JPS6235876B2 - - Google Patents
Info
- Publication number
- JPS6235876B2 JPS6235876B2 JP55087627A JP8762780A JPS6235876B2 JP S6235876 B2 JPS6235876 B2 JP S6235876B2 JP 55087627 A JP55087627 A JP 55087627A JP 8762780 A JP8762780 A JP 8762780A JP S6235876 B2 JPS6235876 B2 JP S6235876B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- solder
- melting point
- present
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- 230000008018 melting Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Description
本発明は、低温度でアルミニウム上へ鑞付け可
能なアルミニウム用ハンダに関するものである。
アルミシースケーブルのシースを鉛工する場
合、鉛工箇所にアルミニウム用半田を擦りつける
ことによりメツキし、このメツキ層上を鉛工して
いる。
従来、上記のアルミニウム用半田には、通常
Sn：90％（重量％、以下同じ）、Zn：10％のもの
が使用されており、その固相温度は約199℃、液
相温度は約211℃である。而るに半田メツキには
半田を固液相共存状態にまで加熱する必要があ
り、従来の上記アルミニウム用半田のメツキ温度
は199〜211℃もの高温である。
ところで、架橋ポリエチレン絶縁を施した電力
ケーブルや絶縁紙としてポリプロピレン等のプラ
スチツク合成紙を使用したアルミシースOFケー
ブルにおいては、その絶縁層の耐熱性から、上記
アルミニウム用半田のメツキ温度には制約があ
る。このため、低融点のアルミニウム用半田が開
発されている。
しかしながら、従来の低融点アルミニウム半田
においては、耐食性に劣るといつた不利がある。
例えば、Zn：５％、Pb：20％、Sn：残部の低融
点アルミニウム用半田（固相温度：170℃、液相
温度：178℃）により、アルミニウム片を面積20
×30mmでメツキし、これらアルミニウム片２枚を
鉛工半田で半田付けし、煮沸蒸温水に24時間浸漬
したところ、半田接続箇所の強度が浸漬前の480
Kgから浸漬後では110Kgに低下した。
本発明は、上述の点に鑑み、耐食性に秀れた低
融点アルミニウム用半田を提案するものである。
すなわち、本発明に係るアルミニウム用半田
は、Znが５〜10％望ましくは７〜９％、Biが５
〜13％望ましくは８〜12％、残部がSnからなる
ことを特徴とするものである。更に本発明の第２
発明はZnが５〜10％望ましくは７〜９％、Biが
５〜13％望しくは６〜８％、Sbが２〜５％望ま
しくは2.5〜４％、残部がSnからなることを特徴
とするものである。
本発明において、Znを５〜10％に限定した理
由は５％未満ではアルミニウムとのはんだ付け強
度が不足し、10％をこえるとはんだの融点が高く
なり過ぎるためである。
Biを５〜13％に限定した理由は５％未満ではは
んだの融点が高くなりすぎ、13％をこえると半田
が熱間において粘さがなくなり、鉛工盛り作業性
が悪くなるためである。
更に第２発明において、Sbを添加した理由は
はんだの耐食性をより向上させるためであり、そ
の添加量を１〜５％と限定した理由は１％未満で
は耐食性の向上がほとんど見られず添加量５％を
こえると融点が高くなりすぎるためである。
なお、本発明のアルミニウム用半田は純アルミ
ニウムのみならず各種アルミニウム合金用として
有用である。
次に、実施例、比較例により本発明を一層詳細
に説明する。第１表に各種実施例、比較例の組成
と特性を示す。
The present invention relates to an aluminum solder that can be soldered onto aluminum at low temperatures. When performing lead work on the sheath of an aluminum sheathed cable, the sheath is plated by rubbing aluminum solder onto the lead work area, and lead work is performed on this plating layer. Conventionally, the solder for aluminum mentioned above usually uses
The material used is Sn: 90% (weight %, same hereinafter) and Zn: 10%, and its solidus temperature is approximately 199°C and liquidus temperature is approximately 211°C. However, solder plating requires heating the solder to a state in which solid and liquid phases coexist, and the conventional solder plating temperature for aluminum is as high as 199 to 211°C. By the way, in power cables with cross-linked polyethylene insulation and aluminum sheathed OF cables that use plastic synthetic paper such as polypropylene as the insulation paper, there are restrictions on the plating temperature of the aluminum solder due to the heat resistance of the insulation layer. . For this reason, low melting point solders for aluminum have been developed. However, conventional low melting point aluminum solders have disadvantages such as poor corrosion resistance.
For example, an aluminum piece with an area of 20
x 30mm, soldered these two aluminum pieces with lead solder, and immersed them in boiling steamed water for 24 hours. The strength of the soldered joints was 480
Kg decreased to 110 Kg after immersion. In view of the above-mentioned points, the present invention proposes a low melting point solder for aluminum that has excellent corrosion resistance. That is, the solder for aluminum according to the present invention contains 5 to 10% Zn, preferably 7 to 9%, and 5 to 9% Bi.
