SU123030A1 - Solder for connecting thermoelements - Google Patents
Solder for connecting thermoelementsInfo
- Publication number
- SU123030A1 SU123030A1 SU616715A SU616715A SU123030A1 SU 123030 A1 SU123030 A1 SU 123030A1 SU 616715 A SU616715 A SU 616715A SU 616715 A SU616715 A SU 616715A SU 123030 A1 SU123030 A1 SU 123030A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- thermoelements
- bismuth
- tellurium
- tin
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Обычна пайка висмутом термоэлементов из тройных сплавов: висмут-теллур-сурьма и висмут-теллур-селен с медными пластинами , приводит к большим переходным электросопротивлени м вследствие образующихс в чистом висмуте труднорастворимых соединений.The usual soldering of bismuth thermoelements from ternary alloys: bismuth-tellurium-antimony and bismuth-tellurium-selenium with copper plates, leads to high transient electrical resistivity due to poorly soluble compounds formed in pure bismuth.
Дл устранени указанного влени предложен припой следующего состава (в %): висмут 99,2-98,8 и олово 0,8-1,2.To eliminate this phenomenon, a solder of the following composition was proposed (in%): bismuth 99.2-98.8 and tin 0.8-1.2.
Припой имеет т. пл. 270°С; при температурах выше 270°С обладает более высокой стойкостью против окислени , чем чистый висмут.Solder has t. Pl. 270 ° C; at temperatures above 270 ° C, it is more resistant to oxidation than pure bismuth.
Предмет изобретени .The subject matter of the invention.
Припой дл соединени термоэлементов из тройных сплавов: висмут-теллур-сурьма и висмут--теллур-селен с медными пластинами , состо щий из висмута и олова, отличающийс тем, что, с целью улучщени качества спа и улучщеии растворимости пленок, образующихс при пайке, в состав припо входит 99,2-98,8% висмута и 0,8- 1,2% олова.A solder for connecting thermoelements made of ternary alloys: bismuth-tellurium-antimony and bismuth-tellurium-selenium with copper plates, consisting of bismuth and tin, characterized in that The composition of the solder is 99.2-98.8% bismuth and 0.8-1.2% tin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU616715A SU123030A1 (en) | 1959-01-16 | 1959-01-16 | Solder for connecting thermoelements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU616715A SU123030A1 (en) | 1959-01-16 | 1959-01-16 | Solder for connecting thermoelements |
Publications (1)
Publication Number | Publication Date |
---|---|
SU123030A1 true SU123030A1 (en) | 1959-11-30 |
Family
ID=48394632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU616715A SU123030A1 (en) | 1959-01-16 | 1959-01-16 | Solder for connecting thermoelements |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU123030A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2477207C1 (en) * | 2011-08-09 | 2013-03-10 | Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" | Lead-free solder |
-
1959
- 1959-01-16 SU SU616715A patent/SU123030A1/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2477207C1 (en) * | 2011-08-09 | 2013-03-10 | Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" | Lead-free solder |
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