CN103484720A - Fusible alloy and temperature fuse applying same - Google Patents
Fusible alloy and temperature fuse applying same Download PDFInfo
- Publication number
- CN103484720A CN103484720A CN201310346749.7A CN201310346749A CN103484720A CN 103484720 A CN103484720 A CN 103484720A CN 201310346749 A CN201310346749 A CN 201310346749A CN 103484720 A CN103484720 A CN 103484720A
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- CN
- China
- Prior art keywords
- fusible alloy
- alloy
- fusible
- fusing point
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000743 fusible alloy Inorganic materials 0.000 title claims abstract description 44
- 229910045601 alloy Inorganic materials 0.000 claims description 23
- 239000000956 alloy Substances 0.000 claims description 23
- 230000008018 melting Effects 0.000 abstract description 10
- 238000002844 melting Methods 0.000 abstract description 10
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 6
- 230000004927 fusion Effects 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- 238000005491 wire drawing Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Fuses (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310346749.7A CN103484720B (en) | 2013-08-09 | 2013-08-09 | The Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310346749.7A CN103484720B (en) | 2013-08-09 | 2013-08-09 | The Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103484720A true CN103484720A (en) | 2014-01-01 |
CN103484720B CN103484720B (en) | 2016-01-06 |
Family
ID=49825308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310346749.7A Expired - Fee Related CN103484720B (en) | 2013-08-09 | 2013-08-09 | The Thermal Cutoffs of a kind of fusible alloy and this fusible alloy of utilization |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103484720B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106531586A (en) * | 2016-12-21 | 2017-03-22 | 国网上海市电力公司 | Grid type fuse wire sheet with inverse-time characteristic curve |
CN109216128A (en) * | 2017-06-30 | 2019-01-15 | 厦门赛尔特电子有限公司 | A kind of high voltage direct current thermal cut-off |
CN109894768A (en) * | 2019-03-29 | 2019-06-18 | 东莞市千岛金属锡品有限公司 | A kind of low temperature leadless alloy solder and preparation method thereof |
US11049683B2 (en) | 2017-06-30 | 2021-06-29 | Xiamen Set Electronics Co., Ltd | High-voltage direct-current thermal fuse |
CN115476069A (en) * | 2022-10-28 | 2022-12-16 | 云南锡业集团(控股)有限责任公司研发中心 | Five-membered or six-membered lead-free tin-based solder with low Ag, high thermal stability and high toughness |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
JP2000141078A (en) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | Leadless solder |
US6176947B1 (en) * | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
CN1503294A (en) * | 2002-11-26 | 2004-06-09 | ���Ű�˹̩�˹ɷ�����˾ | Alloy type thermal fuse and material for a thermal fuse element |
CN101341266A (en) * | 2005-08-30 | 2009-01-07 | 美国铟泰公司 | Technique for increasing the compliance of tin-indium solders |
-
2013
- 2013-08-09 CN CN201310346749.7A patent/CN103484720B/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
JP2000141078A (en) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | Leadless solder |
US6176947B1 (en) * | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
CN1503294A (en) * | 2002-11-26 | 2004-06-09 | ���Ű�˹̩�˹ɷ�����˾ | Alloy type thermal fuse and material for a thermal fuse element |
CN101341266A (en) * | 2005-08-30 | 2009-01-07 | 美国铟泰公司 | Technique for increasing the compliance of tin-indium solders |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106531586A (en) * | 2016-12-21 | 2017-03-22 | 国网上海市电力公司 | Grid type fuse wire sheet with inverse-time characteristic curve |
CN109216128A (en) * | 2017-06-30 | 2019-01-15 | 厦门赛尔特电子有限公司 | A kind of high voltage direct current thermal cut-off |
US11049683B2 (en) | 2017-06-30 | 2021-06-29 | Xiamen Set Electronics Co., Ltd | High-voltage direct-current thermal fuse |
CN109894768A (en) * | 2019-03-29 | 2019-06-18 | 东莞市千岛金属锡品有限公司 | A kind of low temperature leadless alloy solder and preparation method thereof |
CN115476069A (en) * | 2022-10-28 | 2022-12-16 | 云南锡业集团(控股)有限责任公司研发中心 | Five-membered or six-membered lead-free tin-based solder with low Ag, high thermal stability and high toughness |
Also Published As
Publication number | Publication date |
---|---|
CN103484720B (en) | 2016-01-06 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Fusible alloy and temperature fuse applying same Effective date of registration: 20191224 Granted publication date: 20160106 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN SET ELECTRONICS Co.,Ltd. Registration number: Y2019990000795 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231027 Granted publication date: 20160106 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN SET ELECTRONICS Co.,Ltd. Registration number: Y2019990000795 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160106 |