CN104339099B - A kind of containing the intermediate temperature solder of copper and alloy thereof - Google Patents
A kind of containing the intermediate temperature solder of copper and alloy thereof Download PDFInfo
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- CN104339099B CN104339099B CN201410501536.1A CN201410501536A CN104339099B CN 104339099 B CN104339099 B CN 104339099B CN 201410501536 A CN201410501536 A CN 201410501536A CN 104339099 B CN104339099 B CN 104339099B
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- solder
- copper
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- silver
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The present invention discloses a kind of containing the intermediate temperature solder of copper and alloy thereof, comprises each component formed as following weight percent: silver is 1-5wt%, and phosphorus is 5-8wt%, and tin is 1-6wt%, and silicon is 0.1-2.5wt%, and cerium is 0.01-0.1wt%, and surplus is copper. The present invention has the following advantages and effect: the melting temperature of solder reduces, good fluidity, solder has good perviousness simultaneously, can infiltrate in tiny gap and husky hole can not be produced, solder also has good ductility, using in the great environment of the temperature difference, weld seam also can not destroy, and the present invention is used in refrigeration industry in a large number simultaneously.
Description
Technical field
The present invention relates to brazing material field, it is specifically related to a kind of in a large number for the intermediate temperature solder containing copper and alloy thereof of refrigeration industry.
Background technology
Along with industry developments such as electronics and information industry, household electrical appliances, automobile and refrigeration, soldering tech is more and more important in these industries, and the demand of solder is increasing. Solder can be divided into ten multiclass such as money base, copper base, aluminium base, manganese base by alloy system, copper base solder occupies very big ratio in solder, the brazing process of the higher copper alloy parts of ask for something needs the copper-based material higher containing silver content, but silver is going up as precious metal price at present always, therefore enterprise needs when seeking interests to reduce silver content.
Also the copper base solder having some silver contents less at present, such as the BCu89PAg copper base solder containing silver 5%, the BCu91PAg copper base solder etc. containing silver 2%, although these copper base solder prices are lower, but temperature of fusion is higher, the physical strength of soldering processes performance and brazed joint does not all reach service requirements, cannot meet the requirement of client.
China Patent No. 201010588473.X discloses the patent that name is called " a kind of low silver electrovacuum solder for electron device soldering and sealing ", it with the addition of tin in the ag-cu solder of routine, plugs with molten metal and nickel, reduce silver content, and reduce fusing point, alternative BAg72Cu solder, but its tin, plug with molten metal with the addition of nickel higher.
China Patent No. 200610161439.8 discloses the patent that name is called " a kind of Cu-P-Ag solder containing transferring, plug with molten metal and adorn ", and it with the addition of in the silver-colored copper-phosphorus brazing alloy of routine and transfers, and plugs with molten metal and adorns, reduce silver content, and reduce fusing point, but it is transferred, pluging with molten metal and to adorn addition higher, the ratio of phosphorus is also higher.
In another aspect, solder can be divided into again solder and spelter according to its temperature of fusion. Solder liquidus line lower than 450 DEG C be called solder, liquidus line higher than 450 DEG C be called spelter, in some material connection procedures, adopt solder, but adopt solder soldering joint strength and use working temperature can not meet requirement; And adopt spelter soldering, required soldering strength can be reached, but due to physical structure and the physicochemical property temperature influence of spelter rather responsive so that the pull resistance of material, shear resistance weaken, soldering causes weldering split or produce pore, reduce soldering and sealing effect.
In sum, how to provide that a kind of melt temperature is suitable, copper base intermediate temperature solder that soldering strength height, soldering and sealing are effective, it is the technical barrier that those skilled in the art are badly in need of solving.
Summary of the invention
It is an object of the invention to provide a kind of containing the intermediate temperature solder of copper and alloy thereof, each composition proportion is suitable for, and solves the defect that above-mentioned prior art exists.
