CN106975860A - A kind of circuit board tin cream and preparation method thereof - Google Patents
A kind of circuit board tin cream and preparation method thereof Download PDFInfo
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- CN106975860A CN106975860A CN201710175031.4A CN201710175031A CN106975860A CN 106975860 A CN106975860 A CN 106975860A CN 201710175031 A CN201710175031 A CN 201710175031A CN 106975860 A CN106975860 A CN 106975860A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of circuit board tin cream, it is characterised in that includes the raw material of following parts by weight：100 140 parts of glass putty, 15 parts of bismuth meal, 80 120 parts of zinc powder, four 20 30 parts of gold chlorides of hydration, 16 30 parts of polyvinylpyrrolidone, 20 30 parts of sodium borohydride, 70 120 parts of water, 20 40 parts of rosin, 15 30 parts of butyl, 5 10 parts of dibromosuccinic acid, 0.5 1 parts of triethanolamine, 5 10 parts of thixotropic agent, 24 parts of antioxidant.The circuit board of the present invention with tin cream adhesiveness is relatively strong, not oxidizable, chemical property is stable, corrosion-resistant, the rate of spread is higher, while raw material is easy to get, cost is relatively low and preparation method simply, have a good application prospect.
Description
Technical field
The present invention relates to tin cream technical field, and in particular to a kind of circuit board tin cream and preparation method thereof.
Background technology
Solder(ing) paste is a kind of solder, and solder(ing) paste can fix electronic component on circuit boards.When it is heated to
After certain temperature, it will be melted, and soldered component is linked together with circuit board, after after fusing point cooling, that is, solidify
Form fixed solder joint.
Tin composition in existing solder(ing) paste is higher, more than the 63% of solder(ing) paste gross weight is accounted for mostly, cost is higher, simultaneously
Because the relevant environments such as European Union Rohs and REACH protect the lead in the appearance of specification, traditional leypewter in environment ban
Etc, gradually replaced with the lead-free alloy containing silver, bismuth, but silver belongs to rare non-renewable resources, as market is to electricity
Constantly expand the need for sub- product, and the cycle that electronic product updates is more and more short, silver is constantly consumed, and silver-colored valency is continuous
It is soaring, cause cost too high.
Existing lead-free solder is essentially all the alloy based on Sn, its Sn comprising vast scale and one or more
Alloying element, has one comprising the solder(ing) paste (solder(ing) paste based on Sn-Zn) based on Sn-Zn lead-free solder powder and asks
Topic：Zn is a kind of metal, because its high ionization tendency causes it to be easy to oxidation；Therefore, in the solder powder table of ingress of air
Face forms layer of oxide layer, and this causes the wetability of solder powder to reduce.Particularly, by using the weld-aiding cream based on rosin
In the solder(ing) paste based on Sn-Zn prepared, even become more by the surface oxidation that the solder powder produced is reacted with weld-aiding cream
Seriously, therefore it occur frequently that welding fault include due to the wetability of solder extreme difference result in space and formed solder sphere.
In the solder(ing) paste based on Sn-Zn, a kind of method can be used, that is, is before weld-aiding cream mixing, uses suitable thing
Solder powder surface of the matter based on Sn-Zn, to prevent solder powder from being reacted with weld-aiding cream and cause surface oxidation.It is used as coating
Material, can be used rare metal such as Ag or Pd, from the inorganic oxide of the formation such as the organo-silicon compound of hydrolysis, or organic matter
Such as imidazoles or triazole.However, this be coated with adds the manufacturing cost of solder(ing) paste, and differ and surely effectively improve solder
Property or solderability.
The content of the invention
For the defect of prior art, it is an object of the invention to provide a kind of circuit board tin cream adhesiveness it is relatively strong, be difficult
Aoxidize, chemical property is stable, corrosion-resistant, the rate of spread is higher, while raw material is easy to get, cost is relatively low and preparation method simple, have
Good application prospect.
