JPS57127593A - Brazing alloy for adhering of ferrite - Google Patents

Brazing alloy for adhering of ferrite

Info

Publication number
JPS57127593A
JPS57127593A JP1354181A JP1354181A JPS57127593A JP S57127593 A JPS57127593 A JP S57127593A JP 1354181 A JP1354181 A JP 1354181A JP 1354181 A JP1354181 A JP 1354181A JP S57127593 A JPS57127593 A JP S57127593A
Authority
JP
Japan
Prior art keywords
alloy
brazing alloy
ferrite
adhering
amt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1354181A
Other languages
Japanese (ja)
Other versions
JPS5820719B2 (en
Inventor
Akira Kuwano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP1354181A priority Critical patent/JPS5820719B2/en
Publication of JPS57127593A publication Critical patent/JPS57127593A/en
Publication of JPS5820719B2 publication Critical patent/JPS5820719B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

PURPOSE:To improve the adhesive force and water resistance of a brazing alloy for ferrite by specifying the respective components of a Pb-Sn-Zn-Ge-Cu alloy and molding the same into the forms of a plate, a bar or a thread. CONSTITUTION:If a brazing alloy contg., by weight, 1-10% Sn, 0.5-5% Zn, 0.1-1.5% Ge, and 0.05-0.5% Cu, and consisting of the balance Pb is molded into the shape of a plate, a bar or thread by extrusion, rolling, wire drawing, etc., it can be adhered to any shape of adhering surfades by using a soldering iron. If the amt. of the Sn in the composition is too much, the m.p. lowers too low. If the amt. of the Zn is too much, the hardness increases. The Ge is a component for the purpose of increasing adhesive power. With the Cu below the lower limit, water resistance is not improved, and above the upper limit, it weakens the adhesive power. It is equally well to contain 0.2wt% one or both of Al and Sb in the Pb-Sn-Zn-Ge-Cu alloy.
JP1354181A 1981-01-30 1981-01-30 Brazing alloy for ferrite bonding Expired JPS5820719B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1354181A JPS5820719B2 (en) 1981-01-30 1981-01-30 Brazing alloy for ferrite bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1354181A JPS5820719B2 (en) 1981-01-30 1981-01-30 Brazing alloy for ferrite bonding

Publications (2)

Publication Number Publication Date
JPS57127593A true JPS57127593A (en) 1982-08-07
JPS5820719B2 JPS5820719B2 (en) 1983-04-25

Family

ID=11836005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1354181A Expired JPS5820719B2 (en) 1981-01-30 1981-01-30 Brazing alloy for ferrite bonding

Country Status (1)

Country Link
JP (1) JPS5820719B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139165A (en) * 1983-01-25 1984-08-09 Matsushita Electric Ind Co Ltd Magnetic tape device
EP0632225A1 (en) * 1993-06-30 1995-01-04 AGIP S.p.A. Improved anti-seizure protection for joints, particularly suitable for the petroleum sector
DE10237495A1 (en) * 2002-04-22 2003-11-13 Siemens Ag Solder material used in the production of electrical/electronic components using Flip-Chip technology contains aluminum

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139165A (en) * 1983-01-25 1984-08-09 Matsushita Electric Ind Co Ltd Magnetic tape device
EP0632225A1 (en) * 1993-06-30 1995-01-04 AGIP S.p.A. Improved anti-seizure protection for joints, particularly suitable for the petroleum sector
DE10237495A1 (en) * 2002-04-22 2003-11-13 Siemens Ag Solder material used in the production of electrical/electronic components using Flip-Chip technology contains aluminum

Also Published As

Publication number Publication date
JPS5820719B2 (en) 1983-04-25

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