For achieving the above object, the present invention provides following technical scheme: a kind of containing the intermediate temperature solder of copper and alloy thereof, comprise each component formed as following weight percent: silver is 1-5wt%, phosphorus is 5-8wt%, tin is 1-6wt%, silicon is 0.1-2.5wt%, and cerium is 0.01-0.1wt%, and surplus is copper.
As preferably, the present invention comprises each component formed as following weight percent: silver is 1-4.5wt%, and phosphorus is 6-7.5wt%, and tin is 2-5wt%, and silicon is 1-2wt%, and cerium is 0.02-0.1wt%, and surplus is copper.
As preferably, the present invention comprises each component formed as following weight percent: silver is 3.9wt%, phosphorus 6.5wt%, and tin 2wt%, silicon 1.5wt%, cerium 0.08wt%, surplus is copper.
Prepare containing a method for copper and the intermediate temperature solder of alloy thereof, comprise the steps:
1) silver of group component, copper and copper-phosphorus alloy being put into plumbago crucible, heat up heating, adds insulating covering agent; Described insulating covering agent is any one or several mixing in plant ash, rice husk ash, charcoal;
2) to be heated to melting of metal formation solder liquid, stirring, after leaving standstill 10��20min, removes surface oxides, then adds the copper cerium alloy of group component, continues to heat, adds insulating covering agent after stirring evenly;
3) step 2 is left standstill) the solder liquid 10��20min of gained, continue to add the gunmetal of group component, heat fused limit, limit is stirred, and leaves standstill 10��20min after adding insulating covering agent;
4) finally add cupro silicon, add and stir, after leaving standstill 10��20min, remove surface oxides, stop heating;
5) step 4 is got) the solder liquid of gained, even cast long ingot, polishing, extruding, drawing is shaping.
The present invention changes the fusing point of solder by adding tin, according to alloying element to brazing filler metal melts characteristic, and the impact of brazed joint mechanical property, and the microtexture of brazed joint has been carried out observation and analysis, pass through differential thermal analysis, show the increase of Theil indices in the middle of solder alloy, the fusing point of solder can decrease, simultaneously owing to the superheating temperature of viscosity and liquid metal is inversely proportional to, when brazing temperature one timing, the temperature of fusion of metal reduces, then the superheating temperature of liquid metal increases, metal decrease in viscosity will be caused, mobility strengthens, thus tin exists from the spreading property improving solder on the other hand.
Chemical element silicon in the present invention serves the effect of inhibitor on the other hand when reducing fusing point, due in heat-processed, easily make phosphorus volatilization and cause the loss of phosphorus content, the point of ignition of phosphorus itself is lower simultaneously, in the process of preparation, the volatilization making the adding of silicon effectively to inhibit phosphorus in brazing process and splashing, it may also be useful to safer and improve service efficiency. Rare-earth element cerium refinement in the present invention weave construction of solder, accelerate the alloying of copper base solder, improve the condensate depression of solder, reduce solid liquid phase temperature range, cerium is enriched in crystal boundary place with rare earth phase form, play strengthening crystal boundary, the effect of the tissue of refinement solder, improve the processing characteristics of solder.
The present invention compared with the existing technology, has following useful effect: 1, containing less silver, has greatly saved raw materials cost; 2, when this solder uses, having excellent wettability and spreadability, soldering and sealing is effective; 3, this solder melt temperature is suitable, soldering strength height; 4, the plasticity-of this solder is good, can process in all size, the welding rod of size, welding wire, weld-ring, weld tabs etc.; Highly versatile, can the resistance welding pricker of the industry such as widespread use and refrigeration, machinery, electromechanics, flame welding pricker and high-frequency induction weldering pricker.
Embodiment
Technical solution of the present invention is not limited to following cited embodiment, also comprises the arbitrary combination between each embodiment.
Concrete parameter in each embodiment is see table 1-table 4, table 1 is the relevant data of the embodiment of the present invention 1 to embodiment 6, table 2 is the relevant data of the embodiment of the present invention 7 paper embodiment 12, table 3 is the relevant data of the embodiment of the present invention 13 paper embodiment 18, and table 4 is the relevant data of the embodiment of the present invention 19 paper embodiment 24.