The present invention solves technical problem and adopted the following technical scheme that：
The invention provides a kind of circuit board tin cream, it is characterised in that includes the raw material of following parts by weight：
100-140 parts of glass putty, 1-5 parts of bismuth meal, 80-120 parts of zinc powder, four 20-30 parts of gold chlorides of hydration, polyvinylpyrrolidone
16-30 parts, 20-30 parts of sodium borohydride, 70-120 parts of water, 20-40 parts of rosin, 15-30 parts of butyl, dibromosuccinic acid
5-10 parts, 0.5-1 parts of triethanolamine, 5-10 parts of thixotropic agent, 2-4 parts of antioxidant.
Preferably, the circuit board includes the raw material of following parts by weight with tin cream：
120 parts of glass putty, 3 parts of bismuth meal, 100 parts of zinc powder, four 25 parts of gold chlorides of hydration, 23 parts of polyvinylpyrrolidone, sodium borohydride
25 parts, 95 parts of water, 30 parts of rosin, 23 parts of butyl, 7 parts of dibromosuccinic acid, 0.8 part of triethanolamine, 7 parts of thixotropic agent,
3 parts of antioxidant.
Preferably, the thixotropic agent is one or more of groups in poly- phthalein amine wax, poly- phthalein polyimide resin, aliphatic acid phthalein amine wax
Close.
Preferably, the antioxidant is benzenediol.
Present invention also offers a kind of preparation method of circuit board tin cream, comprise the following steps：
Step one, glass putty, bismuth meal, zinc powder, four hydration gold chlorides, polyvinylpyrrolidone, sodium borohydride, water mixing are put into water-bath
Haptoreaction is carried out in pot, water-bath pot temperature is kept for 76-84 DEG C, and the reaction time is 3-5 hours obtained mixture A；
Step 2, rosin, butyl are mixed and added in mixer, whipping temp is 85-90 DEG C, mixing time is
1.5-2 hours, speed of agitator was 1400-1600r/min, obtained mixture B；
Step 3, dibromosuccinic acid is added into mixture B made from step 2, and mixer temperature is risen into 95-100 DEG C, stirring
Time is 50-80 minutes, and speed of agitator is that 1400-1600r/min obtains mixture C；
Step 4, is made to add thixotropic agent, antioxidant in mixture C, mixer temperature is down into 70-80 DEG C to step 3,
Mixing time is 20-40 minutes, and speed of agitator is that 1400-1600r/min obtains mixture D.
Step 5, step 3 is made to add triethanolamine in mixture D, mixer temperature is down into 30-40 DEG C, stirred
It is 20-40 minutes to mix the time, and speed of agitator is that 1400-1600r/min obtains mixing E.
Step 6, step one is obtained that mixture A is obtained that mixture is mixed in addition mixer with step 5, it will stir
The machine temperature of mixing is down to 10-30 DEG C, and mixing time is 20-40 minutes, and speed of agitator is that 1400-1600r/min obtains the tin cream.
Preferably, speed of agitator is 1500r/min in each step.
Preferably, mixer temperature in 80 DEG C of water-bath temperature, 4 hours reaction time, the step 2 in the step one
Degree is 87 DEG C, mixing time is 1.8 hours, in the step 3 mixer temperature be 97 DEG C, mixing time be 65 minutes.
Preferably, in the step 4 mixer temperature be 75 DEG C, mixing time be 30 minutes, stirred in the step 5
Machine temperature is 35 DEG C, mixing time is 30 minutes, in the step 6 mixer temperature be 20 DEG C, mixing time be 30 minutes.
