SU123030A1 - Solder for connecting thermoelements - Google Patents

Solder for connecting thermoelements

Info

Publication number
SU123030A1
SU123030A1 SU616715A SU616715A SU123030A1 SU 123030 A1 SU123030 A1 SU 123030A1 SU 616715 A SU616715 A SU 616715A SU 616715 A SU616715 A SU 616715A SU 123030 A1 SU123030 A1 SU 123030A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solder
thermoelements
bismuth
tellurium
tin
Prior art date
Application number
SU616715A
Other languages
Russian (ru)
Inventor
Е.А. Коленко
А.Г. Щербина
Original Assignee
Е.А. Коленко
А.Г. Щербина
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Е.А. Коленко, А.Г. Щербина filed Critical Е.А. Коленко
Priority to SU616715A priority Critical patent/SU123030A1/en
Application granted granted Critical
Publication of SU123030A1 publication Critical patent/SU123030A1/en

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

Обычна  пайка висмутом термоэлементов из тройных сплавов: висмут-теллур-сурьма и висмут-теллур-селен с медными пластинами , приводит к большим переходным электросопротивлени м вследствие образующихс  в чистом висмуте труднорастворимых соединений.The usual soldering of bismuth thermoelements from ternary alloys: bismuth-tellurium-antimony and bismuth-tellurium-selenium with copper plates, leads to high transient electrical resistivity due to poorly soluble compounds formed in pure bismuth.

Дл  устранени  указанного  влени  предложен припой следующего состава (в %): висмут 99,2-98,8 и олово 0,8-1,2.To eliminate this phenomenon, a solder of the following composition was proposed (in%): bismuth 99.2-98.8 and tin 0.8-1.2.

Припой имеет т. пл. 270°С; при температурах выше 270°С обладает более высокой стойкостью против окислени , чем чистый висмут.Solder has t. Pl. 270 ° C; at temperatures above 270 ° C, it is more resistant to oxidation than pure bismuth.

Предмет изобретени  .The subject matter of the invention.

Припой дл  соединени  термоэлементов из тройных сплавов: висмут-теллур-сурьма и висмут--теллур-селен с медными пластинами , состо щий из висмута и олова, отличающийс  тем, что, с целью улучщени  качества спа  и улучщеии  растворимости пленок, образующихс  при пайке, в состав припо  входит 99,2-98,8% висмута и 0,8- 1,2% олова.A solder for connecting thermoelements made of ternary alloys: bismuth-tellurium-antimony and bismuth-tellurium-selenium with copper plates, consisting of bismuth and tin, characterized in that The composition of the solder is 99.2-98.8% bismuth and 0.8-1.2% tin.

SU616715A 1959-01-16 1959-01-16 Solder for connecting thermoelements SU123030A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU616715A SU123030A1 (en) 1959-01-16 1959-01-16 Solder for connecting thermoelements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU616715A SU123030A1 (en) 1959-01-16 1959-01-16 Solder for connecting thermoelements

Publications (1)

Publication Number Publication Date
SU123030A1 true SU123030A1 (en) 1959-11-30

Family

ID=48394632

Family Applications (1)

Application Number Title Priority Date Filing Date
SU616715A SU123030A1 (en) 1959-01-16 1959-01-16 Solder for connecting thermoelements

Country Status (1)

Country Link
SU (1) SU123030A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2477207C1 (en) * 2011-08-09 2013-03-10 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Lead-free solder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2477207C1 (en) * 2011-08-09 2013-03-10 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Lead-free solder

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