CN102936669B - Low-melting-point lead-free solder alloy - Google Patents
Low-melting-point lead-free solder alloy Download PDFInfo
- Publication number
- CN102936669B CN102936669B CN201210494897.9A CN201210494897A CN102936669B CN 102936669 B CN102936669 B CN 102936669B CN 201210494897 A CN201210494897 A CN 201210494897A CN 102936669 B CN102936669 B CN 102936669B
- Authority
- CN
- China
- Prior art keywords
- solder alloy
- free solder
- alloy
- melting point
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a low-melting-point lead-free solder alloy which belongs to the technical field of welding materials and is used for solving the problem that the conventional solder alloys are high in melting point and low in shearing strength. The low-melting-point lead-free solder alloy comprises the following components in percentage by weight: 10-30% of Bi, 2.2-3.0% of Ag, 0.5-1.0% of In, 0.004-0.008% of P and the balance being tin. The low-melting-point lead-free solder alloy also can comprise 0.002-0.005% of RE and 0.002-0.005% of Co. According to the low-melting-point lead-free solder alloy, the melting point is low, the alloy eutectic temperature is about 170-200 DEG C, the shearing strength is good and between 21-28N/mm<2>, the RE is capable of improving the glossliness of the solder alloy and refining the grains, the Co is capable of improving the soldering performance and the shock resistance, and Zr has the function of homogenizing and refining the alloy tissues.
Description
Technical field
The present invention relates to a kind of scolder, relate in particular to a kind of low melting point lead-free solder alloy, belong to technical field of welding materials.
Background technology
All the time, Sn-Pb alloy, as the main encapsulating material of electronics industry, is occupied an leading position at electronic unit fit on, yet because lead and lead compound thereof belong to extremely toxic substance, human body is had to great toxicity.Especially in recent years along with the enhancing of people's environmental consciousness with for the concern of self health, lead contamination is more and more subject to people's attention; And the taboo leads example that various countries propose in recent years makes Electronic Packaging industry have higher requirement to pb-free solder, and ripe tin-lead solder must be substituted by lead-free solder.
The lead-free solder that current industry is comparatively approved mainly be take Sn-Ag-Cu as representative, because it easily obtains, technical problem is relatively also less, and better with conventional solder compatibility, reliability is higher, although it has avoided adopting the plumbous raw material as scolder,, Sn-Ag-Cu lead-free solder is except cost of alloy factor, its the most fatal weakness is that alloy melting point is higher than Sn-Pb scolder, and Sn-Ag-Cu is that eutectic temperature is 217 ℃ to compare Sn-Pb eutectic solder fusing point be 183 ℃ high 34 ℃.Make easily to cause fire damage for the poor components and parts of heat resistance, cause planar substrates flexural deformation, strengthen the possibility of its damage.This just means that employing Sn-Ag-Cu lead-free solder has proposed stern challenge to a series of engineerings such as heat resistance of welding equipment, welding procedure, electronic component and baseplate material.
As Chinese patent application (publication number: CN101257995A, open day: on 09 03rd, 2008) a kind of solder composition is disclosed, said composition comprises tin, indium, silver and bismuth, and comprises about tin of 30% to 85% and about indium of 15% to 65%, also can further comprise copper.And further to limit silver-colored content be 1% to 10%, the content of bismuth is 0.25% to 6%, and the content of copper is 0.25% to 0.75%.In this solder alloy, the content of bismuth content less and indium is relatively high, although bismuth add the intensity that can improve scolder, but cannot reach desirable temperature requirement.Meanwhile, the amount of adding as the In of noble metal is too much, has increased greatly production cost.Therefore, in order to improve the quality of solder alloy and to consider the requirement of Electronic Assemblies process conditions, required lead-free solder should meet the following conditions: fusing point is low, and alloy eutectic temperature is similar to 183 ℃ of the eutectic temperatures of Sn-Pb, roughly between 180 ℃～200 ℃; There is good wetability; Satisfactory mechanical property, solder joint will have the requirements such as enough mechanical strengths and thermal ageing resistant performance.
Summary of the invention
The present invention is directed to the defect existing in above prior art, a kind of low melting point lead-free solder alloy is provided, there is the low and good effect of shear strength of solder alloy fusing point.
The object of the invention is to be achieved by the following technical programs, a kind of low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:10%～30%; Ag:2.2%～3.0%; In:0.5%～1.0%; P:0.004%～0.008%; All the other are tin.