Table 1 is the relevant data of the embodiment of the present invention 1 to embodiment 6.
Table 2 is the relevant data of the embodiment of the present invention 7 to embodiment 12.
Table 3 is the relevant data of the embodiment of the present invention 13 to embodiment 18.
Table 4 is the relevant data of the embodiment of the present invention 19 to embodiment 24.
The present embodiment 1��24 shows: 1. silver content is less, reduces production cost, and solder fusing point is lower than the solder identical relative to other silver content simultaneously; 2. spreadability reaches A level, exceedes general industry standard, and solder result of use is good, and 3. the tensile strength of the tensile strength height solder of solder can reach 532-555MPa; The tensile strength of its weld seam can reach 218-259MPa, and shearing can reach 131-149MPa, has higher mechanical property; 4. the plasticity-of this solder is good, can process in all size, the welding rod of size, welding wire, weld-ring, weld tabs etc.; There is stronger versatility simultaneously, it is applicable to different Working environments.
According to the known silicone content of table 1 the closer to 1wt%, it it is the enhancing all to a certain extent of solder tensile strength or the intensity of weld seam;
During according to the known silicone content of table 2 between 1��1.5wt%, good relative to the solder intensity effect made by table 1;
During according to the known silicone content of table 3 and table 4 between 1.55��2.5wt%, intensity effect is less than relative to silicone content when 1.5wt%.
Therefore the technical program silicone content is when 1.5wt%, and the weld seam tensile strength that the tensile strength of solder and solder produce after using and slip resistance are best.
The solder manufacture craft of the present invention, comprises the steps:
1) silver of group component, copper and copper-phosphorus alloy being put into plumbago crucible, heat up heating, adds insulating covering agent; Described insulating covering agent is any one or several mixing in plant ash, rice husk ash, charcoal;
2) to be heated to melting of metal formation solder liquid, stirring, after leaving standstill 10��20min, removes surface oxides, then adds the copper cerium alloy of group component, continues to heat, adds insulating covering agent after stirring evenly;
3) step 2 is left standstill) the solder liquid 10��20min of gained, continue to add the gunmetal of group component, heat fused limit, limit is stirred, and leaves standstill 10��20min after adding insulating covering agent;
4) finally add cupro silicon, add and stir, after leaving standstill 10��20min, remove surface oxides, stop heating;
5) step 4 is got) the solder liquid of gained, even cast long ingot, polishing, extruding, drawing is shaping.
Inventive formulation is reasonable in design, temperature of fusion reduces, good fluidity, solder has good perviousness simultaneously, it is possible to infiltrating in tiny gap and can not produce husky hole, solder also has good spreadability, use in the great environment of the temperature difference simultaneously, weld seam also can not destroy, steady quality, can replace the wlding material such as use range is wide, consumption is big BAg40CuZnCd, BAg45CuZn.
Further, it is desirable that illustrate, the specific embodiment described in this specification sheets, its formula, technique are named title etc. can difference. All equivalences of doing according to the structure described in inventional idea of the present invention, feature and principle or simple change, be included in the protection domain of patent of the present invention. Described specific embodiment can be made various amendment or supplements or adopt similar mode to substitute by those skilled in the art; as long as not deviateing the structure of the present invention or surmounting this scope as defined in the claims, protection scope of the present invention all should be belonged to.
