KR970000428A - Lead free solder with excellent mechanical properties - Google Patents

Lead free solder with excellent mechanical properties Download PDF

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Publication number
KR970000428A
KR970000428A KR1019950019011A KR19950019011A KR970000428A KR 970000428 A KR970000428 A KR 970000428A KR 1019950019011 A KR1019950019011 A KR 1019950019011A KR 19950019011 A KR19950019011 A KR 19950019011A KR 970000428 A KR970000428 A KR 970000428A
Authority
KR
South Korea
Prior art keywords
free solder
lead
mechanical properties
excellent mechanical
lead free
Prior art date
Application number
KR1019950019011A
Other languages
Korean (ko)
Other versions
KR0158600B1 (en
Inventor
유충식
김미연
윤덕용
이혁모
Original Assignee
이형도
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이형도, 삼성전자 주식회사 filed Critical 이형도
Priority to KR1019950019011A priority Critical patent/KR0158600B1/en
Priority to JP7352310A priority patent/JPH0919792A/en
Publication of KR970000428A publication Critical patent/KR970000428A/en
Application granted granted Critical
Publication of KR0158600B1 publication Critical patent/KR0158600B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 기계적 특성이 우수한 무연땜납을 제공함에 그 목적이 있다. 이러한 목적달성을 위한 본 발명은 그 조성이 중량％로, Zn 4-9％, In 2-5％, Bi 1-24％ 및 잔부Sn으로 조성되는 기계적 특성이 우수한 무연땜납에 관한 것을 그 기술적 요지로 한다.It is an object of the present invention to provide a lead-free solder having excellent mechanical properties. The present invention for achieving the object relates to a lead-free solder having excellent mechanical properties of the composition of the weight percent, Zn 4-9%, In 2-5%, Bi 1-24% and the balance Sn. Shall be.

Description

기계적 특성이 우수한 무연땜납Lead free solder with excellent mechanical properties

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 종래의 땜납과 본 발명에 의한 무연땜납에 대한 기계적 특성을 나타낸 그래프, 제2도는 종래의 땜납과 본 발명에 의한 무연땜납에 대한 응력-변형 관계를 나타내는 그래프, 제3도는 종래의 무연땜납과 본 발명에 의한 무연땜납에 대한 미세조직 사진을 나타낸다.1 is a graph showing the mechanical properties of the conventional solder and the lead-free solder according to the present invention, Figure 2 is a graph showing the stress-strain relationship between the conventional solder and the lead-free solder according to the present invention, Figure 3 is a conventional lead-free Microstructure photographs of the solder and the lead-free solder according to the present invention are shown.

Claims (5)

중량％로 Zn; 4-9％, In; 2-5％, Bi; 1-24％ 및 잔부Sn으로 조성됨을 특징으로 하는 기계적 특성이 우수한 무연땜납Zn by weight; 4-9%, In; 2-5%, Bi; Lead-free solder with excellent mechanical properties, characterized in that it is composed of 1-24% and the balance Sn 제1항에 있어서, 상기 무연땜납의 조성이 중량％로, Zn:5-9％, In:2-5％, Bi:1-10％및 잔부 Sn으로 이루어지는 무연땜납The lead-free solder according to claim 1, wherein the composition of the lead-free solder is weight percent, Zn: 5-9%, In: 2-5%, Bi: 1-10%, and balance Sn. 제1항에 있어서, 상기 무연땜납의 조성이 중량％로, Zn:7-9％, In:2-3％, Bi:4-9％및 잔부 Sn으로 이루어지는 무연땜납2. The lead-free solder according to claim 1, wherein the composition of the lead-free solder is weight percent, Zn: 7-9%, In: 2-3%, Bi: 4-9%, and the balance Sn. 제1항에 있어서, 상기 무연땜납의 조성이 중량％로, Zn:8-9％, In:4-5％, Bi:6-10％및 잔부 Sn으로 이루어지는 무연땜납The lead-free solder according to claim 1, wherein the composition of the lead-free solder is weight percent, Zn: 8-9%, In: 4-5%, Bi: 6-10%, and the balance Sn. 고상선 온도가 140-193℃이고, 액상선 온도가 167-196℃이며, Zn, In, Bi 및 Sn을 포함하여 구성됨을 특징으로 하는 기계적 특성이 우수한 무연땜납Lead-free solder with excellent mechanical properties, characterized in that the solidus temperature is 140-193 ° C, the liquidus temperature is 167-196 ° C, and is composed of Zn, In, Bi, and Sn. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950019011A 1995-06-30 1995-06-30 The solder for pb-free KR0158600B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1019950019011A KR0158600B1 (en) 1995-06-30 1995-06-30 The solder for pb-free
JP7352310A JPH0919792A (en) 1995-06-30 1995-12-28 Lead-free solder of which mechanical property is excellent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950019011A KR0158600B1 (en) 1995-06-30 1995-06-30 The solder for pb-free

Publications (2)

Publication Number Publication Date
KR970000428A true KR970000428A (en) 1997-01-21
KR0158600B1 KR0158600B1 (en) 1999-01-15

Family

ID=19419407

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950019011A KR0158600B1 (en) 1995-06-30 1995-06-30 The solder for pb-free

Country Status (2)

Country Link
JP (1) JPH0919792A (en)
KR (1) KR0158600B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100366131B1 (en) * 2001-11-21 2002-12-31 이재옥 Lead-free solder with lower melting point and lower dross

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234433A (en) 2001-10-01 2003-08-22 Matsushita Electric Ind Co Ltd Semiconductor device, its mounting method, mounting block and its manufacturing method
KR100743240B1 (en) * 2006-03-16 2007-07-27 희성소재 (주) Low temperature lead-free solder alloy
CN108213767A (en) * 2018-02-28 2018-06-29 西安理工大学 A kind of preparation method of low melting point Sn-Zn-Bi-Ga brazing filler metal alloys
CN113084391A (en) * 2021-04-12 2021-07-09 哈尔滨理工大学 Low-melting-point green flexible 3D packaging alloy

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW251249B (en) * 1993-04-30 1995-07-11 At & T Corp
JP3346848B2 (en) * 1993-08-11 2002-11-18 株式会社日本スペリア社 Lead-free solder alloy
US5455004A (en) * 1993-10-25 1995-10-03 The Indium Corporation Of America Lead-free alloy containing tin, zinc, indium and bismuth
JP3091098B2 (en) * 1994-11-01 2000-09-25 三井金属鉱業株式会社 Solder alloy for heat exchanger

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100366131B1 (en) * 2001-11-21 2002-12-31 이재옥 Lead-free solder with lower melting point and lower dross

Also Published As

Publication number Publication date
KR0158600B1 (en) 1999-01-15
JPH0919792A (en) 1997-01-21

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