Low melting point lead-free solder alloy of the present invention, reduces the temperature of solder alloy by adding Bi, Sn-Bi is that scolder can form in the wide melting range of 139 ℃～232 ℃, and its fusing point approaches the eutectic temperature of Sn-Pb solder alloy most in the time of 180 ℃.Although, Sn-Bi is that the fusing point of scolder eutectic is only 139 ℃, low temperature 160 ℃ of left and right just can be assembled, but because Bi is hard fragility, have soldering coarse microstructure and inhomogeneous phenomenon, if the amount adding conference cause alloy cannot be made into wire, during welding because high-temperature impacts easy to crack, and if the amount adding very little, be not enough to reduce the temperature of solder alloy.In existing scolder, have the content of Bi is controlled to 40%～60% or be controlled at below 5%, although the former can reach the effect that reduces solder temperature, the fragility that Bi itself presents just, the too high levels of Bi, can make scolder present hard fragility, make the shear strength of scolder too poor; And the content of the latter Bi very little, although can guarantee the intensity of scolder, temperature cannot reach desirable requirement.Therefore, the present invention is controlled at 10%～30% by the content of Bi, thereby can either reach the effect that reduces solder temperature, can guarantee again the shear strength performance of scolder, meanwhile, and by adding Ag and In to improve the alloy property of scolder; And simultaneously by adding a small amount of P element, can improve the antioxygenic property of scolder and reduce the oxidized degree of scolder, reduce the generation of scruff.Solder alloy eutectic temperature of the present invention is 170 ℃～200 ℃ left and right.
In above-mentioned low melting point lead-free solder alloy, described Ag can form Sn-Ag eutectic (Ag3Sn) with Sn matrix, improves the mechanical property of scolder, if but that the amount of Ag is added is too many, can increase the cost of scolder; If added very little, the effect that improves mechanical property is not remarkable.
In above-mentioned low melting point lead-free solder alloy, between described In and Bi, there is synergy, can play equally the effect of the fusing point that reduces solder alloy, can also improve the physical property of solder alloy simultaneously, increase the brightness of scolder and improve the effect of prolonging the rate of liter.
As preferably, in above-mentioned low melting point lead-free solder alloy, described leadless welding alloy contains the percentage by weight of following composition:
Bi:15%～25%; Ag:2.3%～2.8%; In:0.6%～0.8%; P:0.005%～0.006%; All the other are tin.
As further preferred, in above-mentioned low melting point lead-free solder alloy, described leadless welding alloy contains the percentage by weight of following composition:
Bi:25%; Ag:2.5%; In:0.8%; P:0.0058%; All the other are tin.
In above-mentioned low melting point lead-free solder alloy, low melting point lead-free solder alloy in described preferable range, can further guarantee that the fusing point of solder alloy of the present invention more approaches the fusing point of Sn-Pb solder alloy (183 ℃), between 180 ℃～200 ℃, thereby better realize both unleadedly, can reach again requirement and the better advantage of shear strength of leaded fusing point.
In above-mentioned low melting point lead-free solder alloy, it is 0.002%～0.005% RE that described leadless welding alloy also contains percentage by weight, and described RE is mishmetal.Can improve the glossiness of solder alloy, the effect of crystal grain thinning, simultaneously can also and scolder in Bi and In element between form synergy, further play the performance that reduces temperature and guarantee shear strength.As preferably, described RE is selected from two or more in La, Pr, Er, Dy, Nd.As further preferred, described described RE is La, Pr, Er and Dy; Wherein, the weight ratio of La:Pr:Er:Dy is 1:0.5～0.8:0.2～0.4:0.3～0.6.
In above-mentioned low melting point lead-free solder alloy, in described low melting point lead-free solder alloy, also contain percentage by weight and be 0.0002%～0.0005% Co.Add Co to play to improve brazing property and the impact resistance of solder alloy.
In above-mentioned low melting point lead-free solder alloy, in described low melting point lead-free solder alloy, also contain percentage by weight and be 0.0001%～0.0005% Zr.Add Zr to play homogenizing alloy structure, the effect of refinement alloy structure, simultaneously with Bi synergy, can also improve the shear strength performance of solder alloy, improves the existing hard fragility defect of Bi element.
Low melting point lead-free solder alloy of the present invention is according to the method preparation of this area routine.
In sum, the present invention has the following advantages:
1. low melting point lead-free solder alloy of the present invention, has lower fusing point, and alloy eutectic temperature is 170 ℃～200 ℃ left and right, and has the effect that shear strength is good simultaneously, and shear strength is at 21N/mm2～28N/mm
2between, alloy structure is even, and the advantage that physical property is good is applicable to the poor electronic apparatus assembling industry of heat resistance.
