CN103484720A - Fusible alloy and temperature fuse applying same - Google Patents
Fusible alloy and temperature fuse applying same Download PDFInfo
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- CN103484720A CN103484720A CN201310346749.7A CN201310346749A CN103484720A CN 103484720 A CN103484720 A CN 103484720A CN 201310346749 A CN201310346749 A CN 201310346749A CN 103484720 A CN103484720 A CN 103484720A
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- fusible alloy
- alloy
- fusible
- fusing point
- temperature
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- 229910000743 fusible alloy Inorganic materials 0.000 title claims abstract description 44
- 229910045601 alloy Inorganic materials 0.000 claims description 23
- 239000000956 alloy Substances 0.000 claims description 23
- 230000008018 melting Effects 0.000 abstract description 10
- 238000002844 melting Methods 0.000 abstract description 10
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 6
- 230000004927 fusion Effects 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- 238000005491 wire drawing Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The invention discloses a fusible alloy and temperature fuse applying the same. The fusible alloy is obtained by combining the following components in percentage by weight: 1.0%-3.8% of Ag, 0.3%-1.0% of Cu, 0.0%-3.0% of Bi, 16%-22% of In, 0.0%-2.0% of Sb and the balance of Sn. The purity of the fusible alloy is not less than 99.99%. The fusible alloy disclosed by the invention has the advantages of accuracy in melting point at 183+/-3 DEG C and good welding property. The temperature fuse formed by being packaged by applying the fusible alloy has good corrosion resistant property.
Description
Technical field
The present invention relates to the Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization.
Background technology
Fusible alloy is that a kind of temperature of fusion scope is little, to the solder of thermotonus sensitivity, and requires to have mechanical property and welding property preferably.Be widely used in the connecting material of Electronic Packaging; Thermal Cutoffs in the device such as fire-fighting, electrical equipment, fire alarm is the low melting point alloy type material that a class has development potentiality.
Thermal Cutoffs is a kind ofly in temperature, to surpass the rated function temperature (temperature that the Thermal Cutoffs conduction state is changed; refer to the rated function temperature definition of GB GB9816-20093.10) time; the thermal sensing element of the protected circuit of energy quick acting switching-off, wherein the rated function temperature of Thermal Cutoffs depends primarily on the fusing point of fusible alloy.
Its chemical composition of fusible alloy that Thermal Cutoffs is used is mainly to take tin as basis, adds some low melting point compositions: as bismuth, indium, antimony, lead, zinc etc., be configured to the alloy of various fusing points by suitable composition proportion.But, along with issuing of the unleaded instructions such as Rohs, Pb etc. are non-, and the environmental protection composition is sternly banned use of, therefore need a series of unleaded fusible alloys of exploitation to replace lead-containing alloy, the Sn-37Pb eutectic alloy that the fusing point especially be widely used is 183 ℃.And the special construction of Thermal Cutoffs and its fact in weak acid environment for a long time, require this class fusible alloy that mechanical property, corrosion resistance and antioxidant property are preferably arranged.
The lead-free brazing be widely studied has Sn-3.0Ag-0.5Cu, and its fusing point is 217 ℃; The fusing point of Sn-9Zn is 199 ℃, and anticorrosive poor with antioxidant property, and particularly, after the burn into oxidation occurring, its poor effect that fuses, even the situation that can't effectively fuse because of oxidation can occur; The Sn-57Bi fusing point is 139 ℃, and plasticity is poor, easily fracture.Above alloy is because the difference of its fusing point all can't replace the Sn-37Pb eutectic alloy to be used as fusible alloy, and the Thermal Cutoffs achieved possesses the accurate fusing point of 183 ° ± 3 ℃, has good erosion resistance, oxidation-resistance and plasticity simultaneously.
Summary of the invention
Can't reach the defect of 183 ° ± 3 ℃ for existing unleaded fusible alloy taking into account corrosion resistance and fusing point, the present invention proposes a kind of unleaded fusible alloy, and use it to become a kind of Thermal Cutoffs, make its fusing point accurately, there is good erosion resistance and oxidation-resistance; Its technical scheme is as follows:
A kind of fusible alloy, its component and corresponding mass percent comprise:
Ag：1.0-3.8；
Cu：0.3-1.0；
Bi：0.0-3.0；
In：16-22；
Sb：0.0-2.0；
Surplus is Sn; Wherein the purity of this alloy is not less than 99.99%.
As a class preferred version of this alloy, its component and mass percent are:
Ag：2.0-3.0；
Cu：0.4-0.6；
Bi：1.3-1.5；
In：18-20；
Sb：0.3-0.7；
Surplus is Sn.
A kind of Thermal Cutoffs, it forms in a kind of fusible alloy, and its component of this fusible alloy and corresponding mass percent comprise:
Ag：1.0-3.8；
Cu：0.3-1.0；
Bi：1.0-3.0；
In：16-22；
Sb：0.1-2.0；
Surplus is Sn; Wherein the purity of this alloy is not less than 99.99%.