~13%, preferably 8~12%, the balance being Sn. Furthermore, the second aspect of the present invention
The invention is characterized in that Zn is 5 to 10%, preferably 7 to 9%, Bi is 5 to 13%, preferably 6 to 8%, Sb is 2 to 5%, preferably 2.5 to 4%, and the balance is Sn. That is. In the present invention, the reason why Zn is limited to 5 to 10% is that if it is less than 5%, the soldering strength with aluminum is insufficient, and if it exceeds 10%, the melting point of the solder becomes too high. The reason why Bi is limited to 5 to 13% is that if it is less than 5%, the melting point of the solder will be too high, and if it exceeds 13%, the solder will lose its viscosity when hot, and the workability of lead plating will deteriorate. Furthermore, in the second invention, the reason why Sb is added is to further improve the corrosion resistance of the solder, and the reason why the amount added is limited to 1 to 5% is that if it is less than 1%, little improvement in corrosion resistance is seen, so the amount added is This is because if it exceeds 5%, the melting point will become too high. The aluminum solder of the present invention is useful not only for pure aluminum but also for various aluminum alloys. Next, the present invention will be explained in more detail with reference to Examples and Comparative Examples. Table 1 shows the compositions and properties of various examples and comparative examples.
【表】
上記の実施例低融点半田並びに比較例公知の半
田のそれぞれを、各２枚のアルミニウム片に面積
20×30mmで擦り付けによつてメツキし、このアル
ミニウム片２枚をそのメツキ箇所において通常の
鉛工半田で半田付けし、24時間蒸溜水煮沸試験を
行つたところ、その試験前後の鉛工接続箇所の引
張り強度は第２表の通りであつた。[Table] The low melting point solder of the above example and the known solder of the comparative example were applied to each of two aluminum pieces in terms of area.
The two aluminum pieces were plated with 20 x 30 mm by rubbing, and the plated parts were soldered with ordinary lead solder, and a 24-hour distilled water boiling test was conducted. The tensile strength was as shown in Table 2.
【表】
この試験結果から明らかなように、本発明によ
れば、低融点で、かつ耐食性に秀れた鉛工を可能
とするアルミニウム用半田を提供でき、プラスチ
ツク合成紙等を使用したアルミシースOFケーブ
ルのシース鉛工時での半田メツキ用に充分有用で
ある。[Table] As is clear from the test results, according to the present invention, it is possible to provide a solder for aluminum that has a low melting point and excellent corrosion resistance, and which enables lead work. It is very useful for solder plating when sheathing OF cables.
Claims (1)
らなることを特徴とするアルミニウム用半田。 ２ Znが５〜10％、Biが５〜13％、Sbが１〜５
％、残部がSnからなることを特徴とするアルミ
ニウム用半田。[Claims] 1. A solder for aluminum, characterized by comprising 5 to 10% Zn, 8 to 13% Bi, and the balance Sn. 2 Zn 5-10%, Bi 5-13%, Sb 1-5
%, the balance being Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8762780A JPS5711793A (en) | 1980-06-26 | 1980-06-26 | Solder for aluminium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8762780A JPS5711793A (en) | 1980-06-26 | 1980-06-26 | Solder for aluminium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5711793A JPS5711793A (en) | 1982-01-21 |
| JPS6235876B2 true JPS6235876B2 (en) | 1987-08-04 |
Family
ID=13920209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8762780A Granted JPS5711793A (en) | 1980-06-26 | 1980-06-26 | Solder for aluminium |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5711793A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06219089A (en) * | 1993-02-15 | 1994-08-09 | Hiroshi Sano | Paper-clipping apparatus |
| WO2002034969A1 (en) * | 2000-10-24 | 2002-05-02 | Fujitsu Limited | Alloy for solder and solder joint |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189096A (en) * | 1983-04-08 | 1984-10-26 | Senjiyu Kinzoku Kogyo Kk | Solder alloy |
| JP3232963B2 (en) * | 1994-10-11 | 2001-11-26 | 株式会社日立製作所 | Lead-free solder for connecting organic substrates and mounted products using the same |
| US6503338B1 (en) | 2000-04-28 | 2003-01-07 | Senju Metal Industry Co., Ltd. | Lead-free solder alloys |
| JP4877890B2 (en) * | 2001-06-18 | 2012-02-15 | 株式会社東京自働機械製作所 | Article supply device |
| JP2003234433A (en) | 2001-10-01 | 2003-08-22 | Matsushita Electric Ind Co Ltd | Semiconductor device, its mounting method, mounting block and its manufacturing method |
| CN100453246C (en) * | 2006-07-13 | 2009-01-21 | 昆山成利焊锡制造有限公司 | No-lead soft brazing alloy |
| CN102152022A (en) * | 2011-04-18 | 2011-08-17 | 宁波喜汉锡焊料有限公司 | Corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5255927U (en) * | 1975-10-13 | 1977-04-22 |
-
1980
- 1980-06-26 JP JP8762780A patent/JPS5711793A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06219089A (en) * | 1993-02-15 | 1994-08-09 | Hiroshi Sano | Paper-clipping apparatus |
| WO2002034969A1 (en) * | 2000-10-24 | 2002-05-02 | Fujitsu Limited | Alloy for solder and solder joint |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5711793A (en) | 1982-01-21 |
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