2. low melting point lead-free solder alloy of the present invention, only need add the elements such as a small amount of In, Ag, without adding a large amount of noble metals as elements such as In, thereby also can play the effect reducing costs, and the present invention is by adding RE mishmetal, can improve the glossiness of solder alloy, the effect of crystal grain thinning, further plays the performance that reduces temperature and guarantee shear strength.
3. low melting point lead-free solder alloy of the present invention, improves brazing property and the impact resistance of solder alloy by adding Co to play; Add Zr to play homogenizing alloy structure, the effect of refinement alloy structure, can also further improve the shear strength performance of solder alloy, improves scolder because of the defect of the existing hard fragility of Bi element that adds.
The specific embodiment
Below by specific embodiment, technical scheme of the present invention is described in further detail, but the present invention is not limited to these embodiment.
Embodiment 1
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:10%; Ag:2.8%; I n:0.5%; P:0.005%; Surplus is Sn, also can comprise inevitable impurity.
Low melting point lead-free solder alloy in the present embodiment adopts following methods to prepare:
According to the percentage by weight of the Bi in the present embodiment, Ag, In, P and Sn, take required raw material, join in stove, be then warmed up to 300 ℃ of meltings, then, put into mixer and fully stir 40 minutes, then cast molding, low melting point lead-free solder alloy of the present invention obtained.
Embodiment 2
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:15%; Ag:2.8%; In:0.5%; P:0.0052%; Surplus is Sn, also can comprise inevitable impurity.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 3
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:20%; Ag:2.5%; In:0.8%; P:0.0055%; Surplus is Sn, also can comprise inevitable impurity.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 4
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:25%; Ag:2.5%; In:0.8%; P:0.0058%; Surplus is Sn, also can comprise inevitable impurity.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 5
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:30%; Ag:2.2%; In:1.0%; P:0.006%; Surplus is Sn, also can comprise inevitable impurity.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 6
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:27%; Ag:3.0%; In:0.6%; P:0.004%; Surplus is Sn, also can comprise inevitable impurity.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 7
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:20%; Ag:2.3%; In:0.7%; P:0.0055%; RE:0.002%, described RE is mishmetal; Surplus is Sn, also can comprise inevitable impurity.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 8
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:22%; Ag:2.4%; In:0.6%; P:0.0057%; RE:0.005%, described RE is mishmetal; Co:0.0005%; Surplus is Sn, also comprises inevitable impurity.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 9
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:18%; Ag:2.5%; In:0.7%; P:0.0055%; RE:0.003%, described RE is mishmetal; Co:0.0002%; Zr:0.0001%; Surplus is Sn, also comprises inevitable impurity.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 10
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:28%; Ag:2.6%; In:0.8%; P:0.008%; Co:0.0004%; Surplus is Sn, also can comprise inevitable impurity.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 11
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:20%; Ag:2.3%; In:0.7%; P:0.0055%; RE:0.002%, described RE is mishmetal, and surplus is Sn, also can comprise inevitable impurity, and described RE mishmetal is the mishmetal of La and Dy, and the weight ratio of La:Dy is 1:0.5.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 12
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:23%; Ag:2.5%; In:1.0%; P:0.0055%; RE:0.005%, described RE is mishmetal, and surplus is Sn, also can comprise inevitable impurity, and described RE mishmetal is the mishmetal of La and Nd, and the weight ratio of La:Dy is 1:0.6.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 13
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:20%; Ag:2.3%; In:0.7%; P:0.0055%; RE:0.002%, described RE is mishmetal, and surplus is Sn, also can comprise inevitable impurity, and described RE mishmetal is the mishmetal of La, Pr, Er and Dy; Wherein, the weight ratio of La:Pr:Er:Dy is 1:0.8:0.4:0.3.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 14
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:25%; Ag:2.5%; In:0.5%; P:0.005%; RE:0.003%, described RE is mishmetal; Co:0.0004%; Surplus is Sn, also can comprise inevitable impurity, and described RE mishmetal is the mishmetal of La, Pr, Er and Dy; Wherein, the weight ratio of La:Pr:Er:Dy is 1:0.5:0.2:0.6.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 15
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:25%; Ag:2.3%; In:0.5%; P:0.0055%; RE:0.003%, described RE is mishmetal; Co:0.0005%; Surplus is Sn, also can comprise inevitable impurity, and described RE mishmetal is the mishmetal of La, Pr, Er and Dy; Wherein, the weight ratio of La:Pr:Er:Dy is 1:0.6:0.3:0.4.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 16
A low melting point lead-free solder alloy, the percentage by weight that this leadless welding alloy contains following composition:
Bi:20%; Ag:2.8%; In:0.8%; P:0.0065%; RE:0.004%, described RE is mishmetal; Co:0.0004%; Zr:0.0005%; Surplus is Sn, also can comprise inevitable impurity, and described RE mishmetal is the mishmetal of La, Pr, Er and Dy; Wherein, the weight ratio of La:Pr:Er:Dy is 1:0.5:0.35:0.5.