Compared with prior art, the present invention has following beneficial effect：
The circuit board tin cream of the present invention is with glass putty, bismuth meal, zinc powder, four hydration gold chlorides, polyvinylpyrrolidone, sodium borohydride
The alloy component in tin cream is made, with rosin, butyl, dibromosuccinic acid, triethanolamine, thixotropic agent, antioxidant system
Obtain the scaling powder part in tin cream.Alloy component on it ensure that the excellent chemical stability of tin cream, welding temperature and the rate of spread,
The content of tin is reduced, cost is effectively reduced；Scaling powder enhances the anti-oxidant energy of tin cream partially due to the addition of antioxidant
Power so that chemical stability more preferably, reasonably from rosin, can increase tin cream adhesiveness, lift welding effect, be difficult to loosen and
Oxidation, the fixed company of enhancing welding position.
To sum up, circuit board of the invention is with tin cream adhesiveness is relatively strong, not oxidizable, chemical property is stable, corrosion-resistant, extend
Rate is higher, while raw material is easy to get, cost is relatively low and preparation method simple, has a good application prospect.
Embodiment
With reference to specific embodiment, the present invention is expanded on further.These embodiments be merely to illustrate the present invention and without
In limitation the scope of the present invention.
Embodiment 1.
The circuit board tin cream of the present embodiment, includes the raw material of following parts by weight：
100 parts of glass putty, 1 part of bismuth meal, 80 parts of zinc powder, four 20 parts of gold chlorides of hydration, 16 parts of polyvinylpyrrolidone, sodium borohydride 20
Part, 70 parts of water, 20 parts of rosin, 15 parts of butyl, 5 parts of dibromosuccinic acid, 0.5 part of triethanolamine, poly- 5 parts of phthalein amine wax,
2 parts of benzenediol.
The preparation method of the present embodiment circuit board tin cream, comprises the following steps：
Step one, glass putty, bismuth meal, zinc powder, four hydration gold chlorides, polyvinylpyrrolidone, sodium borohydride, water mixing are put into water-bath
Haptoreaction is carried out in pot, water-bath pot temperature is kept for 76 DEG C, and the reaction time is 3 hours obtained mixture A；
Step 2, rosin, butyl are mixed and added in mixer, and whipping temp is 85 DEG C, and mixing time is 1.5 small
When, speed of agitator is 1400r/min, obtains mixture B；
Step 3, dibromosuccinic acid is added into mixture B made from step 2, and mixer temperature is risen into 95-100 DEG C, stirring
Time is 50 minutes, and speed of agitator is that 1400r/min obtains mixture C；
Step 4, is made to add thixotropic agent, antioxidant in mixture C to step 3, and mixer temperature is down into 70 DEG C, stirring
Time is 20 minutes, and speed of agitator is that 1400r/min obtains mixture D.
Step 5, step 3 is made to add triethanolamine in mixture D, and mixer temperature is down into 30 DEG C, stirring
Time is 20 minutes, and speed of agitator is that 1400r/min obtains mixing E.
Step 6, step one is obtained that mixture A is obtained that mixture is mixed in addition mixer with step 5, it will stir
The machine temperature of mixing is down to 10 DEG C, and mixing time is 20 minutes, and speed of agitator is that 1400r/min obtains the tin cream.
Embodiment 2.
The circuit board tin cream of the present embodiment, includes the raw material of following parts by weight：
140 parts of glass putty, 5 parts of bismuth meal, 120 parts of zinc powder, four 30 parts of gold chlorides of hydration, PVPK30 part, sodium borohydride
30 parts, 120 parts of water, 40 parts of rosin, 30 parts of butyl, 10 parts of dibromosuccinic acid, 1 part of triethanolamine, poly- phthalein amine wax 10
Part, 4 parts of benzenediol.
The preparation method of the present embodiment circuit board tin cream, comprises the following steps：
Step one, glass putty, bismuth meal, zinc powder, four hydration gold chlorides, polyvinylpyrrolidone, sodium borohydride, water mixing are put into water-bath
Haptoreaction is carried out in pot, water-bath pot temperature is kept for 84 DEG C, and the reaction time is 5 hours obtained mixture A；
Step 2, rosin, butyl are mixed and added in mixer, and whipping temp is 90 DEG C, and mixing time is 2 small
When, speed of agitator is 1600r/min, obtains mixture B；
Step 3, dibromosuccinic acid is added into mixture B made from step 2, and mixer temperature is risen into 95-100 DEG C, stirring
Time is 80 minutes, and speed of agitator is that 1600r/min obtains mixture C；
Step 4, is made to add thixotropic agent, antioxidant in mixture C to step 3, and mixer temperature is down into 80 DEG C, stirring
Time is 40 minutes, and speed of agitator is that 1600r/min obtains mixture D.
