SU553073A1 - Solder for soldering molybdenum and its alloys - Google Patents
Solder for soldering molybdenum and its alloysInfo
- Publication number
- SU553073A1 SU553073A1 SU2301715A SU2301715A SU553073A1 SU 553073 A1 SU553073 A1 SU 553073A1 SU 2301715 A SU2301715 A SU 2301715A SU 2301715 A SU2301715 A SU 2301715A SU 553073 A1 SU553073 A1 SU 553073A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- alloys
- soldering
- molybdenum
- heat resistance
- Prior art date
Links
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- Parts Printed On Printed Circuit Boards (AREA)
Description
(54) ПРИПОЙ ДЛЯ ПАЙКИ МОЛИБДЕНА И ЕГО СПЛАВОВ(54) A solder for soldering molybdenum and its alloys
1one
Изобретение относитс к области пайки, в частности к составу припо дл пайки молибдена и его сплавов.This invention relates to the field of soldering, in particular to the composition of solders for soldering molybdenum and its alloys.
Известен припой l3 на основе системы вольфрам-цирконий-ванадий-ниобий дл пайки вольфрама и молибдена. Однако отмечаетс недостаточно высока прочность па ного со.единени .A solder l3 based on a tungsten-zirconium-vanadium-niobium system is known for soldering tungsten and molybdenum. However, the strength of the steam compound is not high enough.
Дл пайки деталей, изготовленных из мо либдена и его сплавов, по составу компонен- тов наиболее близким вл етс припой 2ji состава, вес.%;For soldering parts made of molybdenum and its alloys, the composition of the components is the closest to 2ji solder composition, wt.%;
Вольфрам .15Tungsten .15
МолибденMolybdenum
Цирконий.1Zirconium.1
Титан5Titan5
НиобийОстальноеNiobiumErest
Однако отмечаютс пониженные жаростойкость на воздухе, теплопрочность при2ООО С а также коррозионна стойкость во всеклимагических услови х.However, there is a decrease in heat resistance in air, heat resistance at 2 ° C, and also corrosion resistance under all-climatic conditions.
Цель изобретени - создание припо , обеспечивающегх повышенную жаростойкости, теплопрочность и коррозионную стойкость. Это достигаетс тем, что дополнительно ввеThe purpose of the invention is the creation of solder, providing increased heat resistance, heat resistance and corrosion resistance. This is achieved by additionally
день ванадий и тантал при следующем соот ношении компонентов, вес.%:day vanadium and tantalum with the following ratio of components, wt.%:
Молибден5 -10Molybdenum5 -10
Титан10-30Titan10-30
Цирконий0,5-5Zirconium 0.5-5
ВольфрамО,Tungsten,
ВанадийО,О 5Тантал0 ,Vanadium, O 5 Tantal,
НиобийОстальное,NiobiumErest
Температура плавлени припо , 2200225О°С , а температура пайки 2300-2350 The melting point of solder is 2200225 ° С, and the soldering temperature is 2300-2350
Повышенна жаростойкость и теплопрочность па ных соединений достигаетс введением в состав припо тантала. Дл получени хорошей, коррозионной стойкости па ных сое/1инений в состав припо введен ванадий. Свойства па ных соединений, выполненных предлагаемым припоем приведены в таблице. Дл количественной оценки жаростойкое ти, теплопрочности и коррозионной стойкости па ных соединений было выплавлено несколько композиций предлагаемого припо . Указанные характеристики сравнивали по верхнему , среднему и низшему пределам содержани легирующих элементов .Increased heat resistance and heat resistance of soldered joints are achieved by the introduction of prim tantalum into the composition. In order to obtain a good corrosion resistance of solder / ion compounds, vanadium was introduced into the composition of the solder. The properties of the solder joints made by the proposed solder are listed in the table. To quantify the heat resistance, heat resistance and corrosion resistance of the solder joints, several compositions of the proposed solder were smelted. These characteristics were compared by the upper, middle, and lower limits of the content of alloying elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU2301715A SU553073A1 (en) | 1975-12-19 | 1975-12-19 | Solder for soldering molybdenum and its alloys |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU2301715A SU553073A1 (en) | 1975-12-19 | 1975-12-19 | Solder for soldering molybdenum and its alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU553073A1 true SU553073A1 (en) | 1977-04-05 |
Family
ID=20641406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU2301715A SU553073A1 (en) | 1975-12-19 | 1975-12-19 | Solder for soldering molybdenum and its alloys |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU553073A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907740A (en) * | 2015-06-15 | 2015-09-16 | 西安理工大学 | Cu-Mo-Nb welding wire for titanium-pipeline steel welding and manufacturing method thereof |
| RU2564181C1 (en) * | 2014-12-22 | 2015-09-27 | Юлия Алексеевна Щепочкина | Niobium-based alloy |
| CN108015445A (en) * | 2017-12-06 | 2018-05-11 | 中广核研究院有限公司 | Microalloying connection method and microalloying connection structure |
-
1975
- 1975-12-19 SU SU2301715A patent/SU553073A1/en active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2564181C1 (en) * | 2014-12-22 | 2015-09-27 | Юлия Алексеевна Щепочкина | Niobium-based alloy |
| CN104907740A (en) * | 2015-06-15 | 2015-09-16 | 西安理工大学 | Cu-Mo-Nb welding wire for titanium-pipeline steel welding and manufacturing method thereof |
| CN108015445A (en) * | 2017-12-06 | 2018-05-11 | 中广核研究院有限公司 | Microalloying connection method and microalloying connection structure |
| CN108015445B (en) * | 2017-12-06 | 2024-05-10 | 中广核研究院有限公司 | Microalloyed connection method and microalloyed connection structure |
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