CN103484720B - The Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization - Google Patents
The Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization Download PDFInfo
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- CN103484720B CN103484720B CN201310346749.7A CN201310346749A CN103484720B CN 103484720 B CN103484720 B CN 103484720B CN 201310346749 A CN201310346749 A CN 201310346749A CN 103484720 B CN103484720 B CN 103484720B
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- fusible alloy
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- thermal cutoffs
- fusible
- fusing point
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- 229910000743 fusible alloy Inorganic materials 0.000 title claims abstract description 43
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 25
- 239000000956 alloy Substances 0.000 claims abstract description 25
- 230000008018 melting Effects 0.000 abstract description 12
- 238000002844 melting Methods 0.000 abstract description 12
- 229910052787 antimony Inorganic materials 0.000 abstract description 4
- 229910052797 bismuth Inorganic materials 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 229910052738 indium Inorganic materials 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 229910052718 tin Inorganic materials 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 6
- 230000004927 fusion Effects 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000005491 wire drawing Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The invention discloses the Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization, obtained by Ag, Cu, Bi, In, Sb and Sn combination; Its mass percent is: Ag:1.0-3.8; Cu:0.3-1.0; Bi:0.0-3.0; In:16-22; Sb:0.0-2.0; All the other are Sn, and the purity of this alloy is not less than 99.99%.The fusible alloy of the program possesses the precise melting point of 183 ° ± 3 DEG C, possesses good welding property simultaneously, and the safety fuse of its encapsulated moulding has good corrosion resistance.
Description
Technical field
The present invention relates to the Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization.
Background technology
Fusible alloy is that a kind of temperature of fusion scope is little, to the solder of thermotonus sensitivity, and requires good mechanical property and welding property.Be widely used in the connecting material of Electronic Packaging; Thermal Cutoffs in the devices such as fire-fighting, electrical equipment, fire alarm is the low melting point alloy type material that a class has development potentiality.
Thermal Cutoffs a kind of exceed rated function temperature in temperature and (make the temperature that Thermal Cutoffs conduction state changes; refer to the rated function temperature definition of GB GB9816-20093.10) time; the thermal sensing element of the protected circuit of energy quick acting switching-off, wherein the rated function temperature of Thermal Cutoffs depends primarily on the fusing point of fusible alloy.
Its chemical composition of fusible alloy that Thermal Cutoffs uses, mainly based on tin, adds some low melting point compositions: as bismuth, indium, antimony, lead, zinc etc., be configured to the alloy of various fusing point by suitable composition proportion.But along with issuing of the unleaded instructions such as Rohs, Pb etc. are non-, and environmental protection composition is sternly prohibitted the use, therefore need to develop a series of Lead-free fusible alloy to replace lead-containing alloy, the fusing point be especially widely used is the Sn-37Pb eutectic alloy of 183 DEG C.And the special construction of Thermal Cutoffs is in the fact of weak acid environment for a long time with it, requires that this kind of fusible alloy has good mechanical property, corrosion resistance and antioxidant property.
The lead-free brazing be widely studied has Sn-3.0Ag-0.5Cu, and its fusing point is 217 DEG C; The fusing point of Sn-9Zn is 199 DEG C, and anticorrosive poor with antioxidant property, and particularly after there is burn into oxidation, its poor effect that fuses, the situation that cannot effectively fuse because of oxidation even can occur; Sn-57Bi fusing point is 139 DEG C, and plasticity is poor, easily ruptures.Above alloy all cannot replace Sn-37Pb eutectic alloy to be used as fusible alloy due to the difference of its fusing point, and the Thermal Cutoffs achieved possesses the precise melting point of 183 ° ± 3 DEG C, has good erosion resistance, oxidation-resistance and plasticity simultaneously.
Summary of the invention
For existing Lead-free fusible alloy in the defect taking into account corrosion resistance and fusing point and cannot reach 183 ° ± 3 DEG C, the present invention proposes a kind of Lead-free fusible alloy, and use it to become a kind of Thermal Cutoffs, make its fusing point accurately, there is good erosion resistance and oxidation-resistance; Its technical scheme is as follows:
A kind of fusible alloy, its component and corresponding mass percent comprise:
Ag：1.0-3.8；
Cu：0.3-1.0；
Bi：0.0-3.0；
In：16-22；
Sb：0.0-2.0；
Surplus is Sn; Wherein the purity of this alloy is not less than 99.99%.
