CN106695161A - Pb-free Sn-Bi alloy solder and preparation method thereof - Google Patents
Pb-free Sn-Bi alloy solder and preparation method thereof Download PDFInfo
- Publication number
- CN106695161A CN106695161A CN201611247759.5A CN201611247759A CN106695161A CN 106695161 A CN106695161 A CN 106695161A CN 201611247759 A CN201611247759 A CN 201611247759A CN 106695161 A CN106695161 A CN 106695161A
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- China
- Prior art keywords
- alloy
- lead
- free
- snbiag
- free solder
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Abstract
The invention discloses Pb-free Sn-Bi alloy solder and a preparation method thereof and belongs to the technical field of Pb-free new material manufacturing. The Pb-free Sn-Bi alloy solder comprises the following components in percentage by weight: 16-18% of Bi, 0.3-0.8% of Ag, 0.1-0.3% of Fe, 0.1-0.3% of Zn, 0.1-0.3% of Sb and the balance Sn. The melting point of the Pb-free Sn-Bi alloy solder is 156-165 DEG C and meets the welding temperature requirement of components in the microelectronic industry. Moreover, the Pb-free Sn-Bi alloy solder has good wettability and spreadability, high bonding strength and good ductility for various semiconductor materials with different properties in the microelectronic industry.
Description
Technical field
The present invention relates to a kind of lead-free solder, and in particular to a kind of for the lead-free solder of sn-bi alloy and its preparation side
Method, belongs to unleaded and is made new material technology field.
Background technology
Lead was a kind of harmful metallic element, early in European Union ROHS (Restriction of Hazardous in 2003
Substances, refers to use the instruction of some harmful components on being limited in electronic and electrical equipment) instruction regulation enters Europe
The electronics and IT products in continent can not contain lead, mercury, cadmium, Cr VI, PBBs and PBDEs, before electronic product assembling
Welding and electronic component in making more uses tin-lead solder.Although the lead-free solder field of China is started late, with
Developed country compares still gap, but in order to improve the adaptability of itself product, keeps up with the demand of international market, in analysis
On the basis of the conventional lead-free solder in current domestic and international market, it is proposed by substantial amounts of experimental study a kind of for making pressure-sensitive electricity
Hinder the multi-component leadless solder of device, its electrical property, mechanical property, with the wetting and spreading performance of piezoresistor semiconductor substrate and weldering
Intensity etc. is connect to have reached and used the similar effect of tin-lead solder, it is ensured that export to European Union electronic product integrally realize it is unleaded
The requirement of change.
Tin-lead solder is with a long history, but with the high request to the cognition of Lead Toxicity and electronics industry development butt welding point, nothing
Kupper solder gradually instead of conventional tin-lead solders.Solder has the applicating history of more than 20 years, and it is mainly characterized by can
Welded below 183 DEG C, therefore to the strong adaptability of element, saving energy consumption, reduction disposal of pollutants.Current solder
Mainly there are two kinds of Sn-Bi systems and Sn-In systems, because In is a kind of rare expensive metal so that the application of Sn-In solders is limited, because
This bianry alloy Sn-Bi (especially SnBi58) is often used the occasion in low-temperature welding demand.Sn-Bi systems solder is in temperature wider
There is identical elastic modelling quantity in the range of degree with Sn-Pb, and many physicochemical characteristics of Bi are similar to Pb, the use of Bi can be with
Reduce fusing point, reduce surface tension, the addition of Bi reduces the reaction speed of Sn and Ag, so there is preferable wetability；In addition
Sn-Bi systems solder contains relatively low Sn contents, so as to reduce tin risk high (such as tin palpus).But bismuth also brings other problems,
Influence including its composition to alloy mechanical property is changed greatly, and easily produces low melting point problem (low melting point can be formed after inclined tin
Eutectic), boundary layer is unstable to cause reliability poor, particularly Sn-Bi solders deviate eutectic composition when due to melting range it is larger,
Easily occur dendritic segregation and tissue coarsening in process of setting, unequal power distribution causes easily peelable harm in addition, and natural
Supply is few, reserves are limited etc., and this causes the research of Sn-Bi systems solder and using at a low tide always.
The content of the invention
The present invention provides a kind of lead-free solder of sn-bi alloy and preparation method thereof, solve existing Sn-Bi solders due to
Boundary layer is unstable to cause poor reliability and easily peelable problem.
The technical proposal of the invention is realized in this way：
A kind of lead-free solder of sn-bi alloy is composed of the following components by weight percentage：Bi16~18%, Ag0.3~
0.8%th, Fe0.1~0.3%, Zn0.1~0.3%, Sb0.1~0.3%, balance of Sn.
