GB721881A - Improvements in methods of soldering and solder therefor - Google Patents

Improvements in methods of soldering and solder therefor

Info

Publication number
GB721881A
GB721881A GB20829/51A GB2082951A GB721881A GB 721881 A GB721881 A GB 721881A GB 20829/51 A GB20829/51 A GB 20829/51A GB 2082951 A GB2082951 A GB 2082951A GB 721881 A GB721881 A GB 721881A
Authority
GB
United Kingdom
Prior art keywords
per cent
solder
soldering
therefor
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB20829/51A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB721881A publication Critical patent/GB721881A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Lead-tin solder alloys, for use with electrically heated soldering bits, contain sufficient of the metal of which the soldering bit is made to form a eutectic. Thus where the bit is made of copper the solder contains copper in amount at least 1 per cent of the tin. The solder may contain up to 5 per cent of copper. Examples of such alloys are 40 per cent Sn, 59 per cent Pb, 1 per cent Cu; 50 per cent Sn, 48.5 per cent Pb, 1.5 per cent Cu; 60 per cent Sn, 38 per cent Pb, 2 per cent Cu.
GB20829/51A 1950-09-29 1951-09-04 Improvements in methods of soldering and solder therefor Expired GB721881A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE721881X 1950-09-29

Publications (1)

Publication Number Publication Date
GB721881A true GB721881A (en) 1955-01-12

Family

ID=6630382

Family Applications (1)

Application Number Title Priority Date Filing Date
GB20829/51A Expired GB721881A (en) 1950-09-29 1951-09-04 Improvements in methods of soldering and solder therefor

Country Status (1)

Country Link
GB (1) GB721881A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0198353A2 (en) * 1985-04-12 1986-10-22 International Business Machines Corporation Lead base alloys and their application for reducing electromigration activity
EP1103995A1 (en) * 1999-06-09 2001-05-30 Matsushita Electric Industrial Co., Ltd. Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method
EP1391261A1 (en) * 2002-08-22 2004-02-25 Delphi Technologies, Inc. Lead-based solder alloys containing copper

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0198353A2 (en) * 1985-04-12 1986-10-22 International Business Machines Corporation Lead base alloys and their application for reducing electromigration activity
EP0198353A3 (en) * 1985-04-12 1988-09-14 International Business Machines Corporation Lead base alloys and their application for reducing electromigration activity
EP1103995A1 (en) * 1999-06-09 2001-05-30 Matsushita Electric Industrial Co., Ltd. Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method
EP1103995A4 (en) * 1999-06-09 2004-08-11 Matsushita Electric Ind Co Ltd Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method
EP1391261A1 (en) * 2002-08-22 2004-02-25 Delphi Technologies, Inc. Lead-based solder alloys containing copper
US6811892B2 (en) 2002-08-22 2004-11-02 Delphi Technologies, Inc. Lead-based solder alloys containing copper

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