SU219367A1 - Solder for brazing copper and its alloys - Google Patents
Solder for brazing copper and its alloysInfo
- Publication number
- SU219367A1 SU219367A1 SU1154068A SU1154068A SU219367A1 SU 219367 A1 SU219367 A1 SU 219367A1 SU 1154068 A SU1154068 A SU 1154068A SU 1154068 A SU1154068 A SU 1154068A SU 219367 A1 SU219367 A1 SU 219367A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- alloys
- brazing copper
- copper
- brazing
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title description 9
- 229910045601 alloy Inorganic materials 0.000 title description 3
- 239000000956 alloy Substances 0.000 title description 3
- 229910052802 copper Inorganic materials 0.000 title description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 3
- 239000010949 copper Substances 0.000 title description 3
- 238000005219 brazing Methods 0.000 title 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 210000001503 Joints Anatomy 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
Description
Известен припой дл пайки меди и ее сплавов следующего состава (в о/о): I-4 серебра, 2--6 сурьмы, 0,5-5 инди , остальное - олова .A solder is known for soldering copper and its alloys of the following composition (in o / o): I-4 silver, 2--6 antimony, 0.5-5 indium, the rest is tin.
Дл повышени коррозионной стойкости па ного соединени , работоспособного при температуре до , предлагаетс состав припо брать в соотношении (в а/,); Q-14 серебра , 7-12 сурьмы, остальное - олова.In order to increase the corrosion resistance of the solder compound, which is operable at temperatures up to, a composition is proposed in the ratio (in a /,); Q-14 silver, 7-12 antimony, the rest is tin.
Температура солидуса припо составл ет 250С.The solidus solder temperature is 250 ° C.
Предложенный припой дает возможность получать па ные соединени , свободно выдерживаюш ,ие температуру до -{-200°С.The proposed solder makes it possible to obtain solder joints that freely withstand temperatures up to - {- 200 ° C.
Такой припой можно использовать при пайке изделий, предназначенны.х дл работы в тропических услови .х без дополнительной заш ,иты па ных соединений.Such a solder can be used when soldering products intended for operation in tropical conditions without additional protection, as well as solder joints.
Предмет и з о б р е т е н И Subject and reference
Лрипой дл пайки меди и ее сплавов, содерл аш ,ий серебро, сурьму, олово, отличающийс тем, что, с целью повышени коррозионной стойкости па ного соединени , работоспособного при температуре до 200°С, его состав вз т в следуюш,ем процентном соотношении: серебро 6-14; сурьма 7-12; олово - остальное .Lipoy for soldering copper and its alloys, containing ash, silver, antimony, tin, characterized in that, in order to increase the corrosion resistance of the solder compound, operating at temperatures up to 200 ° C, its composition is taken as : silver 6-14; antimony 7-12; tin - the rest.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU219367A1 true SU219367A1 (en) | 1968-05-30 |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS526468A (en) * | 1975-07-04 | 1977-01-18 | Sumitomo Metal Mining Co Ltd | Brazing material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS526468A (en) * | 1975-07-04 | 1977-01-18 | Sumitomo Metal Mining Co Ltd | Brazing material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SU456415A3 (en) | Ligature for aluminum and its alloys | |
| KR970000427A (en) | Lead free solder with excellent solderability | |
| KR940006693A (en) | Use of silver alloy as cadmium member solder | |
| SU219367A1 (en) | Solder for brazing copper and its alloys | |
| GB1005352A (en) | Improvements in or relating to thermoelectric devices | |
| SU183037A1 (en) | Solder for soldering products | |
| SU241950A1 (en) | N.V. Kurguzov, I.K. Sklre and A.I. Golubev | |
| SU194528A1 (en) | Solder for soldering thermoelements | |
| SU123030A1 (en) | Solder for connecting thermoelements | |
| SU209953A1 (en) | Aluminum-Magnesium Alloy Soldering | |
| SU217185A1 (en) | ||
| SU207685A1 (en) | Solder for soldering metals and alloys | |
| SU181815A1 (en) | ||
| SU372045A1 (en) | FLUSHING FOR A METHOD BECKER \\\\\\\\\\\\\\\\\\\\\ h: ^ | |
| SU118690A1 (en) | Heat resistant solder | |
| SU176784A1 (en) | TITANIAN PAIKI | |
| SU186264A1 (en) | VACUUM DENSITY STAINLESS STEEL | |
| SU190180A1 (en) | ||
| GB927380A (en) | Improvements in or relating to solders | |
| SU239775A1 (en) | Solder for soldering products | |
| SU455832A1 (en) | Flux for soldering aluminum and its alloys | |
| Ekuni | Corrosion Resistance of Brazing Filler Metals and Brazed Copper Joints | |
| SU206988A1 (en) | MOLYBDENA PIKES | |
| SU118066A1 (en) | Heat resistant solder | |
| SU234834A1 (en) |