As the preferred version of this safety fuse, its component and mass percent are:
Ag：2.0-3.0；
Cu：0.4-0.6；
Bi：1.3-1.5；
In：18-20；
Sb：0.3-0.7；
Surplus is Sn.
The beneficial effect of this programme has:
This scheme has realized the standard performance of traditional leaded Thermal Cutoffs on the one hand, comprises possessing 183 ° ± the accurate fusing point of 3 ℃, and simultaneously, the Thermal Cutoffs than containing zinc, have good anticorrosive, antioxidant property.
Except Thermal Cutoffs, this programme can also apply to the scolder field in fact, can directly as soldering tin material, use, and has substituted leaded scheme; Have and stablize accurate fusing point, environmental protection, anticorrosive, oxidation resistant over-all properties.
Embodiment
Embodiment mono-:
Below the embodiment of the present invention one, according to the following component of following mass percent weighing: 1.0Ag; 0.3Cu; 1.0Bi; 16In; 0.1Sb surplus is Sn.All the purity of component is that 99.99%, In and Bi have the effect that reduces alloy melting point; And the major function of Ag, Cu, Sb relates to and dwindles the temperature of fusion scope and improve wettability simultaneously; In addition, the purpose of interpolation Ag, Sb is to improve especially the antioxidant property in the large electric current of safety fuse, sour environment.
The metal that adds said components in Stainless Steel Kettle, melting, by the chill mould casting, obtain the fusible alloy ingot of as cast condition.
After obtaining the fusible alloy ingot, alloy carries out the fusing point test:
From melted as cast condition fusible alloy ingot, random intercepting 8mg carries out the fusing point test of alloy, and the heating top temperature is 230 ℃, and heating rate is 10 ℃/MIN.After to be tested completing, carry out the temperature of fusion analysis.The temperature range of learning this alloy melting is 182-186 ℃.
After having checked the fusing point performance of alloy, the wettability of beta alloy then, can prepare the fusible alloy silk after all qualified.
The fusible alloy ingot of fusing point and wettability test passes is carried out to wire-drawing shape by extrusion machine, can obtain the fusible alloy silk different size specification, good mechanical properties, that wettability is good.The fusible alloy silk obtained is encapsulated as to Thermal Cutoffs, and then the operating temperature of probe temperature safety fuse, be 183-186 ℃, 185.6 ℃ of averages
Embodiment bis-:
Below the embodiment of the present invention two, according to the following component of following mass percent weighing: 3.8Ag; 1.0Cu; 3.0Bi; 22In; 2.0Sb surplus is Sn.All the purity of component is 99.99%.
Adopt the method for high-frequency induction to be heated, the good said components of weighing, put into Stainless Steel Kettle and carry out melting, pours into a mould, and obtains the fusible alloy ingot of as cast condition.
After obtaining the fusible alloy ingot, alloy carries out the fusing point test:
From melted as cast condition fusible alloy ingot, random intercepting 8mg carries out the fusing point test of alloy, and maximum heating temperature is 230 ℃, and heating rate is 10 ℃/MIN.After to be tested completing, carry out the temperature of fusion analysis.Learn that this alloy melting temperature range is 180-184 ℃.
Check the fusing point performance of alloy, prepared the fusible alloy silk, the fusible alloy ingot of fusing point test passes has been carried out to wire-drawing shape by extrusion machine, can obtain the fusible alloy silk different size specification, good mechanical properties, that wettability is good.
The fusible alloy silk obtained is encapsulated as to Thermal Cutoffs, and then the operating temperature of probe temperature safety fuse, be 181-184 ℃, 181.7 ℃ of averages: this embodiment is stretched as alloy the form of hollow fibre, still has good mechanical property.
Embodiment tri-:
The component of the embodiment of the present invention three and mass percentage content are: Ag2.0; Cu0.5; Bi1.5; In18; Sb1.1; Surplus is Sn.
Adopt method melting in Stainless Steel Kettle of high-frequency induction, obtain the fusible alloy ingot of as cast condition.
After obtaining the fusible alloy ingot, alloy carries out the fusing point test:
From melted as cast condition fusible alloy ingot, random intercepting 8mg carries out the fusing point test of alloy, and maximum heating temperature is 230 ℃, and heating rate is 10 ℃/MIN.After to be tested completing, carry out the temperature of fusion analysis.Learn that this alloy melting temperature range is about 182-185 ℃.This alloy pig is carried out to wire-drawing shape by extrusion machine, then the fusible alloy silk obtained is encapsulated as to Thermal Cutoffs, then the operating temperature of probe temperature safety fuse, be 182-185 ℃, 182.5 ℃ of averages
The above, only for preferred embodiment of the present invention, therefore can not limit according to this scope of the invention process, the equivalence of doing according to the scope of the claims of the present invention and description changes and modifies, and all should still belong in the scope that the present invention contains.