The preparation method of the low-melting point leadless scolder in the present embodiment is consistent with the method described in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Choose at random the low melting point lead-free solder alloy obtaining in above-described embodiment, the performance of its liquidus temperature, solidus temperature, shear strength and percentage elongation is tested, concrete test result is shown in following table 1.
Table 1:
Specific embodiment described in invention is only to the explanation for example of the present invention's spirit.Those skilled in the art can make various modifications or supplement or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Although the present invention has been made a detailed description and has quoted as proof some specific embodiments, to those skilled in the art, only otherwise it is obvious leaving that the spirit and scope of the present invention can make various changes or revise.
Claims (4)
1. a low melting point lead-free solder alloy, is characterized in that, the percentage by weight that this leadless welding alloy contains following composition:
Bi:15%～25%; Ag:2.3%～2.8%; In:0.6%～0.8%; P:0.005%～0.006%; RE:0.002%～0.005%; All the other are tin;
Described RE is mishmetal, and described RE is selected from two or more in La, Pr, Er, Dy, Nd.
2. low melting point lead-free solder alloy according to claim 1, is characterized in that, the percentage by weight that this leadless welding alloy contains following composition:
Bi:25%; Ag:2.5%; In:0.8%; P:0.0058%; All the other are tin.
3. low melting point lead-free solder alloy according to claim 1, is characterized in that, described RE is La, Pr, Er and Dy; Wherein, the weight ratio of La:Pr:Er:Dy is 1:0.5～0.8:0.2～0.4:0.3～0.6.
4. low melting point lead-free solder alloy according to claim 1, is characterized in that, also contains percentage by weight and be 0.0002%～0.0005% Co.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210494897.9A CN102936669B (en) | 2012-11-28 | 2012-11-28 | Low-melting-point lead-free solder alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210494897.9A CN102936669B (en) | 2012-11-28 | 2012-11-28 | Low-melting-point lead-free solder alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102936669A CN102936669A (en) | 2013-02-20 |
| CN102936669B true CN102936669B (en) | 2014-09-10 |
Family
ID=47695590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210494897.9A Active CN102936669B (en) | 2012-11-28 | 2012-11-28 | Low-melting-point lead-free solder alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102936669B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105382443A (en) * | 2015-12-18 | 2016-03-09 | 黄河水电光伏产业技术有限公司 | Alloy welding flux, preparation method thereof and application thereof |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013013296B4 (en) * | 2013-08-12 | 2020-08-06 | Schott Ag | Converter-heat sink assembly with metallic solder connection and method for its production |
| JP6197619B2 (en) * | 2013-12-09 | 2017-09-20 | 富士通株式会社 | Electronic device and method of manufacturing electronic device |
| CN103722303A (en) * | 2013-12-23 | 2014-04-16 | 苏州宏泉高压电容器有限公司 | Zirconium-gold-silver welding material and preparation method thereof |
| CN105583547A (en) * | 2016-03-11 | 2016-05-18 | 深圳市同方电子新材料有限公司 | SnBi lead-free solder and preparation method thereof |
| CN106244851B (en) * | 2016-08-31 | 2018-12-28 | 西安泰力松新材料股份有限公司 | A kind of low temperature tin alloy and preparation method thereof |
| CN106624433A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Low-melting-point lead-free solder alloy |
| CN106695159A (en) * | 2016-11-30 | 2017-05-24 | 安徽华众焊业有限公司 | Tin-bismuth series lead-free solder and preparation method thereof |
| CN106624432A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Low-melting-point tin bismuth solder alloy |
| CN106624434A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Tin antimony solder alloy |
| CN106695161A (en) * | 2016-12-29 | 2017-05-24 | 安徽华众焊业有限公司 | Pb-free Sn-Bi alloy solder and preparation method thereof |