Step 5, step 3 is made to add triethanolamine in mixture D, mixer temperature is down into 30-40 DEG C, stirred
It is 40 minutes to mix the time, and speed of agitator is that 1600r/min obtains mixing E.
Step 6, step one is obtained that mixture A is obtained that mixture is mixed in addition mixer with step 5, it will stir
The machine temperature of mixing is down to 30 DEG C, and mixing time is 40 minutes, and speed of agitator is that 1600r/min obtains the tin cream.
Embodiment 3.
The circuit board tin cream of the present embodiment, includes the raw material of following parts by weight：
120 parts of glass putty, 3 parts of bismuth meal, 100 parts of zinc powder, four 25 parts of gold chlorides of hydration, 23 parts of polyvinylpyrrolidone, sodium borohydride
25 parts, 95 parts of water, 30 parts of rosin, 23 parts of butyl, 7 parts of dibromosuccinic acid, 0.8 part of triethanolamine, poly- phthalein amine wax 7
Part, 3 parts of benzenediol.
The preparation method of the present embodiment circuit board tin cream, comprises the following steps：
Step one, glass putty, bismuth meal, zinc powder, four hydration gold chlorides, polyvinylpyrrolidone, sodium borohydride, water mixing are put into water-bath
Haptoreaction is carried out in pot, water-bath pot temperature is kept for 80 DEG C, and the reaction time is 4 hours obtained mixture A；
Step 2, rosin, butyl are mixed and added in mixer, and whipping temp is 87 DEG C, and mixing time is 1.8 small
When, speed of agitator is 1500r/min, obtains mixture B；
Step 3, dibromosuccinic acid is added into mixture B made from step 2, mixer temperature is risen into 97 DEG C, mixing time
For 65 minutes, speed of agitator was that 1500r/min obtains mixture C；
Step 4, is made to add thixotropic agent, antioxidant in mixture C to step 3, and mixer temperature is down into 75 DEG C, stirring
Time is 30 minutes, and speed of agitator is that 1500r/min obtains mixture D.
Step 5, step 3 is made to add triethanolamine in mixture D, and mixer temperature is down into 35 DEG C, stirring
Time is 30 minutes, and speed of agitator is that 1500r/min obtains mixing E.
Step 6, step one is obtained that mixture A is obtained that mixture is mixed in addition mixer with step 5, it will stir
The machine temperature of mixing is down to 20 DEG C, and mixing time is 30 minutes, and speed of agitator is that 1500r/min obtains the tin cream.
Embodiment 4.
The circuit board tin cream of the present embodiment, includes the raw material of following parts by weight：
110 parts of glass putty, 2 parts of bismuth meal, 90 parts of zinc powder, four 22 parts of gold chlorides of hydration, 20 parts of polyvinylpyrrolidone, sodium borohydride 22
Part, 80 parts of water, 25 parts of rosin, 20 parts of butyl, 7 parts of dibromosuccinic acid, 1 part of triethanolamine, poly- 7 parts of phthalein amine wax, benzene
3 parts of diphenol.
