JPS526468A - Brazing material - Google Patents

Brazing material

Info

Publication number
JPS526468A
JPS526468A JP8288475A JP8288475A JPS526468A JP S526468 A JPS526468 A JP S526468A JP 8288475 A JP8288475 A JP 8288475A JP 8288475 A JP8288475 A JP 8288475A JP S526468 A JPS526468 A JP S526468A
Authority
JP
Japan
Prior art keywords
brazing material
brazing
dyamond
distrotion
friable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8288475A
Other languages
Japanese (ja)
Other versions
JPS5649679B2 (en
Inventor
Tomio Takahashi
Takeshi Nagasaki
Akira Kuwano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP8288475A priority Critical patent/JPS526468A/en
Publication of JPS526468A publication Critical patent/JPS526468A/en
Publication of JPS5649679B2 publication Critical patent/JPS5649679B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:Supply of a brazing alloy which is a little harder and more friable than the Pb-Sn brazing material but can be cut with ease by a dyamond blade and absorb the heat distrotion.
JP8288475A 1975-07-04 1975-07-04 Brazing material Granted JPS526468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8288475A JPS526468A (en) 1975-07-04 1975-07-04 Brazing material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8288475A JPS526468A (en) 1975-07-04 1975-07-04 Brazing material

Publications (2)

Publication Number Publication Date
JPS526468A true JPS526468A (en) 1977-01-18
JPS5649679B2 JPS5649679B2 (en) 1981-11-24

Family

ID=13786688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8288475A Granted JPS526468A (en) 1975-07-04 1975-07-04 Brazing material

Country Status (1)

Country Link
JP (1) JPS526468A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device
JPS60177661A (en) * 1984-02-23 1985-09-11 Matsushita Electric Ind Co Ltd Soldering method of semiconductor
US4879096A (en) * 1989-04-19 1989-11-07 Oatey Company Lead- and antimony-free solder composition
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5532031A (en) * 1992-01-29 1996-07-02 International Business Machines Corporation I/O pad adhesion layer for a ceramic substrate
US6231691B1 (en) 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
CN1090550C (en) * 1998-04-14 2002-09-11 株式会社村田制作所 Solder alloy
JP2007044701A (en) * 2005-08-05 2007-02-22 Fuji Electric Device Technology Co Ltd Lead-free solder material
JP2007260695A (en) * 2006-03-27 2007-10-11 Toshiba Corp Joining material, joining method, and joined body
JP2007268569A (en) * 2006-03-31 2007-10-18 Fuji Electric Holdings Co Ltd Powder solder material and joining material

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6058589U (en) * 1983-09-30 1985-04-23 日野自動車株式会社 Mounting structure of eye bolt for cab block
JP3721073B2 (en) * 1999-12-28 2005-11-30 株式会社東芝 Solder material, device or apparatus using the same, and manufacturing method thereof
WO2015125855A1 (en) * 2014-02-24 2015-08-27 株式会社弘輝 Lead-free solder alloy, solder material, and joined structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU219367A1 (en) * 1967-04-17 1968-05-30 В.П. Батраков Solder for brazing copper and its alloys
JPS4938858A (en) * 1972-08-19 1974-04-11

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU219367A1 (en) * 1967-04-17 1968-05-30 В.П. Батраков Solder for brazing copper and its alloys
JPS4938858A (en) * 1972-08-19 1974-04-11

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device
JPS60177661A (en) * 1984-02-23 1985-09-11 Matsushita Electric Ind Co Ltd Soldering method of semiconductor
US4879096A (en) * 1989-04-19 1989-11-07 Oatey Company Lead- and antimony-free solder composition
US5532031A (en) * 1992-01-29 1996-07-02 International Business Machines Corporation I/O pad adhesion layer for a ceramic substrate
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US6231691B1 (en) 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
CN1090550C (en) * 1998-04-14 2002-09-11 株式会社村田制作所 Solder alloy
JP2007044701A (en) * 2005-08-05 2007-02-22 Fuji Electric Device Technology Co Ltd Lead-free solder material
JP2007260695A (en) * 2006-03-27 2007-10-11 Toshiba Corp Joining material, joining method, and joined body
JP2007268569A (en) * 2006-03-31 2007-10-18 Fuji Electric Holdings Co Ltd Powder solder material and joining material
JP4722751B2 (en) * 2006-03-31 2011-07-13 富士電機株式会社 Powder solder material and bonding material

Also Published As

Publication number Publication date
JPS5649679B2 (en) 1981-11-24

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