SU123395A1 - Soldering method using triple alloy thermocouples on flax - Google Patents
Soldering method using triple alloy thermocouples on flaxInfo
- Publication number
- SU123395A1 SU123395A1 SU616718A SU616718A SU123395A1 SU 123395 A1 SU123395 A1 SU 123395A1 SU 616718 A SU616718 A SU 616718A SU 616718 A SU616718 A SU 616718A SU 123395 A1 SU123395 A1 SU 123395A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- flax
- soldering method
- triple alloy
- alloy thermocouples
- bismuth
- Prior art date
Links
Landscapes
- Conductive Materials (AREA)
Description
Известен способ пайки па льником термозлементов из тройных сплавов с полупроводниками - теллуром, сурьмой или селеном припоем из висмута или сплава висмута с оловом. Однако при наличии в сплавах активного вещества теллура его соединени с материалом бойка па льника разлуживают па льник и проникают в тройной сплав, что ухудшает его электрические свойства.There is a known method of soldering a pair of thermal elements from ternary alloys with semiconductors — tellurium, antimony, or selenium — with solder from bismuth or an alloy of bismuth with tin. However, in the presence of tellurium active substance in the alloys, its compounds with the material of the striking element of the paulica leave the paulnik to be dispersed and penetrate into the ternary alloy, which impairs its electrical properties.
В описываемом способе пайки па льником термоэлементов из тройных сплавов висмута с полупроводниками теллуром, сурьмой или селеном припоем из висмута или сплава висмута с оловом с целью улучшени качестваIn the described method of soldering a pair of thermoelements from ternary alloys of bismuth with semiconductors tellurium, antimony or selenium with solder from bismuth or an alloy of bismuth with tin in order to improve the quality
па льник с бойком из чипайки примен ют стого никел .A pair of chips made of fine nickel is used.
Предмет изобретени Subject invention
Способ пайки па льником термоэлементов из тройных сплавов висмута с полупроводниками теллуром, сурьмой или селеном припоем из висмута или сплава висмута с оловом, отличающийс тем, что, с целью улучшени качества пайки путем уменьшени возмол ного проникновени материала бойка па льника в тройной сплав и ухудшени его электрических свойств, примен ют па льник с бойком из чистого никел .A soldering method with a paul of thermoelements made from ternary bismuth alloys with semiconductors tellurium, antimony or selenium is soldered from bismuth or an alloy of bismuth with tin, characterized in that, in order to improve the quality of soldering by reducing the possible penetration of the material of the striker into the ternary alloy and worsen it electrical properties, steam iron with a stripe of pure nickel is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU616718A SU123395A1 (en) | 1959-01-16 | 1959-01-16 | Soldering method using triple alloy thermocouples on flax |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU616718A SU123395A1 (en) | 1959-01-16 | 1959-01-16 | Soldering method using triple alloy thermocouples on flax |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU853894039A Addition SU1262753A2 (en) | 1985-05-06 | 1985-05-06 | Device for fixing stack of printed-circuit boards |
| SU904849584A Addition SU1746551A2 (en) | 1990-07-09 | 1990-07-09 | Device for assembly of stack of printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU123395A1 true SU123395A1 (en) | 1959-11-30 |
Family
ID=48394959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU616718A SU123395A1 (en) | 1959-01-16 | 1959-01-16 | Soldering method using triple alloy thermocouples on flax |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU123395A1 (en) |
-
1959
- 1959-01-16 SU SU616718A patent/SU123395A1/en active
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