Claims (1)
1. prepare containing the method for copper and the intermediate temperature solder of alloy thereof for one kind, it is characterized in that: each component of the weight percent composition of this intermediate temperature solder: silver is 1-5wt%, phosphorus is 5-8wt%, tin is 1-6wt%, silicon is 0.1-2.5wt%, cerium is 0.01-0.1wt%, and surplus is copper, and the method comprises the steps:
1) silver of group component, copper and copper-phosphorus alloy being put into plumbago crucible, heat up heating, adds insulating covering agent; Described insulating covering agent is any one or several mixing in plant ash, rice husk ash, charcoal;
2) to be heated to melting of metal formation solder liquid, stirring, after leaving standstill 10��20min, removes surface oxides, then adds the copper cerium alloy of group component, continues to heat, adds insulating covering agent after stirring evenly;
3) step 2 is left standstill) the solder liquid 10��20min of gained, continue to add the gunmetal of group component, heat fused limit, limit is stirred, and leaves standstill 10��20min after adding insulating covering agent;
4) finally add cupro silicon, add and stir, after leaving standstill 10��20min, remove surface oxides, stop heating;
5) step 4 is got) the solder liquid of gained, even cast long ingot, polishing, extruding, drawing is shaping.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410501536.1A CN104339099B (en) | 2014-09-27 | 2014-09-27 | A kind of containing the intermediate temperature solder of copper and alloy thereof |
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| CN201410501536.1A CN104339099B (en) | 2014-09-27 | 2014-09-27 | A kind of containing the intermediate temperature solder of copper and alloy thereof |
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| CN104339099A CN104339099A (en) | 2015-02-11 |
| CN104339099B true CN104339099B (en) | 2016-06-01 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106181123A (en) * | 2016-08-19 | 2016-12-07 | 佛山晓世科技服务有限公司 | A kind of low silver middle temperature brazing material |
| CN108381058A (en) * | 2018-02-27 | 2018-08-10 | 江苏远方动力科技有限公司 | One kind high-performance solder of low-silver copper-base containing Ga and preparation method thereof |
| CN108465974A (en) * | 2018-02-27 | 2018-08-31 | 江苏远方动力科技有限公司 | A kind of low-silver copper-base high-performance solder and preparation method thereof |
| CN108381060A (en) * | 2018-05-16 | 2018-08-10 | 中原工学院 | Copper phosphorus base solder and its application |
| CN113843546A (en) * | 2021-09-23 | 2021-12-28 | 金华市金钟焊接材料有限公司 | CuPSnAg Ni-Re ultra-silver solder, preparation method and application |
Citations (5)
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|---|---|---|---|---|
| JPS63313695A (en) * | 1987-06-12 | 1988-12-21 | Tanaka Kikinzoku Kogyo Kk | Silver alloy filler metal for brazing |
| EP0465861A1 (en) * | 1990-07-04 | 1992-01-15 | Degussa Aktiengesellschaft | Brazing alloy |
| CN101786208A (en) * | 2010-03-25 | 2010-07-28 | 杭州华光焊料有限公司 | Novel active copper-phosphorus brazing alloy |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
| CN103358048A (en) * | 2013-07-25 | 2013-10-23 | 杭州华光焊接新材料股份有限公司 | Silver, copper and phosphorus system vacuum brazing filler |
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2014
- 2014-09-27 CN CN201410501536.1A patent/CN104339099B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313695A (en) * | 1987-06-12 | 1988-12-21 | Tanaka Kikinzoku Kogyo Kk | Silver alloy filler metal for brazing |
| EP0465861A1 (en) * | 1990-07-04 | 1992-01-15 | Degussa Aktiengesellschaft | Brazing alloy |
| CN101786208A (en) * | 2010-03-25 | 2010-07-28 | 杭州华光焊料有限公司 | Novel active copper-phosphorus brazing alloy |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
| CN103358048A (en) * | 2013-07-25 | 2013-10-23 | 杭州华光焊接新材料股份有限公司 | Silver, copper and phosphorus system vacuum brazing filler |
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Effective date of registration: 20200629 Address after: 430000 705, 706a, building 1, Huigu spacetime, No.206, laowuhuang highway, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: Wuhan Tuozhijia Information Technology Co.,Ltd. Address before: Hemudu Site in Yuyao City, Zhejiang Province town Luojiang village 315000 Jiang Ningbo home Patentee before: NINGBO YINMA WELDING TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20201103 Address after: Jiangdong Road, Shuichang Road, Gulou District, Nanjing City, Jiangsu Province, 210000 Patentee after: Li Wenkang Address before: 430000 705, 706a, building 1, Huigu spacetime, No.206, laowuhuang highway, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee before: Wuhan Tuozhijia Information Technology Co.,Ltd. |