Claims (4)
1. a fusible alloy, it is characterized in that: its component and corresponding mass percent comprise:
Ag：1.0-3.8；
Cu：0.3-1.0；
Bi：0.0-3.0；
In：16-22；
Sb：0.0-2.0；
Surplus is Sn; Wherein the purity of this alloy is not less than 99.99%.
2. a kind of fusible alloy according to claim 1, it is characterized in that: its component and mass percent are:
Ag：2.0-3.0；
Cu：0.4-0.6；
Bi：1.3-1.5；
In：18-20；
Sb：0.3-0.7；
Surplus is Sn.
3. a Thermal Cutoffs, it is characterized in that: it forms in a kind of fusible alloy, and its component of fusible alloy and the mass percent that form its main body are:
Ag：1.0-3.8；
Cu：0.3-1.0；
Bi：1.0-3.0；
In：16-22；
Sb：0.1-2.0；
Surplus is Sn; Wherein the purity of this alloy is not less than 99.99%.
4. a kind of Thermal Cutoffs according to claim 3, it is characterized in that: its component of fusible alloy and the mass percent that form its main body are:
Ag：2.0-3.0；
Cu：0.4-0.6；
Bi：1.3-1.5；
In：18-20；
Sb：0.3-0.7；
Surplus is Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310346749.7A CN103484720B (en) | 2013-08-09 | 2013-08-09 | The Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310346749.7A CN103484720B (en) | 2013-08-09 | 2013-08-09 | The Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103484720A true CN103484720A (en) | 2014-01-01 |
| CN103484720B CN103484720B (en) | 2016-01-06 |
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| CN201310346749.7A Active CN103484720B (en) | 2013-08-09 | 2013-08-09 | The Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531586A (en) * | 2016-12-21 | 2017-03-22 | 国网上海市电力公司 | Grid type fuse wire sheet with inverse-time characteristic curve |
| CN109216128A (en) * | 2017-06-30 | 2019-01-15 | 厦门赛尔特电子有限公司 | A kind of high voltage direct current thermal cut-off |
| CN109894768A (en) * | 2019-03-29 | 2019-06-18 | 东莞市千岛金属锡品有限公司 | A kind of low temperature leadless alloy solder and preparation method thereof |
| US11049683B2 (en) | 2017-06-30 | 2021-06-29 | Xiamen Set Electronics Co., Ltd | High-voltage direct-current thermal fuse |
| CN115476069A (en) * | 2022-10-28 | 2022-12-16 | 云南锡业集团（控股）有限责任公司研发中心 | Five-membered or six-membered lead-free tin-based solder with low Ag, high thermal stability and high toughness |
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| US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
| JP2000141078A (en) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | Leadless solder |
| US6176947B1 (en) * | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
| CN1503294A (en) * | 2002-11-26 | 2004-06-09 | ���Ű�˹̩�˹ɷ�����˾ | Alloy type thermal fuse and material for a thermal fuse element |
| CN101341266A (en) * | 2005-08-30 | 2009-01-07 | 美国铟泰公司 | Technique for increasing the compliance of tin-indium solders |
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2013
- 2013-08-09 CN CN201310346749.7A patent/CN103484720B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
| JP2000141078A (en) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | Leadless solder |
| US6176947B1 (en) * | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
| CN1503294A (en) * | 2002-11-26 | 2004-06-09 | ���Ű�˹̩�˹ɷ�����˾ | Alloy type thermal fuse and material for a thermal fuse element |
| CN101341266A (en) * | 2005-08-30 | 2009-01-07 | 美国铟泰公司 | Technique for increasing the compliance of tin-indium solders |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531586A (en) * | 2016-12-21 | 2017-03-22 | 国网上海市电力公司 | Grid type fuse wire sheet with inverse-time characteristic curve |
| CN109216128A (en) * | 2017-06-30 | 2019-01-15 | 厦门赛尔特电子有限公司 | A kind of high voltage direct current thermal cut-off |
| US11049683B2 (en) | 2017-06-30 | 2021-06-29 | Xiamen Set Electronics Co., Ltd | High-voltage direct-current thermal fuse |
| CN109894768A (en) * | 2019-03-29 | 2019-06-18 | 东莞市千岛金属锡品有限公司 | A kind of low temperature leadless alloy solder and preparation method thereof |
| CN115476069A (en) * | 2022-10-28 | 2022-12-16 | 云南锡业集团（控股）有限责任公司研发中心 | Five-membered or six-membered lead-free tin-based solder with low Ag, high thermal stability and high toughness |
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| Publication number | Publication date |
|---|---|
| CN103484720B (en) | 2016-01-06 |
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Denomination of invention: Fusible alloy and temperature fuse applying same Effective date of registration: 20191224 Granted publication date: 20160106 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN SET ELECTRONICS Co.,Ltd. Registration number: Y2019990000795 |
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Date of cancellation: 20231027 Granted publication date: 20160106 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN SET ELECTRONICS Co.,Ltd. Registration number: Y2019990000795 |