Wherein it is preferred to, a kind of lead-free solder of sn-bi alloy is composed of the following components by weight percentage：Bi17
~18%, Ag0.4~0.6%, Fe0.1~0.3%, Zn0.1~0.3%, Sb0.1~0.3%, balance of Sn.
A kind of preparation method of the lead-free solder of sn-bi alloy, comprises the following steps：
(1) Sn, Bi and Ag are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiAg intermediate alloys；
(2) in the SnBiAg intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiAg
The surface of gold covers anti-oxidation solvent, and alloy is heated into 250~400 DEG C, is incubated 15~25min, removes Surface Oxygen slugging, pours
Note and alloy ingot blank is made in mould, and silk, bar, sheet products are further processed into according to technological requirement.
The Ag that the present invention participates in about 0.5% in Sn-Bi alloys can obviously improve its tensile property, be primarily due in weldering
Material has been internally formed Ag-Sn intermetallic compounds (Ag3Sn).Improve the binding ability of solder joint and use reliability, and send out
Now the Bi constituent content high due to reducing resistivity in Sn-Bi-Ag solders, greatly improved conduction, the heat conduction of solder to have
Effect is alleviated solder joint and is generated heat in use Fatigue Failures.
Fe particle dispersion phases are added in Sn-Bi eutectic alloys, microstructure is refined and stabilize, the anti-of alloy is enhanced
Croop property.
The fusing point lead-free solder suitable with SnPb37 of sn-bi alloy solder prepared by the present invention, can be used in electronic product
In each technique of manufacture, not SnPb solders can be completely taken, had broad application prospects.
Lead-free solder fusing point of the invention is 178~192 DEG C, meets each component of microelectronic industry to welding temperature
It is required that.Also, the semi-conducting material wetting and spreading with the various different performances of microelectronic industry is good, adhesion is strong, and ductility is good,
0.2% bends and stretches intensity reaches more than 30MPa, and tensile strength reaches more than 35MPa, elongation percentage more than 70%, and solder side is without pit
Bubble-free, smooth, high-temperature soldering nondiscolouring, corrosion stability is excellent.
Specific embodiment
The technical scheme in the embodiment of the present invention is clearly and completely described below, it is clear that described embodiment
Only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, the common skill in this area
All other embodiment that art personnel are obtained under the premise of creative work is not made, belongs to the model of present invention protection
Enclose.
Embodiment 1
It is composed of the following components by weight percentage that the present embodiment provides a kind of lead-free solder of sn-bi alloy：
Bi17%, Ag0.5%, Fe0.2%, Zn0.2%, Sb0.2%, balance of Sn.
The preparation method of the lead-free solder of above-mentioned sn-bi alloy, comprises the following steps：
(1) Sn, Bi and Ag are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiAg intermediate alloys；
(2) in the SnBiAg intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiAg
The surface of gold covers anti-oxidation solvent, and alloy is heated into 350 DEG C, is incubated 35min, removes Surface Oxygen slugging, is cast in mould
In be made alloy ingot blank, and thread product is further processed into according to technological requirement.
Embodiment 2
It is composed of the following components by weight percentage that the present embodiment provides a kind of lead-free solder of sn-bi alloy：
Bi16%, Ag0.8%, Fe0.1%, Zn0.3%, Sb0.1%, balance of Sn.
The preparation method of the lead-free solder of above-mentioned sn-bi alloy, comprises the following steps：
(1) Sn, Bi and Ag are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiAg intermediate alloys；
(2) in the SnBiAg intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiAg
The surface of gold covers anti-oxidation solvent, and alloy is heated into 250 DEG C, is incubated 45min, removes Surface Oxygen slugging, is cast in mould
In be made alloy ingot blank, and strip-shaped product is further processed into according to technological requirement.
Embodiment 3
It is composed of the following components by weight percentage that the present embodiment provides a kind of lead-free solder of sn-bi alloy：
Bi18%, Ag0.3%, Fe0.3%, Zn0.1%, Sb0.3%, balance of Sn.
The preparation method of the lead-free solder of above-mentioned sn-bi alloy, comprises the following steps：
(1) Sn, Bi and Ag are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiAg intermediate alloys；
(2) in the SnBiAg intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiAg
The surface of gold covers anti-oxidation solvent, and alloy is heated into 400 DEG C, is incubated 25min, removes Surface Oxygen slugging, is cast in mould
In be made alloy ingot blank, and sheet products are further processed into according to technological requirement.
Embodiment 4
It is composed of the following components by weight percentage that the present embodiment provides a kind of lead-free solder of sn-bi alloy：
Bi17%, Ag0.4%, Fe0.1%, Zn0.1%, Sb0.3%, balance of Sn.