The preparation method of the present embodiment circuit board tin cream, comprises the following steps：
Step one, glass putty, bismuth meal, zinc powder, four hydration gold chlorides, polyvinylpyrrolidone, sodium borohydride, water mixing are put into water-bath
Haptoreaction is carried out in pot, water-bath pot temperature is kept for 78 DEG C, and the reaction time is 4 hours obtained mixture A；
Step 2, rosin, butyl are mixed and added in mixer, and whipping temp is 88 DEG C, and mixing time is 1.8 small
When, speed of agitator is 1550r/min, obtains mixture B；
Step 3, dibromosuccinic acid is added into mixture B made from step 2, mixer temperature is risen into 98 DEG C, mixing time
For 60 minutes, speed of agitator was that 1550r/min obtains mixture C；
Step 4, is made to add thixotropic agent, antioxidant in mixture C to step 3, and mixer temperature is down into 75 DEG C, stirring
Time is 25 minutes, and speed of agitator is that 1500r/min obtains mixture D.
Step 5, step 3 is made to add triethanolamine in mixture D, and mixer temperature is down into 35 DEG C, stirring
Time is 25 minutes, and speed of agitator is that 1550r/min obtains mixing E.
Step 6, step one is obtained that mixture A is obtained that mixture is mixed in addition mixer with step 5, it will stir
The machine temperature of mixing is down to 15 DEG C, and mixing time is 25 minutes, and speed of agitator is that 1550r/min obtains the tin cream.
The circuit board tin cream of the present invention is with glass putty, bismuth meal, zinc powder, four hydration gold chlorides, polyvinylpyrrolidone, boron hydrogen
Change the alloy component that sodium is made in tin cream, with rosin, butyl, dibromosuccinic acid, triethanolamine, thixotropic agent, antioxygen
The scaling powder part in tin cream is made in agent.The circuit board of the present invention is steady with tin cream adhesiveness relatively strong, not oxidizable, chemical property
Fixed, the corrosion-resistant, rate of spread is higher, while raw material is easy to get, cost is relatively low and preparation method simple, has a good application prospect.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It may be appreciated other embodiment.
Claims (8)
1. a kind of circuit board tin cream, it is characterised in that include the raw material of following parts by weight：100-140 parts of glass putty, bismuth meal 1-5
Part, 80-120 parts of zinc powder, four 20-30 parts of gold chlorides of hydration, 16-30 parts of polyvinylpyrrolidone, 20-30 parts of sodium borohydride, water
70-120 parts, 20-40 parts of rosin, 15-30 parts of butyl, 5-10 parts of dibromosuccinic acid, 0.5-1 parts of triethanolamine, touch
Become 5-10 parts of agent, 2-4 parts of antioxidant.
2. circuit board tin cream according to claim 1, it is characterised in that the tin cream includes the original of following parts by weight
Material：120 parts of glass putty, 3 parts of bismuth meal, 100 parts of zinc powder, four 25 parts of gold chlorides of hydration, 23 parts of polyvinylpyrrolidone, sodium borohydride 25
It is part, 95 parts of water, 30 parts of rosin, 23 parts of butyl, 7 parts of dibromosuccinic acid, 0.8 part of triethanolamine, 7 parts of thixotropic agent, anti-
3 parts of oxygen agent.
3. circuit board tin cream according to claim 1 or 2, it is characterised in that the thixotropic agent is poly- phthalein
One or more of combinations in amine wax, poly- phthalein polyimide resin, aliphatic acid phthalein amine wax.
4. circuit board tin cream according to claim 1 or 2, it is characterised in that the antioxidant is benzenediol.
5. the preparation method of circuit board tin cream according to claim 1 or 2, it is characterised in that comprise the following steps：
Step one, glass putty, bismuth meal, zinc powder, four hydration gold chlorides, polyvinylpyrrolidone, sodium borohydride, water mixing are put into water-bath
Haptoreaction is carried out in pot, water-bath pot temperature is kept for 76-84 DEG C, and the reaction time is 3-5 hours obtained mixture A；
Step 2, rosin, butyl are mixed and added in mixer, whipping temp is 85-90 DEG C, mixing time is
1.5-2 hours, speed of agitator was 1400-1600r/min, obtained mixture B；
Step 3, dibromosuccinic acid is added into mixture B made from step 2, and mixer temperature is risen into 95-100 DEG C, stirring
Time is 50-80 minutes, and speed of agitator is that 1400-1600r/min obtains mixture C；
Step 4, is made to add thixotropic agent, antioxidant in mixture C, mixer temperature is down into 70-80 DEG C to step 3,
Mixing time is 20-40 minutes, and speed of agitator is that 1400-1600r/min obtains mixture D；
Step 5, step 3 is made to add triethanolamine in mixture D, mixer temperature is down into 30-40 DEG C, during stirring
Between be 20-40 minute, speed of agitator be 1400-1600r/min obtain mixing E；
Step 6, step one is obtained that mixture A is obtained that mixture is mixed in addition mixer with step 5, by mixer
Temperature is down to 10-30 DEG C, and mixing time is 20-40 minutes, and speed of agitator is that 1400-1600r/min obtains the tin cream.