As a class preferred version of this alloy, its component and mass percent are:
Ag：2.0-3.0；
Cu：0.4-0.6；
Bi：1.3-1.5；
In：18-20；
Sb：0.3-0.7；
Surplus is Sn.
A kind of Thermal Cutoffs, it forms in a kind of fusible alloy, and its component of this fusible alloy and corresponding mass percent comprise:
Ag：1.0-3.8；
Cu：0.3-1.0；
Bi：1.0-3.0；
In：16-22；
Sb：0.1-2.0；
Surplus is Sn; Wherein the purity of this alloy is not less than 99.99%.
As the preferred version of this safety fuse, its component and mass percent are:
Ag：2.0-3.0；
Cu：0.4-0.6；
Bi：1.3-1.5；
In：18-20；
Sb：0.3-0.7；
Surplus is Sn.
The beneficial effect of this programme has:
The program achieves the standard performance of traditional leaded Thermal Cutoffs on the one hand, comprises the precise melting point possessing 183 ° ± 3 DEG C, meanwhile, than the Thermal Cutoffs containing zinc, has good anticorrosive, antioxidant property.
Except Thermal Cutoffs, this programme can also apply to solder field in fact, directly can use as soldering tin material, instead of leaded scheme; There is stable accurate fusing point, environmental protection, anticorrosive, oxidation resistant over-all properties.
Embodiment
Embodiment one:
Be below the embodiment of the present invention one, weigh following component according to following mass percent: 1.0Ag; 0.3Cu; 1.0Bi; 16In; 0.1Sb, surplus is Sn.The purity of whole component is that 99.99%, In and Bi has the effect reducing alloy melting point; And the major function of Ag, Cu, Sb relates to and reduces temperature of fusion scope and improve wettability simultaneously; In addition, the object of adding Ag, Sb improves the antioxidant property in safety fuse big current, sour environment especially.
In Stainless Steel Kettle, add the metal of said components, melting, by chill mould casting, obtain the fusible alloy ingot of as cast condition.
After acquisition fusible alloy ingot, alloy carries out fusing point test:
From melted as cast condition fusible alloy ingot, random intercepting 8mg carries out the fusing point test of alloy, and heating top temperature is 230 DEG C, and heating rate is 10 DEG C/MIN.To be tested complete after, carry out temperature of fusion analysis.Learn that the temperature range of this alloy melting is 182-186 DEG C.
After examining the fusing point performance of alloy, the then wettability of beta alloy, can prepare fusible alloy silk after all qualified.
The fusible alloy ingot of fusing point and wettability test passes is carried out wire-drawing shape by extrusion machine, can obtain different size specification, good mechanical properties, fusible alloy silk that wettability is good.The fusible alloy silk obtained being encapsulated as Thermal Cutoffs, then the operating temperature of probe temperature safety fuse, is 183-186 DEG C, average 185.6 DEG C
Embodiment two:
Be below the embodiment of the present invention two, weigh following component according to following mass percent: 3.8Ag; 1.0Cu; 3.0Bi; 22In; 2.0Sb, surplus is Sn.The purity of whole component is 99.99%.
Adopt the method for high-frequency induction to heat, weighed said components, put into Stainless Steel Kettle and carry out melting, cast, obtains the fusible alloy ingot of as cast condition.
After acquisition fusible alloy ingot, alloy carries out fusing point test:
From melted as cast condition fusible alloy ingot, random intercepting 8mg carries out the fusing point test of alloy, and maximum heating temperature is 230 DEG C, and heating rate is 10 DEG C/MIN.To be tested complete after, carry out temperature of fusion analysis.Learn that this alloy melting temperature range is 180-184 DEG C.
Examine the fusing point performance of alloy, namely prepare fusible alloy silk, the fusible alloy ingot of fusing point test passes is carried out wire-drawing shape by extrusion machine, can obtain different size specification, good mechanical properties, fusible alloy silk that wettability is good.
The fusible alloy silk obtained being encapsulated as Thermal Cutoffs, then the operating temperature of probe temperature safety fuse, is 181-184 DEG C, average 181.7 DEG C: alloy tensile is the form of hollow fibre by this embodiment, still has good mechanical property.
Embodiment three:
The component of the embodiment of the present invention three and mass percentage content are: Ag2.0; Cu0.5; Bi1.5; In18; Sb1.1; Surplus is Sn.
Adopt method melting in Stainless Steel Kettle of high-frequency induction, obtain the fusible alloy ingot of as cast condition.
