1 of semiconductor material such as germanium, by forming the wire in a double coiled spring, inserting the wafer between the two turns and soldering. Fig. 7 shows the arrangement used for the base electrode 13 of a junction transistor which is sealed in a glass envelope 14. The wire may be of phosphor bronze or beryllium copper. Stannous chloride may be used as a flux and pure tin as the solder. The envelope 14 may be filled with resin. Soldering may be affected with a minimum amount of heat by arranging for the solder to fill the coil on the germanium and may be carried out after the process for forming PN junctions in the device.
GB19173/53A 1951-06-08 1953-07-10 Improvements in or relating to electrical couplings to semiconductor elements Expired GB753488A (en)

Priority Applications (30)

Application Number Priority Date Filing Date Title
BE554903D BE554903A (en) 1951-06-08
BE538791D BE538791A (en) 1951-06-08
NL86185D NL86185C (en) 1951-06-08
LU37433D LU37433A1 (en) 1951-06-08
NLAANVRAGE7703161,A NL170157B (en) 1951-06-08 METHOD AND DEVICE FOR GASIFICATION OF SOLID FUELS BY PARTIAL OXIDATION.
NL238107D NL238107A (en) 1951-06-08
DENDAT1069726D DE1069726B (en) 1951-06-08 Galvanic element for high current loads and process for its manufacture
BE512559D BE512559A (en) 1951-06-08
BE530249D BE530249A (en) 1951-06-08
FR1066148D FR1066148A (en) 1951-06-08 1952-06-06 Improvements to electric crystal rectifiers
US292304A US2785349A (en) 1951-06-08 1952-06-07 Electric semi-conducting devices
DEI5966A DE968077C (en) 1951-06-08 1952-06-08 Process for the manufacture of crystal rectifiers
GB19173/53A GB753488A (en) 1953-07-10 1953-07-10 Improvements in or relating to electrical couplings to semiconductor elements
FR66909D FR66909E (en) 1951-06-08 1954-07-06 Improvements to electric crystal rectifiers
DEI8884A DE1060992B (en) 1951-06-08 1954-07-07 Process for making an electrical connection in semiconductors such as germanium
DEI10229A DE1015934B (en) 1951-06-08 1955-05-20 Crystallode with a semiconductor crystal built into a tight housing and desiccant arranged in the housing
GB15973/55A GB795113A (en) 1951-06-08 1955-06-03 Improvements in or relating to containers including desiccants
FR69762D FR69762E (en) 1951-06-08 1955-06-06 Improvements to electric crystal rectifiers
CH342657D CH342657A (en) 1951-06-08 1955-06-07 Method of manufacturing semiconductor elements
GB4261/56A GB797822A (en) 1951-06-08 1956-02-10 Improvements in or relating to semi-conductor junction diodes
FR71643D FR71643E (en) 1951-06-08 1957-02-08 Improvements to electric crystal rectifiers
DEST13682A DE1098102B (en) 1951-06-08 1958-04-23 A method of manufacturing an electric semiconductor device
GB13142/59A GB914592A (en) 1951-06-08 1959-04-17 Electrical semi-conductor device
FR792952A FR75616E (en) 1951-06-08 1959-04-23 Improvements to electric crystal rectifiers
DEST15123A DE1255823B (en) 1951-06-08 1959-05-13 Process for the production of cooling elements for electrical components from cooling plates arranged on a bolt perpendicular to the longitudinal axis, in particular for semiconductor power rectifiers and transistors
FR800665A FR76055E (en) 1951-06-08 1959-07-21 Improvements to electric crystal rectifiers
GB25349/59A GB884824A (en) 1951-06-08 1959-07-23 Improvements in or relating to galvanic cells
GB16156/60A GB877644A (en) 1951-06-08 1960-05-06 Method of manufacturing cooling bodies for cooling electrical components
CH543660A CH384722A (en) 1951-06-08 1960-05-12 Process for the production of heat sinks for cooling electrical components
FR827169A FR77758E (en) 1951-06-08 1960-05-13 Improvements to electric crystal rectifiers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB19173/53A GB753488A (en) 1953-07-10 1953-07-10 Improvements in or relating to electrical couplings to semiconductor elements

Publications (1)

Publication Number Publication Date
GB753488A true GB753488A (en) 1956-07-25

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GB19173/53A Expired GB753488A (en) 1951-06-08 1953-07-10 Improvements in or relating to electrical couplings to semiconductor elements

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1059571B (en) * 1957-08-13 1959-06-18 Siemens Ag Small dry rectifier arrangement and method for its manufacture
DE1072752B (en) * 1958-11-10 1960-01-07 Siemens S. Halske Aktiengesellschaft, Berlin und München Rectifier arrangement
US3002132A (en) * 1956-12-24 1961-09-26 Ibm Crystal diode encapsulation
DE1188211B (en) * 1958-07-10 1965-03-04 Texas Instruments Inc Semiconductor arrangement with spacer device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3002132A (en) * 1956-12-24 1961-09-26 Ibm Crystal diode encapsulation
DE1059571B (en) * 1957-08-13 1959-06-18 Siemens Ag Small dry rectifier arrangement and method for its manufacture
DE1188211B (en) * 1958-07-10 1965-03-04 Texas Instruments Inc Semiconductor arrangement with spacer device
DE1072752B (en) * 1958-11-10 1960-01-07 Siemens S. Halske Aktiengesellschaft, Berlin und München Rectifier arrangement

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