6. the preparation method of circuit board tin cream according to claim 5, it is characterised in that stirring turns in each step
Speed is 1500r/min.
7. the preparation method of circuit board tin cream according to claim 5, it is characterised in that water-bath in the step one
In 80 DEG C of temperature, 4 hours reaction time, the step 2 mixer temperature be 87 DEG C, mixing time be 1.8 hours, the step
In rapid three mixer temperature be 97 DEG C, mixing time be 65 minutes.
8. the preparation method of circuit board tin cream according to claim 3, it is characterised in that mixer in the step 4
Temperature is 75 DEG C, mixing time is 30 minutes, in the step 5 mixer temperature be 35 DEG C, mixing time be 30 minutes, institute
State mixer temperature in step 6 be 20 DEG C, mixing time be 30 minutes.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710175031.4A CN106975860A (en) | 2017-03-22 | 2017-03-22 | A kind of circuit board tin cream and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710175031.4A CN106975860A (en) | 2017-03-22 | 2017-03-22 | A kind of circuit board tin cream and preparation method thereof |
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| CN106975860A true CN106975860A (en) | 2017-07-25 |
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| CN201710175031.4A Withdrawn CN106975860A (en) | 2017-03-22 | 2017-03-22 | A kind of circuit board tin cream and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1132673A (en) * | 1994-10-11 | 1996-10-09 | 株式会社日立制作所 | Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same |
| CN1887501A (en) * | 2006-07-13 | 2007-01-03 | 昆山成利焊锡制造有限公司 | No-lead soft brazing alloy |
| CN104858563A (en) * | 2015-04-30 | 2015-08-26 | 东莞市晨锦电子新材料有限公司 | Dedicated tin paste for LED and preparation method thereof |
| JP2016026883A (en) * | 2014-07-02 | 2016-02-18 | 住友金属鉱山株式会社 | Bi-Sn-Zn BASED SOLDER ALLOY FOR MEDIUM TO LOW TEMPERATURES AND SOLDER PASTE |
| CN105397343A (en) * | 2015-11-26 | 2016-03-16 | 芜湖雅葆轩电子科技有限公司 | Solder paste for signal processing substrate and preparation method thereof |
-
2017
- 2017-03-22 CN CN201710175031.4A patent/CN106975860A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1132673A (en) * | 1994-10-11 | 1996-10-09 | 株式会社日立制作所 | Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same |
| CN1887501A (en) * | 2006-07-13 | 2007-01-03 | 昆山成利焊锡制造有限公司 | No-lead soft brazing alloy |
| JP2016026883A (en) * | 2014-07-02 | 2016-02-18 | 住友金属鉱山株式会社 | Bi-Sn-Zn BASED SOLDER ALLOY FOR MEDIUM TO LOW TEMPERATURES AND SOLDER PASTE |
| CN104858563A (en) * | 2015-04-30 | 2015-08-26 | 东莞市晨锦电子新材料有限公司 | Dedicated tin paste for LED and preparation method thereof |
| CN105397343A (en) * | 2015-11-26 | 2016-03-16 | 芜湖雅葆轩电子科技有限公司 | Solder paste for signal processing substrate and preparation method thereof |
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Application publication date: 20170725 |