The preparation method of the lead-free solder of above-mentioned sn-bi alloy, comprises the following steps：
(1) Sn, Bi and Ag are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiAg intermediate alloys；
(2) in the SnBiAg intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiAg
The surface of gold covers anti-oxidation solvent, and alloy is heated into 300 DEG C, is incubated 40min, removes Surface Oxygen slugging, is cast in mould
In be made alloy ingot blank, and silk, bar, sheet products are further processed into according to technological requirement.
Embodiment 5
It is composed of the following components by weight percentage that the present embodiment provides a kind of lead-free solder of sn-bi alloy：
Bi17%, Ag0.6%, Fe0.3%, Zn0.1%, Sb0.3%, balance of Sn.
The preparation method of the lead-free solder of above-mentioned sn-bi alloy, comprises the following steps：
(1) Sn, Bi and Ag are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiAg intermediate alloys；
(2) in the SnBiAg intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiAg
The surface of gold covers anti-oxidation solvent, and alloy is heated into 350 DEG C, is incubated 40min, removes Surface Oxygen slugging, is cast in mould
In be made alloy ingot blank, and silk, bar, sheet products are further processed into according to technological requirement.
The physicochemical property of lead-free solder obtained in above-described embodiment is as follows：
As seen from the above table, lead-free solder fusing point of the invention is 156~165 DEG C, meets each component of microelectronic industry
Requirement to welding temperature.Also, the semi-conducting material wetting and spreading with the various different performances of microelectronic industry is good, adhesion
By force, ductility is good.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (3)
1. a kind of lead-free solder of sn-bi alloy, it is characterised in that composed of the following components by weight percentage：Bi16~
18%th, Ag 0.3~0.8%, Fe0.1~0.3%, Zn0.1~0.3%, Sb0.1~0.3%, balance of Sn.
2. the lead-free solder of a kind of sn-bi alloy according to claim 1, it is characterised in that by weight percentage by with
The following group is grouped into：It is Bi17~18%, Ag0.4~0.6%, Fe0.1~0.3%, Zn0.1~0.3%, Sb0.1~0.3%, remaining
It is Sn to measure.
3. the preparation method of the sn-bi alloy lead-free solder described in a kind of claim 1 or 2, it is characterised in that including following step
Suddenly：
(1) Sn, Bi and Ag are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiAg intermediate alloys；
(2) in the SnBiAg intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, in SnBiAg intermediate alloys
Surface covers anti-oxidation solvent, and alloy is heated into 250~400 DEG C, is incubated 15~25min, removes Surface Oxygen slugging, is cast in
Alloy ingot blank is made in mould, and silk, bar, sheet products are further processed into according to technological requirement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611247759.5A CN106695161A (en) | 2016-12-29 | 2016-12-29 | Pb-free Sn-Bi alloy solder and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611247759.5A CN106695161A (en) | 2016-12-29 | 2016-12-29 | Pb-free Sn-Bi alloy solder and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106695161A true CN106695161A (en) | 2017-05-24 |
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ID=58905952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611247759.5A Pending CN106695161A (en) | 2016-12-29 | 2016-12-29 | Pb-free Sn-Bi alloy solder and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108161271A (en) * | 2017-12-27 | 2018-06-15 | 北京康普锡威科技有限公司 | A kind of SnPbBiSb systems low temperature enhancing solder and preparation method thereof |
| CN108857147A (en) * | 2018-06-29 | 2018-11-23 | 陕西图灵电子科技有限公司 | A kind of tin bismuth preformed solder production technology |
| CN112342417A (en) * | 2020-11-17 | 2021-02-09 | 昆明理工大学 | Tin-based solder and preparation method thereof |
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| EP0787559A1 (en) * | 1996-02-09 | 1997-08-06 | Matsushita Electric Industrial Co., Ltd. | Soldering alloy, cream solder and soldering method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108161271A (en) * | 2017-12-27 | 2018-06-15 | 北京康普锡威科技有限公司 | A kind of SnPbBiSb systems low temperature enhancing solder and preparation method thereof |
| CN108161271B (en) * | 2017-12-27 | 2021-06-01 | 北京康普锡威科技有限公司 | SnPbBiSb series low-temperature reinforced solder and preparation method thereof |
| CN108857147A (en) * | 2018-06-29 | 2018-11-23 | 陕西图灵电子科技有限公司 | A kind of tin bismuth preformed solder production technology |
| CN112342417A (en) * | 2020-11-17 | 2021-02-09 | 昆明理工大学 | Tin-based solder and preparation method thereof |
| CN112342417B (en) * | 2020-11-17 | 2022-03-15 | 昆明理工大学 | Tin-based solder and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |
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| RJ01 | Rejection of invention patent application after publication |