After acquisition fusible alloy ingot, alloy carries out fusing point test:
From melted as cast condition fusible alloy ingot, random intercepting 8mg carries out the fusing point test of alloy, and maximum heating temperature is 230 DEG C, and heating rate is 10 DEG C/MIN.To be tested complete after, carry out temperature of fusion analysis.Learn that this alloy melting temperature range is about 182-185 DEG C.This alloy pig is carried out wire-drawing shape by extrusion machine, then the fusible alloy silk obtained is encapsulated as Thermal Cutoffs, then the operating temperature of probe temperature safety fuse, be 182-185 DEG C, average 182.5 DEG C
The above, be only present pre-ferred embodiments, therefore can not limit scope of the invention process according to this, the equivalence change namely done according to the scope of the claims of the present invention and description with modify, all should still belong in scope that the present invention contains.
Claims (4)
1. a fusible alloy, is characterized in that: its component and corresponding mass percent comprise:
Ag：1.0-3.8；
Cu：0.3-1.0；
Bi：0.0-3.0；
In：16-22；
Sb：0.0-2.0；
Surplus comprises Sn; Wherein the purity of this alloy is not less than 99.99%.
2. a kind of fusible alloy according to claim 1, is characterized in that: its component and mass percent are:
Ag：2.0-3.0；
Cu：0.4-0.6；
Bi：1.3-1.5；
In：18-20；
Sb：0.3-0.7；
Surplus is Sn.
3. a Thermal Cutoffs, is characterized in that: it forms in a kind of fusible alloy, and its component of fusible alloy and the mass percent that form its main body are:
Ag：1.0-3.8；
Cu：0.3-1.0；
Bi：1.0-3.0；
In：16-22；
Sb：0.1-2.0；
Surplus is Sn; Wherein the purity of this alloy is not less than 99.99%.
4. a kind of Thermal Cutoffs according to claim 3, is characterized in that: its component of fusible alloy and the mass percent that form its main body are:
Ag：2.0-3.0；
Cu：0.4-0.6；
Bi：1.3-1.5；
In：18-20；
Sb：0.3-0.7；
Surplus is Sn.
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| CN201310346749.7A CN103484720B (en) | 2013-08-09 | 2013-08-09 | The Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization |
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| CN201310346749.7A CN103484720B (en) | 2013-08-09 | 2013-08-09 | The Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization |
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| CN103484720A CN103484720A (en) | 2014-01-01 |
| CN103484720B true CN103484720B (en) | 2016-01-06 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531586A (en) * | 2016-12-21 | 2017-03-22 | 国网上海市电力公司 | Grid type fuse wire sheet with inverse-time characteristic curve |
| CN109216128A (en) * | 2017-06-30 | 2019-01-15 | 厦门赛尔特电子有限公司 | A kind of high voltage direct current thermal cut-off |
| CN206976273U (en) | 2017-06-30 | 2018-02-06 | 厦门赛尔特电子有限公司 | A kind of HVDC thermal cut-off |
| CN109894768B (en) * | 2019-03-29 | 2021-06-18 | 东莞市千岛金属锡品有限公司 | Preparation method of low-temperature lead-free alloy solder |
| CN115476069A (en) * | 2022-10-28 | 2022-12-16 | 云南锡业集团（控股）有限责任公司研发中心 | Five-membered or six-membered lead-free tin-based solder with low Ag, high thermal stability and high toughness |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
| US6176947B1 (en) * | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
| CN1503294A (en) * | 2002-11-26 | 2004-06-09 | ���Ű�˹̩�˹ɷ�����˾ | Alloy type thermal fuse and material for a thermal fuse element |
| CN101341266A (en) * | 2005-08-30 | 2009-01-07 | 美国铟泰公司 | Technique for increasing the compliance of tin-indium solders |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000141078A (en) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | Leadless solder |
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2013
- 2013-08-09 CN CN201310346749.7A patent/CN103484720B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
| US6176947B1 (en) * | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
| CN1503294A (en) * | 2002-11-26 | 2004-06-09 | ���Ű�˹̩�˹ɷ�����˾ | Alloy type thermal fuse and material for a thermal fuse element |
| CN101341266A (en) * | 2005-08-30 | 2009-01-07 | 美国铟泰公司 | Technique for increasing the compliance of tin-indium solders |
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Denomination of invention: Fusible alloy and temperature fuse applying same Effective date of registration: 20191224 Granted publication date: 20160106 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN SET ELECTRONICS Co.,Ltd. Registration number: Y2019990000795 |
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