| TWI622653B (en) * | 2017-05-25 | 2018-05-01 | 綠點高新科技股份有限公司 | Solder alloy and solder composition |
| CN108004429A (en) * | 2017-11-29 | 2018-05-08 | 广西厚思品牌策划顾问有限公司 | A kind of low melting point lead-free solder alloy and preparation method thereof |
| CN108971793B (en) * | 2018-08-24 | 2021-04-23 | 云南科威液态金属谷研发有限公司 | Low-temperature lead-free solder |
| FR3101561B1 (en) * | 2019-10-06 | 2023-09-22 | Pruvost Jean Claude Lucien | Lead-free solder alloy called SIA based on Sn and Bi and Cu and Ag additives limited to 1%. |
| CN114055007B (en) * | 2021-11-16 | 2023-03-14 | 陕西众森电能科技有限公司 | Superfine low-temperature soldering tin powder, soldering paste, preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1139605A (en) * | 1995-06-30 | 1997-01-08 | 三星电机株式会社 | Non-lead solder with fine weldability |
| CN1442271A (en) * | 2003-04-11 | 2003-09-17 | 深圳市亿铖达工业有限公司 | Leadless soft brazing alloy |
| CN101700606A (en) * | 2009-11-27 | 2010-05-05 | 浙江一远电子科技有限公司 | Sn-Ag-Cu misch metal lead-free solder with low content of Cu and preparation method thereof |
-
2012
- 2012-11-28 CN CN201210494897.9A patent/CN102936669B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1139605A (en) * | 1995-06-30 | 1997-01-08 | 三星电机株式会社 | Non-lead solder with fine weldability |
| CN1442271A (en) * | 2003-04-11 | 2003-09-17 | 深圳市亿铖达工业有限公司 | Leadless soft brazing alloy |
| CN101700606A (en) * | 2009-11-27 | 2010-05-05 | 浙江一远电子科技有限公司 | Sn-Ag-Cu misch metal lead-free solder with low content of Cu and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105382443A (en) * | 2015-12-18 | 2016-03-09 | 黄河水电光伏产业技术有限公司 | Alloy welding flux, preparation method thereof and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102936669A (en) | 2013-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102936669B (en) | Low-melting-point lead-free solder alloy | |
| TWI383052B (en) | Low silver solder alloy and solder paste composition | |
| EP2277657B1 (en) | Lead-free solder | |
| CN105195915A (en) | Low-temperature lead-free solder alloy | |
| GB2421030A (en) | Solder alloy | |
| CN103341699A (en) | Unleaded Sn-In-Ag brazing filler metal replacing tin-lead brazing filler metal | |
| CN102699563A (en) | Low-silver lead-free soft solder | |
| JPWO2005102594A1 (en) | Solder and mounted products using it | |
| CN101716702A (en) | Multi-component alloy cadmium-free low-silver solder | |
| CN103008904B (en) | SnCuNiGaGeIn serial silver-free and lead-free solder alloy | |
| CN103406686A (en) | Co-included Sn-Bi-based high-strength lead-free low-temperature welding flux | |
| CN101992362A (en) | Oxidation-resistant lead-free solder alloy suitable for powder process | |
| CN101716705B (en) | Multi-alloy cadmium-free phosphor-free copper-based solder | |
| CN100467192C (en) | Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus | |
| CN101927410B (en) | Sn-Ag-Zn-Bi-Cr lead-free solder | |
| CN102172805A (en) | Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof | |
| CN101579790B (en) | Sn-Ag-Cu lead-free solder containing Nd, Li, As and In | |
| EP1707302B1 (en) | Pb-free solder alloy compositions comprising essentially tin (Sn), silver (Ag), copper (Cu), and phosphorus (P) | |
| EP4299238A2 (en) | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications | |
| CN1203960C (en) | Oxidation-inhibited lead-free welding materials | |
| CN102642097A (en) | Low-silver lead-free solder alloy | |
| CN1313631C (en) | Tin silver copper nickel aluminium series leadless welding flux alloy | |
| CN101733575A (en) | Tin-zinc-bismuth-copper leadless solder with low cost and welding spot thereof | |
| CN101537547B (en) | Sn-Ag-Cu lead-free solder containing Nd, Ni and Co | |
| CN100496861C (en) | A tin-zinc selenium alloy welding flux |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170808 Address after: 200233 Shanghai City, Xuhui District Road No. 159 15 Tianzhou room unit 804 Patentee after: Shanghai Yuan Yuan Electronic Technology Co., Ltd. Address before: Xianju Hengxi Town Industrial Park Taizhou city Zhejiang province 317312 a far electronic technology limited company Patentee before: YIYUAN Electronic Technology Co., Ltd. |